Specifications.pdf

Specifications: microPREP PRO system

03/12/2024

1. Base System: (no fixtures, stages, and laser included)

• GUI for fast and easy sample preparation

• Process (1st) and overview (2nd) camera

• Air-Jet and exhaust system to remove particles

• Workflows: cutting, thinning, milling (boxes, pillar, and Chunk™) and labeling

• Local certification

• 12 months warranty and software updates

2. FEMTO-Laser

• Maximum power: 2.5 W @ 60 kHz

• Guaranteed power: 2,2 W @ 60 kHz

• Wavelength: 515 nm

• Frequency: 60 - 1,000 kHz

• Pulsepicker: optional

• Pulse duration: < 300 fs

• Pulse energy: up to 50 μJ

2.5 W femtosecond laser with very short pulse. This laser is the best option for users who want to prepare transparent samples and avoid any kind of laser interference. The laser source is recommended for the preparation of atome probe tomography samples and cross sections. This laser is not recommended as an all-in-one solution and is optimized for the mentioned applications. The influence of the laser on the material is < 1 μm for most materials. The beam diameter of this laser is > 8 μm (focal length 65 mm with telecentric optics) and in combination with the camera setup the aiming accuracy is < 3 μm.

Recommendation: cross section for transparent and brittle material and samples for atom probe tomography

3. CO2 Snow Jet

Advanced cleaning process to remove dirt and dust. This process is non-destructive, non-abrasive, residue-free and environmentally friendly.

Includes: Connection Kit for CO2 Snow Jet

Note: liquid CO2 is required to use the CO2 Snow Jet

4. Installation and Basic Tool Operation Training

• One (1) day for installation and setup.

• Three (3) days are allotted for training.

o This training includes one day for parameter setup and maintenance processes and two days for application training.

5. Custom and Simple Shape

(CAD import and layout editor)

Additional process for creating standard geometries rectangles, triangles, circles, and combinations of them for cutting and ablation or loading complex DXF and vector files from CAD programs. Different processes (milling, cutting, marking and mask) or parameters can be assigned to the geometries. Allows the processing of freely created shapes with up to ten different laser parameters per process shape.

6. Motorized Containment Stage for milling and cutting under inert conditions

• sample size: < Ø 30 mm x 10 mm

• travel: 43 mm (X), 26 mm (Y), 360 ° (R)

• Processes: Cutting, Chunks, Pillar, box and ramp milling, Custom/Simple Shapes and marking

Motorized Containment Stage for milling and cutting under inert atmosphere. The travel range is limited by the size of the cover glass to 20 mm in X and Y directions. Process area must be in the center of the Containment Stage. The sample size is limited to Ø 30 mm x 10

mm. Containment can be opened with gloves.

Adapter: 3 mm pin (standard), UNC4-40 or M4 (will specify in order)