CHIPS Incentives Program - Facilities for Semiconductor Materials and Manufacturing Equipment
Open Posted
- Opportunity number
- 2023-NIST-CHIPS-SMME-01
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Applications due
- Award size
- Not on record
Opportunity facts
- Assistance listings
-
- 11.037 CHIPS Incentives Program
- Funding instrument
- Cooperative Agreement
- Category
-
- Science and Technology and other Research and Development
- Eligible applicants
-
- Other
- Points of contact
-
- Misty Roosa apply@chips.gov
- Full announcement
Opportunity details come from Grants.gov. Updated .
About this opportunity
The National Institute of Standards and Technology (NIST) within the Department of Commerce is seeking applications for construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment, with concept plans due November 1, 2026. The program funds up to $500 million in total capital projects without a specified per-award ceiling or minimum investment threshold following the most recent amendment, though the government file summary indicates a minimum capital investment of approximately $20 million applies. Eligible applicants ("covered entities") include nonprofit entities, private-sector entities, consortia of private-sector entities, or consortia combining nonprofit, public, and private-sector entities, each with demonstrated ability to substantially finance, construct, expand, or modernize a semiconductor-related facility. Awards will be provided as grants or cooperative agreements (Assistance Listing 11.037) and range from 10–30% of project costs. The program operates through a two-phase application process: concept plans are submitted first, with select semi-finalists advancing to full applications. Funded activities include facility construction, site development, workforce development, and reasonable operating expenses; funding cannot be used for activities outside the United States or for purchasing equity securities. Recipients must partner with state or local governments and commit to workforce training and community investment programs. The program prioritizes projects that support regional chip manufacturing clusters, strengthen supply chain resilience, advance U.S. technology leadership, and demonstrate commercial viability, technical feasibility, and financial resources. Applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. Pre-application requirements include completion of an Environmental Questionnaire.
Synopsis
3 versions
Update #3 · Latest ·
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Update #2 ·
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is an amendment to the second Notice of Funding Opportunity under this program. This amendment re-opens and extends the period of acceptance of applications, which was originally open from December 1, 2023, through February 1, 2024, so that concept plans will now be accepted through November 1, 2026. It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. Application forms and instructions are available on the CHIPS Incentives Program application portal. FAQs, guides and templates are available at https://www.chips.gov. -
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million.
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Update #1 ·
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment for which the capital investment falls below $300 million.
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Eligibility
An applicant must be a "covered entity" to receive CHIPS Incentives. For purposes of this NOFO, a "covered entity" means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
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