Tab 04 SOW Redacted.pdf

This is a Statement of Work (SOW) for the fabrication and assembly of the ADaPT Gen III Antenna Printed Circuit Board (PCB). NASA requires a contractor to fabricate and assemble antenna PCBs according to NASA-provided design files, utilizing specialized microwave PCB substrates with specific via and trace geometry to ensure proper antenna performance.

The procurement involves a two-step manufacturing process: PCB fabrication followed by component assembly. Key cost drivers include the material stack-up composition and geometry tolerances for via sizes and trace geometry, with detailed specifications provided in the fabrication files. The SOW recommends that a single vendor perform both fabrication and assembly to minimize component damage risk and reduce shipping logistics between manufacturing steps. The antenna PCB stack-up consists of nine layers incorporating materials such as Astra M177 dielectrics, CF-004 signal layers, TSM-DS3b core substrates, and composite bond materials, with layer thicknesses ranging from 0.55mil to 5mil. Multiple via types are specified across different layers with varying aspect ratios and diameters. The mechanical design includes component placement locations, connectors, and mounting holes as depicted in the provided design drawings.