This contract award to HRL Laboratories, LLC, a corporate R&D lab owned by Boeing and General Motors, is funded by the Defense Advanced Research Projects Agency (DARPA) and aims to advance microwave integrated circuit manufacturing capabilities. The $18,789,575 cost-plus-fixed-fee contract covers the development of metal-embedded chip assembly (MECAMIC), a foundational platform for rapid, low-cost RF IC fabrication, as well as a transition acceleration study with business plan and roadmap development. DARPA issued this award without any set-aside designation. HRL has engaged Boeing as a subcontractor to support market analysis and business case development for the T3 and T4A gallium nitride (GaN) MMIC technologies being advanced under the contract. Other subcontractors include Modelithics for device modeling, Murray Plumbing & Heating for system installation, and SPTS Technologies for etch equipment. This effort aims to bridge the gap from prototyping to production validation, including cycle time reduction and yield improvements.
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