Atomic fusion wafer bonding tool for ultra-high-power switches
Ended Definitive Contract Awarded Last action
- Contract number
- W911NF24C0041
- Awardee
-
Partow Technologies LLC UEI PDT5WE8U2624
- Awarding agency
-
ACC Aberdeen Proving Ground
Army Contracting Command, Department of Defense
- Obligated
- $1,699,828
Award facts
- Contract value 100% obligated
- $1,699,827.68 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Contracting staff
- Funding agency
- Office of the Secretary of Defense Department of Defense
- NAICS code
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- PSC
- AJ11 General Science And Technology R&D Services; General Science And Technology; Basic Research
- Set-aside
- Total Small Business
- Competition
- Full and Open Competition after exclusion of sources · 4 offers Negotiated Proposal / Quote
- Pricing
- Firm Fixed Price
- Place of performance
- Vista, CA 92081, USA
- Legislative mandates
-
- Employment Eligibility Verification (E-Verify) FAR subpart 22.18
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Other Administrative Action | $0 | |
| Other Administrative Action | $0 | |
| Exercise an Option | $815,507 | |
| Other Administrative Action | $0 | |
| Original award | $884,320 |
About this award
Partow Technologies LLC, a small business based in Carlsbad, California, was awarded a $1.7 million firm fixed-price definitive contract by the Office of the Secretary of Defense on March 1, 2024, to develop an Atomic Fusion Wafer Bonding Tool for Ultra-High-Power Switches. This Phase II Small Business Technology Transfer (STTR) program contract, set aside for total small business participation, represents the continuation of the company's research effort following a Phase I award valued at $249,492. The work will be performed in Vista, California, with an ultimate completion date of May 31, 2026.
The contract supports the advancement of specialized wafer bonding technology critical for next-generation ultra-high-power electronic switch applications. Partow Technologies' selection reflects its demonstrated expertise in advanced sensor and wafer bonding technologies developed through previous federal research partnerships. The STTR program structure, which emphasizes collaboration between small businesses and research institutions, aligns with the Department of Defense's investment strategy in innovative, domestically-based technological solutions for defense applications.
Quick answers
Who was awarded contract W911NF24C0041?
W911NF24C0041 was awarded to Partow Technologies LLC by ACC Aberdeen Proving Ground (Army Contracting Command) on March 1, 2024.
How much is contract W911NF24C0041 worth?
The government has obligated $1,699,828 on W911NF24C0041.
Which agency awarded contract W911NF24C0041?
ACC Aberdeen Proving Ground (Army Contracting Command) awarded W911NF24C0041, with funding from Office of the Secretary of Defense (Department of Defense).
Was contract W911NF24C0041 competed?
The extent of competition for W911NF24C0041 was full and open competition after exclusion of sources. The government received 4 offers. It was set aside: Total Small Business.
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