This definitive cost-plus-fixed-fee contract valued at $138.36 million was awarded by the Defense Advanced Research Projects Agency to Raytheon Company for the Blackjack Phase 2 and 3 program. Raytheon will serve as the prime contractor and is responsible for the design, engineering development, fabrication, test, and delivery of an Overhead Persistent Infrared payload. Major subcontractors include Casetech, Smiths Interconnect Americas, Wallender & Associates, National Instruments, Cicon Engineering, Airborn Interconnect, Microsemi, Integra Technologies, Dynamic Fabrication, Superior Jig, GSI Technology, Scicon Technologies, Port Electronics, Frontgrade Colorado Springs, Newbridge Partners, Alva Manufacturing, Richardson Rfpd, GC Micro, Advanced Cooling Technologies, Trio Manufacturing, Pioneer Circuits, Second Order Effects, and others. The work will be performed in El Segundo, California through April 2024. No set aside designation was specified. This contract provides continued development of a space-based infrared system under DARPA's Blackjack program.
Generated 12/29/23, 5:06 PM