Sealing compound: a low-density, high temperatur E resistant, two-component epoxy paste system FO R use as a core filler for metal skins and addin G stiffness and strength to fabricated parts. SZ :…

Ended Awarded

Contract number
GSNWA68291
Awardee
Awarding agency
Obligated
$11,306

Award facts

Contract value 100% obligated
$11,306.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
NAICS code
325520 Adhesive Manufacturing
PSC
8030 Preservative And Sealing Compounds
Set-aside
No set-aside
Competition
Full and Open Competition · 2 offers
Pricing
Fixed Price with Economic Price Adjustment
Place of performance
California, USA

Award details come from SAM.gov/FPDS.

Description

Sealing compound: a low-density, high temperatur E resistant, two-component epoxy paste system FO R use as a core filler for metal skins and addin G stiffness and strength to fabricated parts. SZ : a 1 GA kit consisting of base compound and the required amount of curing agent packaged in SEP arate containers. Shelf life code: 2 (6 MO) max age on DEL: 1 month vantico INC. PN epocast 1652 a/B. (partial description)

Quick answers

Who was awarded contract GSNWA68291?

GSNWA68291 was awarded to Packaging Systems, Inc. by Federal Acquisition Service (General Services Administration) on November 17, 2004.

How much is contract GSNWA68291 worth?

The government has obligated $11,306 on GSNWA68291.

Is contract GSNWA68291 an order under another contract?

Yes. GSNWA68291 is a delivery order under GS06FL0007, an indefinite delivery contract.

Was contract GSNWA68291 competed?

The extent of competition for GSNWA68291 was full and open competition. The government received 2 offers.

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