Optomechanical thermal imaging (optim) technical area 2 (TA2) proposal entitled: scalable optomechanical thermal imager with adaptable spectral sensing

Ended Definitive Contract Awarded Last action

Contract number
HR001124C0473
Awardee
Awarding agency
Obligated
$2,705,282

Award facts

Opportunity
Contract value 100% obligated
$2,705,282.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Contracting staff
Set-aside
No set-aside
Competition
Full and Open Competition · 4 offers Basic Research
Pricing
Cost Plus Fixed Fee
Place of performance
Malibu, CA, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Other Administrative Action P00004 · Optomechanical thermal imaging (optim) $0
Funding Only Action P00003 $886,046
Funding Only Action P00002 · Optim TA2 - base $909,618
Other Administrative Action P00001 $0
Original award $909,618

About this award

The Defense Advanced Research Projects Agency (DARPA) awarded HRL Laboratories, LLC a $2.7 million cost-plus-fixed-fee definitive contract on July 1, 2024, for the Optomechanical Thermal Imaging (OPTIM) Technical Area 2 program. The contract, which extends through March 15, 2026, supports development of a scalable optomechanical thermal imager with adaptable spectral sensing capabilities. HRL Laboratories, a Malibu, California-based research and development laboratory jointly owned by Boeing and General Motors, will perform the work at its primary facility. This contract was awarded without a set-aside designation and represents DARPA's continued investment in HRL's advanced sensing and infrared technology capabilities, which have been central to the company's defense research portfolio.

HRL Laboratories has engaged Semiconductor Components Industries, LLC as a key subcontractor to supply critical components and manufacturing services supporting the thermal imaging development. Semiconductor Components Industries was awarded subcontracts in August 2024 and October 2024 to deliver prototype wafer lots, mechanical samples, reticle tooling, and related semiconductor manufacturing services essential to the optomechanical sensor development. These subcontracts demonstrate the integration of specialized semiconductor fabrication capabilities into HRL's advanced sensor development program, enabling the production and validation of prototype thermal imaging components required to meet DARPA's technical objectives.

Subawards

Subcontractor Amount Awarded
Semiconductor Components Industries, LLC OPTIM TA2 - BASE Reticle Tooling and Prototype Lot Wafer $183,960
Semiconductor Components Industries, LLC OPTOMECHANICAL THERMAL IMAGING (OPTIM) TECHNICAL AREA 2 (TA2) PROPOSAL ENTITLED: SCALABLE OPTOMECHANICAL THERMAL IMAGER WITH ADAPTABLE SPECTRAL SENSING… $46,680

Quick answers

Who was awarded contract HR001124C0473?

HR001124C0473 was awarded to HRL Laboratories, LLC by Defense Advanced Research Projects Agency (Department of Defense) on July 1, 2024.

How much is contract HR001124C0473 worth?

The government has obligated $2,705,282 on HR001124C0473.

Was contract HR001124C0473 competed?

The extent of competition for HR001124C0473 was full and open competition. The government received 4 offers.

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