Engineering services - design, develop, prototype and test advanced microelectronic and software solutions to improve performance, and components of the microelectronics-based GAN nanoshotkey puck…
Ended Awarded Last action
- Contract number
- HQ072720F1625
- Awardee
-
Raytheon Company UEI QF4VA87ST9F7 Part of RTX Corporation
- Awarding agency
-
Defense Microelectronics Activity
Department of Defense
- Obligated
- $1,199,922
Award facts
- Opportunity
-
- HQ072715R0001 Solicitation number
- Advanced Technology Support Program IV (ATSP4) Full and Open Competition Award Notice · Posted Mar 31, 2016
- Advanced Technology Support Program IV (ATSP4) Full & Open Award Notice · Posted Feb 17, 2015
- Advanced Technology Support Program IV (ATSP4) - Full & Open Award Notice · Posted Jan 29, 2015
- Contract value 100% obligated
- $1,199,922.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Funding agency
- Office of the Secretary of Defense Department of Defense
- NAICS code
- 541330 Engineering Services
- Set-aside
- No set-aside
- Competition
- Full and Open Competition · 1 offer Multiple Award, Fair Opportunity
- Pricing
- Cost Plus Fixed Fee
- Place of performance
- El Segundo, CA, USA
- Legislative mandates
-
- Economy Act FAR subpart 17.5
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Supplemental Agreement for work within scope | $0 | |
| Supplemental Agreement for work within scope | $0 | |
| Original award | $1,199,922 |
About this award
The Office of the Secretary of Defense awarded Raytheon Company a $1.2 million delivery order against the Advanced Technology Support Program IV indefinite-delivery/indefinite-quantity contract vehicle. Raytheon will provide engineering services to design, develop, prototype, and test advanced microelectronic and software solutions to improve performance of the microelectronics-based GaN Nanoshotkey puck retenna module. Major subcontractors include OSI Electronics to assist with substrate engineering and thin-film builds, and West Bond to supply machinery, equipment, and bonding services. The work will take place in El Segundo, California from August 2020 through January 2023. This cost-plus-fixed-fee contract aims to support the Defense Department's efforts to research advanced technologies.
Description
Engineering services - design, develop, prototype and test advanced microelectronic and software solutions to improve performance, and components of the microelectronics-based GAN nanoshotkey puck retenna module
Quick answers
Who was awarded contract HQ072720F1625?
HQ072720F1625 was awarded to Raytheon Company by Defense Microelectronics Activity (Department of Defense) on August 27, 2020.
How much is contract HQ072720F1625 worth?
The government has obligated $1,199,922 on HQ072720F1625.
Which agency awarded contract HQ072720F1625?
Defense Microelectronics Activity (Department of Defense) awarded HQ072720F1625, with funding from Office of the Secretary of Defense (Department of Defense).
Is contract HQ072720F1625 an order under another contract?
Yes. HQ072720F1625 is a delivery order under HQ072716D0006, an indefinite delivery contract, on Advanced Technology Support Program IV (ATSP4).
Was contract HQ072720F1625 competed?
The extent of competition for HQ072720F1625 was full and open competition. The government received 1 offer.
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