This federal Project Grant award of $300,000, funded by the National Science Foundation (NSF) under the Mathematical and Physical Sciences (CFDA 47.049) program, aims to advance the field of semiconductor manufacturing by addressing a critical challenge in extreme ultraviolet (EUV) photolithography. The two-year project, awarded to the University of Washington, will focus on the development of new EUV photoresist materials and the study of the chemical reactions and crosslinking behavior of ultrathin photoresist films grown using molecular layer deposition (MLD) techniques. Through a combined experimental and computational modeling approach, the project seeks to uncover the structure-property relationships of these organic-inorganic photoresist films, which will support the broader adoption of EUV photolithography and enable the production of smaller, faster, and more efficient electronic devices. Additionally, the project includes educational initiatives to inspire and prepare students for careers in the semiconductor industry, aligning with the goals of the US CHIPS Act.
Mod # | Description | Reason For Modification | Federal Obligation (Click to sort descending) | Date (Click to sort ascending) |
|---|---|---|---|---|
| Not listed | $300.0k | 5/29/25 |