Fan out wafer level packaging

Ended Definitive Contract Awarded Last action

Contract number
FA865020C1130
Awardee
Awarding agency
Obligated
$2,220,000

Award facts

Contract value 57% obligated
$3,861,534.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Set-aside
No set-aside
Competition
Full and Open Competition · 1 offer Negotiated Proposal / Quote
Pricing
Cost Plus Fixed Fee
Place of performance
St. Petersburg, FL 33716, USA

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Additional Work (new agreement, FAR part 6 applies) P00002 · Fine pitch fabrication and packaging capabilities for fan out wafer level packaging (FO-WLP) $600,000
Funding Only Action P00001 · Fine pitch fabrication and packaging capabilities for fan out water level packaging $100,000
Original award $1,520,000

About this award

The Department of the Air Force Materiel Command Research Laboratory awarded I3 Microsystems, Inc., doing business as I3 Microsystems Inc., a $3.86 million definitive contract to provide fan out wafer level packaging. As the prime contractor, I3 Microsystems Inc. will perform this work from August 12, 2022 through July 31, 2023 using a cost plus fixed fee pricing structure. I3 Microsystems Inc. is a subsidiary of I3 Electronics, Inc. No subcontractors were identified.

Quick answers

Who was awarded contract FA865020C1130?

FA865020C1130 was awarded to I3 Microsystems, Inc. by Air Force Research Laboratory (Air Force Materiel Command) on August 12, 2022.

How much is contract FA865020C1130 worth?

The government has obligated $2,220,000 on FA865020C1130. Its current value, with exercised options, is $3,861,534.

Was contract FA865020C1130 competed?

The extent of competition for FA865020C1130 was full and open competition. The government received 1 offer.

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