ADaPT Gen III PCB Fabrication/Assembly

The National Aeronautics and Space Administration Shared Services Center seeks quotations for ADaPT Gen III printed circuit board fabrication and assembly, with proposals due July 30, 2026, and questions due July 28, 2026. This procurement carries multiple issue dates and set-aside designations reflecting RFQ revisions; the most recent version, issued July 27, is full and open competition, superseding an earlier small-business set-aside version.

Place of performance is Cleveland, Ohio (NASA Glenn Research Center, 21000 Brookpark Road, Cleveland, OH 44135). The contractor shall fabricate 12 PCBs using specialized microwave substrates with nine-layer stack configurations incorporating EM-892K glass cloth epoxy laminate, Astra M177 dielectrics, and multiple via types, then assemble components onto 8 PCBs with Rx bill of materials and 4 PCBs with Tx bill of materials. Manufacturing must comply with IPC-2221, IPC-2222, IPC-2228 Type 4 design standards and IPC-6012 Class 2 fabrication and inspection criteria. Assembly requires lead-based no-clean solder, J-STD-001 Class III and IPC-A-610 Class III standards, 2-hour minimum demoisturization at 93°C ± 5.5°C, and ESD controls. All fabricated PCBs require 100% electrical testing per IPC-6018 Class 2 Type 4.

Invoicing and completion are required by September 30, 2026, with milestone-based payment: 25% upon engineering review completion, 50% upon PCB fabrication completion, and 25% upon delivery of all assembled units. NASA provides long-lead RFICs as partial consignment. The solicitation uses lowest price technically acceptable evaluation; quotes must remain valid for 30 days and include two points of contact. NAICS code is 541330 (Engineering Services); PSC is 5963 (Electronic Modules). Delivery is FOB Destination. Firm-fixed-price contract value is TBD. All correspondence must reference ID 80NSSC26933620Q; submission email is lindsey.m.mclellan@nasa.gov.