UPDATED REDACTED 23-3F8 PWS 3D-Micromac microPRO XS Laser Anneal System.pdf
PDF 130 KB Posted
- Attached to
- Laser Anneal MicroPro XS
- Solicitation number
- HQ072723QMH06
- Issued by
-
Defense Microelectronics Activity
About this file
This performance work statement outlines requirements for the purchase of a 3D-Micromac microPRO XS Laser Anneal System for use by the Defense Microelectronics Activity in silicon carbide device manufacturing. The laser anneal system must be capable of processing 150mm silicon carbide wafer substrates with a UV 355nm nanosecond laser that has a power of 28W and frequency range of 40-200kHz. The system must include automated wafer handling, have a class ISO 3 cleanroom certified process chamber and handling area, and prevent heat damage to wafer fronts. The vendor will travel onsite to install the tool, provide basic training and documentation, and ensure the tool is operational according to specifications. The vendor will also supply a one year labor and parts warranty along with preventative maintenance for the first year.
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PERFORMANCE WORK STATEMENT (PWS)
DMEA 23-3F8
24 May 2023
Project Engineer: Tommy Nguyen, DMEA/MEBA, (916) 999-2717
Contract Officer Representative: Tracy Lu, DMEA/MEBA, (916) 999-2795
1.0 SCOPE:
1.1 TITLE: 3D-Micromac microPRO XS Laser Anneal System
1.2 APPLICABILITY: For use in DMEA Foundry SiC device manufacturing for backside ohmic contact formation with nickel silicide.
1.3 BACKGROUND:
1.4 PURPOSE: Purchase of the 3D-Micromac microPRO XS Laser Anneal System for laser anneal capability to form backside ohmic contact with nickel silicide for SiC device manufacturing and future high voltage device manufacturing.
2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:
2.1 GOVERNMENT DOCUMENTS:
Document No. Date Title eB 100714 ARMS Cleanroom Protocol
2.2 GOVERNMENT FURNISHED FACILITIES/ACCESS:
Facility/Access Date
DMEA 4234 54th Street, McClellan, CA 95652-2100 Upon Installation
3.0 REQUIREMENTS:
3.1 GENERAL REQUIREMENTS:
a. Include all items as listed in Appendix A of the PWS
b. Include all items (e.g. hardware, software, and other documentation) as listed in the tool purchase package
c. User Manuals (softcopy and/or hardcopy)
d. Correct or fix any hardware or software problems encountered during testing
e. Be operational and functional in accordance to tool vendor specifications
f. Provide DMEA with User Licenses and License Agreement
g. Provide DMEA with tool 1 year labor + 1 year parts warranty
h. Provide DMEA personnel with basic training to effectively use the tool
3.2 PROGRAM MANAGEMENT: None
3.3 TASK REQUIREMENTS: DMEA is tasked with installation of tool but vendor will perform checks to guarantee tool is operational, according to vendor specs, and also provide tool training. Travel for Field Service
Engineer to perform tool checks post installation and tool training is included in quote.
3.3.1 Travel: The vendor will travel to DMEA to perform testing of the tool onsite. The vendor performing the testing onsite shall provide proof of US citizenship. The vendor is required to check in with DMEA Security to obtain appropriate badge upon arrival.
3.4 TOOL REQUIREMENT: The tool shall be capable of laser anneal processing on 150 mm SiC wafer substrates.
The tool shall be a turn-key solution COTS product for SiC wafer manufacturing.
a. The tool shall have wafer size handling capability: 150mm
b. The tool shall have wafer thickness handling range capability: ≥ 100µm to 500µm
c. The tool shall have laser source and beam delivery capability: ns UV DPSS laser, with fluency range 0.5-4
J/cm2 (with 80 µm spot size)
d. The tool shall have laser type: UV 355nm Long Pulse Nanosecond Laser
e. The tool shall have laser capability: 28W max power with frequency range of 40-200kHz
f. The tool shall have process chamber ambient environment capability: N2 inert with O2 concentration monitoring
g. The tool shall have capability to prevent heat-related damage to the front-side of wafer during process
h. The tool shall have an automated wafer handling system
i. The tool shall be certified for use in a cleanroom environment for semiconductor manufacturing (class ISO
3 for process chamber and wafer handling area)
3.5 PROGRAM SUMMARY: None
4.0 POINTS OF CONTACT:
APPENDIX A – Laser Anneal System Required Item Options
Item Description Qty. Unit
1 microPRO XS for OCF according to attached specification
“SO02090_Specification microPRO XS OCF_Rev01_ext.xlsm”
1.00 pc
2 Installation, Basic training (3 days) and documentation (EN, hard-and software manuals, facility hook-up guide)
1.00 pc
3 Filter Fan Unit (FFU)
Additional FFU on top of laser process module to ensure continuous clean air flow – recommended for increased optical lifetime and decrease particle contamination during handling process
1.00 pc
4 Off-axis Process Camera
Optical image system for visualization of process results without removing the sample from the process chamber – recommended for process development
1.00 pc
5 Annual PM (Preventative Maintenance) during warranty period 1.00 pc
6 Spare parts package (per list in annex) 1.00 pc
File details come from the government source that posted it. Updated .