Project Grant 2511158
Award Date 9/1/25
Completion Date 8/31/28
Dollars Obligated $3.5M
Funding Federal Agency
Awarding Federal Agency
Federal Grant Program
Assistance Type
Project Grant
Place of Performance
Baltimore, MD 21218, USA
Similar Awards
- This $350,000 Project Grant awarded by the National Science Foundation's (CFDA 47.041) Engineering program will fund research to develop a new, solvent-free process for creating metal-based photoresists used in semiconductor manufacturing. The project aims to advance extreme ultraviolet (EUV) lithography, a critical technology for producing smaller, more powerful computer chips. Awarded to The Johns Hopkins University, the research will explore environmentally-friendly methods to fabricate these...
- This Project Grant award from the National Science Foundation (NSF) under the Mathematical and Physical Sciences program (CFDA 47.049) provides $300,000 in funding to the University of Washington to advance the field of semiconductor manufacturing through the development of new photoresist materials for extreme ultraviolet (EUV) photolithography. The two-year project aims to uncover the mechanisms behind the crosslinking and chemical etching of ultrathin photoresist films grown using molecular...
- The National Science Foundation (NSF) awarded a $50,000 Project Grant under the Engineering program (CFDA 47.041) to The Trustees of Princeton University. The grant, titled "ECLIPSE-CHIPS: HIGH-FLUENCE COHERENT EUV LIGHT FROM ULTRAINTENSE LASER-PLASMA INTERACTIONS FOR ADVANCED NANOLITHOGRAPHY AND METROLOGY," will be used to explore advanced methods of generating extreme ultraviolet (EUV) light. This research aims to develop brighter and more coherent EUV beams, which can enable the...
- This Project Grant award from the National Science Foundation's (NSF) Mathematical and Physical Sciences program (CFDA 47.049) provides $412,542 to the University of Wisconsin-Madison to conduct collaborative research on developing new photoresist materials for high-volume extreme ultraviolet (EUV) lithography in integrated circuit manufacturing. The research will integrate expertise in polymer chemistry, materials characterization, computational modeling, and AI-driven materials design to...
- This $260,000 Project Grant awarded by the National Science Foundation (NSF) under the Mathematical and Physical Sciences (CFDA 47.049) program supports a collaborative effort by researchers at the University of Texas at Dallas, Johns Hopkins University, and the University of Texas at Austin to develop new materials for advanced computer chips. The key objectives are to: (1) design novel indium-based extreme ultraviolet (EUV) resists using computational and machine learning tools; (2) synthesize...
- This Project Grant award, titled "ECLIPSE-CHIPS: Plasma-Produced Materials to Investigate Laser-Produced Plasmas for Microelectronics Manufacturing", is provided by the National Science Foundation (NSF) Engineering program (CFDA 47.041). The $532,000 grant, awarded on September 1, 2025, supports research to develop a new approach for generating extreme ultraviolet (EUV) radiation, which is critical for advancing photolithography techniques used in microelectronics manufacturing. The...
- Under a $425,448 Project Grant from the National Science Foundation (NSF) Division of Chemistry, the University of Florida is conducting collaborative research on electron-induced reactivity of organometallic precursors for focused electron beam-induced deposition (FEBID) and extreme ultraviolet (EUV) lithography resists. This 3-year research effort, in partnership with Johns Hopkins University, aims to develop a holistic understanding of electron interactions with organometallic complexes to...
- This Project Grant awarded by the National Science Foundation (NSF) Division of Chemistry, under the Mathematical and Physical Sciences (CFDA 47.049) Federal Grant Program, will fund a collaborative research effort between the University of Florida and Johns Hopkins University to explore the underlying chemical reactions involved in two technologically important processes: focused electron beam-induced deposition (FEBID) and extreme ultraviolet lithography (EUVL). The $354,551 award will support...
- The National Science Foundation Division of Industrial Innovation awarded $250,000 under the Engineering (47.041) federal grant program to Colorado State University to enhance the mass production of advanced integrated circuits. The project aims to develop new technology to improve the efficiency of extreme ultraviolet lithography machines used in the semiconductor manufacturing process. Extreme ultraviolet lithography entered high-volume manufacturing in 2019 and relies on laser heating of...
- The National Science Foundation (NSF) Office of Integrative Activities awarded a $390,390 Project Grant to the University of Dayton Research Institute Division. The grant, funded under the CFDA 47.083 Integrative Activities program, will enable the acquisition of a laser direct-write photolithography system. This advanced lithographic capability will accelerate research and development of semiconductor electronics, photonics, and biotechnology devices by eliminating the need for photomasks....