Tab 04 SOW Redacted.pdf
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- Attached to
- ADaPT Gen III PCB Fabrication/Assembly
- Solicitation number
- 80NSSC26933620Q
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Statement of Work Summary: ADaPT Gen III PCB Fabrication and Assembly
This Statement of Work describes a NASA procurement for the fabrication and assembly of ADaPT Gen III Antenna Printed Circuit Boards (PCBs). The contractor shall fabricate 12 PCBs using specialized microwave substrates with specific via and trace geometry designed to meet antenna performance requirements. Following fabrication, the contractor shall assemble components onto 8 PCBs configured with an "Rx" Bill of Materials (BOM) and 4 PCBs configured with a "Tx" BOM; the two configurations differ only in drop-in replacement radio frequency integrated circuits (RFICs). All design specifications, including board dimensions, stack material, via sizes and counts, conductor geometry tolerances, and IPC inspection requirements, are detailed in the provided fabrication and assembly drawings (reference documents 20260701.pdf). Upon contract award, NASA will provide the contractor with additional technical files including BOM, Gerber, NC Drill, ODB, and Pick Place data for use in manufacturing.
The procurement must be invoiced and costed by September 30, 2026, with milestone-based payment structure preferred. The suggested payment schedule allocates 25% upon completion of engineering review, 50% upon completion of PCB fabrication, and 25% upon delivery of all 12 assembled units. This is a partial consignment arrangement in which NASA provides long-lead commercially available RFICs to the contractor for incorporation into the assemblies.
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Title: ADaPT Gen III Printed Circuit Board (PCB) Fabrication and Assembly
Statement of work: This procurement request is for the fabrication and assembly of the ADaPT Gen III Antenna PCB’s. The design uses specialized microwave PCB substrates along with specific via and trace geometry to ensure proper antenna performance. The attached fabrication and assembly files describe these details for quotation. Upon award additional files will be provided including: BOM, Gerber, NC Drill, ODB and Pick Place.
These files are generated by NASA and delivered to the contractor who fabricates and assembles the PCB’s according to the design file package.
Salient Specifications: See “ADaPT GEN III PCB, Fabrication Drawing, 20260701.pdf” and “ADaPT GEN III PCB, Assembly Drawing, 20260701.pdf” for board dimensions, stack material, via sizes and counts, conductor geometry tolerances, IPC specification and inspection requirements. The antenna PCB’s are made in 2 steps: the fabrication of the PCB itself then the assembly of parts onto the PCB. This request is for 12 PCB’s to be fabricated. Then 8 PCB’s to have parts assembled with an “Rx’ BOM and 4 PCB’s assembled with a “Tx” BOM. All 12 PCB’s are fabricated with the same exact design. The BOM diƯerences between the “Rx” assembly and “Tx” assembly are drop-in replacements for IC’s. This request is for partial consignment where NASA provides long lead commercially available RFIC’s (radio frequency integrated circuits).
Lead time: This procurement will need to be invoiced and costed by 9/30/2026. It is preferred to be invoiced with milestone payments if possible. Suggested structure:
25% upon completion of engineering review 50% upon completion of PCB fabrication 25% upon delivery of 12 assembled units
File details come from the government source that posted it. Updated .