Laser Anneal MicroPro XS

The Defense Microelectronics Activity is seeking to procure a 3D-Micromac microPRO XS Laser Anneal System to provide laser anneal capability for forming backside ohmic contact with nickel silicide for silicon carbide device manufacturing and future high voltage device manufacturing. The solicitation requires the system be capable of processing 150mm silicon carbide wafer substrates within specified laser power and frequency ranges. Proposals are due by August 24, 2023 and will be evaluated based on product quality and price, with award to represent the best value.

The procurement has been set aside for total small business and is designated NAICS code 333298, other industrial machinery manufacturing, with PSC code J063 for semiconductor production equipment. The sole source justification approval identifies 3D-Micromac America LLC as the only vendor capable of meeting the specialized requirements. The place of performance will be McClellan Park, California and the period of performance includes installation, training, preventative maintenance and extended warranty coverage for one year.