CHIPS Incentives Program
Active
- Assistance listing
- 11.037
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Grant awards
- Not on record
Program facts
- Treasury account
-
- 13-0520-0-1-376
- More information
Program details come from SAM.gov Assistance Listings. Updated .
About this program
The Department of Commerce National Institute of Standards and Technology (NIST) operates the CHIPS Incentives Program (CFDA 11.037) to fund construction, expansion, and modernization of domestic semiconductor manufacturing and research facilities, with a currently open application deadline of November 1, 2026, under solicitation 2023-NIST-CHIPS-SMME-01.
The program funds capital projects for the fabrication, assembly, testing, advanced packaging, and production of semiconductors; manufacture of semiconductor materials and equipment; and semiconductor research and development. Recent grant opportunities issued under this program target two project tiers: commercial fabrication facilities for front- and back-end semiconductor production (leading-edge, current-generation, and mature-node nodes) and semiconductor materials and manufacturing equipment facilities. The source does not provide representative recent grant awards, award volumes, or historical award data that would indicate grant frequency or typical funding magnitudes.
The program operates via Cooperative Agreements as the funding instrument. Eligible applicants are covered entities, defined as nonprofit entities, private-sector entities, consortia of private-sector entities, or consortia of nonprofit, public, and private-sector entities with demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to semiconductor fabrication, materials, or equipment manufacturing. All applications are submitted through the CHIPS Incentives Portal at applications.chips.gov.
Two solicitations are active or recently closed. The first Notice of Funding Opportunity (2023-NIST-CHIPS-CFF-01) posted February 28, 2023, sought applications for commercial fabrication facilities; its most recent due date was June 18, 2024. The second Notice of Funding Opportunity (2023-NIST-CHIPS-SMME-01) posted September 29, 2023, and was amended to extend the application window through November 1, 2026, for projects involving semiconductor materials and manufacturing equipment facilities. The second solicitation removed a capital investment ceiling that had previously been set at $300 million.
The source does not specify total program funding, award concentrations among agencies, or recent award history, limiting visibility into current funding volume and competitive posture.
Objective and description
- Objective
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security.
- Description
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security through the construction, expansion, and modernization of facilities and equipment in the United States for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. It seeks to assure a sufficient, sustainable, reliable, and secure domestic semiconductor ecosystem, including for national security needs and critical manufacturing industries. It also seeks to strengthen the semiconductor workforce and build strong communities across the United States that participate in the prosperity of the semiconductor industry.
Eligibility
- Applicant eligibility
An applicant must be a "covered entity." A "covered entity" means a nonprofit entity; a private- sector entity; a consortium of private- sector entities; or a consortium of nonprofit, public-, and private- sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.
- Credentials and documentation
Any required credentials and documentation will be announced in the applicable Notice of Funding Opportunity.
- Uses of assistance
Eligible uses include costs to finance the construction, expansion, or modernization of an eligible facility or equipment for that facility; support site development or modernization for the facility; support workforce development for the facility; and pay reasonable costs related to the operating expenses for the facility.
- Length and time phasing of assistance
The length of any direct funding (grant, cooperative agreement, or other transaction agreement), loan or guarantee will be determined on a case-by-case basis, based on the distinctive characteristics of individual projects. Assistance will be funded in tranches.
How to apply
- Preapplication coordination
Pre-application requirements include an Environmental Questionnaire that will assist the Department in determining the required level of environmental review for the proposed project(s). See the Notice of Funding Opportunity for more information.
- Application procedure
Any required steps for applying for assistance will be announced in the applicable funding solicitation.
- Criteria for selecting proposals
Specific criteria are listed in the Notice of Funding Opportunity posted at www.grants.gov.
- Award procedure
Award processes are identified in the applicable Notices of Funding Opportunity that will be posted on Grants.gov.
- Time to approval or disapproval
Ranges of approval/disapproval may vary. Information will be provided by the CHIPS Program Office.
Grant opportunities
| Opportunity | Status | Posted | Applications due |
|---|---|---|---|
| CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment | Open | ||
| CHIPS Incentives Program - Commercial Fabrication Facilities | Closed |
Quick answers
What is Assistance Listing 11.037?
Assistance Listing 11.037 is CHIPS Incentives Program, a federal grant program run by National Institute of Standards and Technology (Department of Commerce).
What is the CFDA number for CHIPS Incentives Program?
Its CFDA number is 11.037: Assistance Listing numbers were called CFDA numbers before 2018.
Are there open grant opportunities under 11.037?
1 listed opportunity under 11.037 is open or forecasted. The latest, CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment, was posted on September 29, 2023.
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