Under a $425,448 Project Grant from the National Science Foundation (NSF) Division of Chemistry, the University of Florida is conducting collaborative research on electron-induced reactivity of organometallic precursors for focused electron beam-induced deposition (FEBID) and extreme ultraviolet (EUV) lithography resists. This 3-year research effort, in partnership with Johns Hopkins University, aims to develop a holistic understanding of electron interactions with organometallic complexes to...
This Project Grant awarded by the National Science Foundation (NSF) Division of Chemistry, under the Mathematical and Physical Sciences (CFDA 47.049) Federal Grant Program, will fund a collaborative research effort between the University of Florida and Johns Hopkins University to explore the underlying chemical reactions involved in two technologically important processes: focused electron beam-induced deposition (FEBID) and extreme ultraviolet lithography (EUVL). The $354,551 award will support...
This $260,000 federal Project Grant award from the National Science Foundation's (NSF) Mathematical and Physical Sciences program, with a start date of October 1, 2024, supports a collaborative research effort to co-design novel indium-based materials for advanced computer chip manufacturing. Led by researchers at the University of Texas at Dallas, the project aims to develop indium-based extreme ultraviolet (EUV) resist materials and indium oxide transistors to enable smaller, more...
This National Science Foundation (NSF) Mathematical and Physical Sciences Federal Grant Award, with the CFDA number 47.049, provides $548,000 in funding to Louisiana State University (LSU) to design, synthesize, and investigate new polymeric materials and processes for high-resolution patterning in semiconductor manufacturing. The project aims to develop new classes of extreme ultraviolet (EUV)-sensitive polymers and investigate their fundamental interactions with photons and electrons to enable...
This $466,735 Project Grant award from the National Science Foundation (NSF) Engineering program (CFDA 47.041) supports fundamental research to develop an electron beam-activated atomic layer etching (EB-ALE) process for advanced materials manufacturing. The primary objectives are to obtain the required knowledge on the surface chemical and physical aspects of the EB-ALE mechanism, and to enable layer-by-layer etching for critical applications involving complex multi-element materials that are...
This $371,847 federal Project Grant award from the National Science Foundation's (NSF) Mathematical and Physical Sciences (CFDA 47.049) program supports collaborative research at The Johns Hopkins University focused on using two-dimensional metal halide perovskite (2D MHP) thin films as a crystallization templating tool for organic semiconductor (OSC) thin films. The research aims to reduce disorder in OSC crystal packing and control packing geometries to tune optoelectronic behaviors, including...
The National Science Foundation Division of Industrial Innovation awarded $250,000 under the Engineering (47.041) federal grant program to Colorado State University to enhance the mass production of advanced integrated circuits. The project aims to develop new technology to improve the efficiency of extreme ultraviolet lithography machines used in the semiconductor manufacturing process. Extreme ultraviolet lithography entered high-volume manufacturing in 2019 and relies on laser heating of...
The National Science Foundation awarded a $355,714 Project Grant to the University of Rochester under the Engineering (47.041) federal grant program. The grant supports research to develop an innovative, scalable nanomanufacturing platform for area-selective atomic layer deposition of components for ultra-efficient optoelectronic devices. The goal is to pioneer a continuous, energy-efficient manufacturing approach that enables novel three-dimensional chip designs not reliant on unsustainable...
This $600,000 Project Grant award from the National Science Foundation's (NSF) Engineering program (CFDA 47.041) aims to support research that develops a novel approach to metamaterials engineering and manufacturing for emerging optoelectronics. The project at the University of Michigan will utilize a combination of advanced manufacturing tools and focused-ion-beam-assisted molecular-beam epitaxy to pattern and integrate high-purity non-precious metals with high-quality semiconductors. The...
The National Science Foundation (NSF) awarded a three-year, $460,443 Project Grant under the Engineering program (CFDA 47.041) to Michigan Technological University. The "REU Site: INSPIRES: Integrated Circuits and Semiconductor Processes to Promote Responsible Engineering and Sustainability" project focuses on integrated circuits and semiconductor processes, emphasizing responsible engineering and sustainability. Eight students per year will conduct research on semiconductor processing...
This Project Grant award from the National Science Foundation's (NSF) Division of Materials Research (DMR) provides $150,000 to The Johns Hopkins University to develop an eco-friendly, solvent-free process for manufacturing metal-based extreme ultraviolet (EUV) photoresists used in semiconductor chip production. The 2-year award, which runs from May 1, 2025 to April 30, 2027, aims to: (i) create more EUV-sensitive amorphous metal imidazolate films using molecular layer deposition; (ii) identify environmentally-friendly dry developers as alternatives to fluorinated chemicals; (iii) establish a fundamental understanding of the manufacturing steps; and (iv) optimize resist performance and reduce environmental impact through machine learning-assisted analysis. This work under CFDA 47.049 - Mathematical and Physical Sciences has the potential to enable a new, sustainable fabrication method for semiconductor devices, leading to more powerful, efficient, and reliable electronics.