PlasmaPro 100 Fluorine Etcher

The Department of Energy is seeking to procure a PlasmaPro 100 Cobra 300 Fluorine Etcher, specifically an Inductively Coupled Plasma (ICP) Deep Reactive Ion Etcher (DRIE) for silicon etching applications. The solicitation requires a sophisticated scientific instrument capable of multiple etching processes including room temperature, cryogenic, and heated silicon etching. The technical specifications demand a comprehensive system with specific components such as a 3kW ICP etch source, 600W plasma bias RF source, and a cryogenically cooled substrate electrode. While detailed evaluation criteria are not explicitly stated in the notice, the technical specification document suggests that vendors will be assessed on their ability to meet precise engineering requirements, including automated loadlock capabilities, specific pump interfaces, and integrated endpoint detection systems. The solicitation was posted on November 26, 2024, with proposals due by December 4, 2024, providing potential contractors approximately one week to prepare and submit their responses.

The contract is not designated with any specific set-aside status, indicating it is open to all qualified contractors. The place of performance will be located in Oak Ridge, Tennessee, with the procurement falling under NAICS category 334513 for Instruments and Related Products Manufacturing. The solicitation covers a single instrument system for a 100mm wafer configuration, with a required minimum 3-year warranty. While the exact award value is not specified, the technical complexity and specialized nature of the PlasmaPro 100 Fluorine Etcher suggest a high-value procurement typical of advanced scientific research equipment. The system must meet rigorous certification standards, including factory and field NRTL (Nationally Recognized Testing Laboratory) certifications, which will likely influence vendor selection and proposal evaluation.