The advanced technology support program (atsp) contract acquires progressive microelectronic capability solutions for rectenna enabling charging technology.
Ended Awarded Last action
- Contract number
- HQ072724F1609
- Awardee
-
Raytheon Company UEI QF4VA87ST9F7 Part of RTX Corporation
- Awarding agency
-
Defense Microelectronics Activity
Department of Defense
- Obligated
- $1,422,887
Award facts
- Opportunity
-
- HQ072715R0001 Solicitation number
- Contract value 100% obligated
- $1,422,887.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Funding agency
- Office of the Secretary of Defense Department of Defense
- NAICS code
- 541330 Engineering Services
- Set-aside
- No set-aside
- Competition
- Full and Open Competition · 1 offer Multiple Award, Fair Opportunity
- Pricing
- Cost Plus Fixed Fee
- Place of performance
- El Segundo, CA, USA
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Supplemental Agreement for work within scope | $0 | |
| Funding Only Action | $250,000 | |
| Original award | $1,172,887 |
About this award
The Office of the Secretary of Defense issued a $1.42 million delivery order to Raytheon Company on June 13, 2024, under the Advanced Technology Support Program IV (ATSP IV) for progressive microelectronic capability solutions for rectenna enabling charging technology.
ATSP IV is a $25.357 billion multiple-award indefinite delivery contract through December 29, 2035, administered by the Defense Microelectronics Activity for microelectronics capability development and integration across the Department of Defense. Place of performance is El Segundo, California, with an ultimate completion date of August 31, 2026.
The order is priced on a cost-plus-fixed-fee basis and carries no set-aside designation. Raytheon engaged Leidos, Inc. (Leidos Solutions Operating Segment) and Teledyne Scientific & Imaging, LLC as subcontractors for testing, non-recurring engineering, materials alternatives, and wafer fabrication support.
Subawards
| Subcontractor | Amount | Awarded |
|---|---|---|
| Leidos, Inc. | $171,671 | |
| Teledyne Scientific & Imaging, LLC | $434,209 |
Quick answers
Who was awarded contract HQ072724F1609?
HQ072724F1609 was awarded to Raytheon Company by Defense Microelectronics Activity (Department of Defense) on June 13, 2024.
How much is contract HQ072724F1609 worth?
The government has obligated $1,422,887 on HQ072724F1609.
Which agency awarded contract HQ072724F1609?
Defense Microelectronics Activity (Department of Defense) awarded HQ072724F1609, with funding from Office of the Secretary of Defense (Department of Defense).
Is contract HQ072724F1609 an order under another contract?
Yes. HQ072724F1609 is a delivery order under HQ072716D0006, an indefinite delivery contract, on Advanced Technology Support Program IV (ATSP4).
Was contract HQ072724F1609 competed?
The extent of competition for HQ072724F1609 was full and open competition. The government received 1 offer.
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