Direct Bonding for Compound Semiconductors

The Department of the Army Materiel Command Army Contracting Command Aberdeen Proving Ground, through the Army's C5ISR Center, is conducting market research to identify contractors capable of developing direct bonding techniques for compound semiconductors in dual band infrared focal plane arrays (FPAs). This Sources Sought Notice seeks companies with advanced manufacturing capabilities to remove or reduce infrared-absorbing epoxy in FPA production, with the ultimate goal of improving quantum efficiency and sensitivity of the Army's Electro-Optic Infrared (EOIR) systems. Interested contractors must demonstrate experience in FPA research, direct bonding techniques, Department of Defense science and technology support, and technical project management. Companies must submit a 10-page response detailing their capabilities and qualifications, with submissions due 15 days after the August 21, 2025 publication date, making the deadline September 5, 2025. The procurement falls under NAICS code 541715 for research and development services, and performance will occur at the contractor's facility.

This opportunity does not utilize any set-aside designations, making it open to all qualified contractors regardless of business size. The Sources Sought Notice does not identify any incumbent contractors or specify potential award values or budget ranges, as this is strictly a market research exercise with no cost or pricing information required in responses. The estimated performance period spans 36 months, providing a substantial timeline for the development and implementation of the advanced direct bonding manufacturing methods. Companies responding must include their business size classification and provide a comprehensive statement of capabilities. The research and development nature of this procurement suggests it will involve significant technical innovation in semiconductor manufacturing processes for military applications.