A02 - JA - Direct Bonding - Redacted.pdf

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DRS Network & Imaging Systems, LLC. (DRS) Program: Direct Bonding for Compound Semiconductor

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Justification Review Document for Other than Full and Open Competition

Federal Acquisition Regulation (FAR) Part 6

Program/Equipment: Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays (FPAs).

Authority: Title 10 United States Code Section 3204(a)(1) as implemented in Federal Acquisition Regulation 6.302-1(a)(2)(ii)(A), Only one responsible source and no other supplies or services will satisfy agency requirements.

Amount: $8.4M

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DRS Network & Imaging Systems, LLC. (DRS) Program: Direct Bonding for Compound Semiconductor

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Reviews:

I have reviewed this justification and find it adequate to support other than full and open competition.

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DRS Network & Imaging Systems, LLC. (DRS) Program: Direct Bonding for Compound Semiconductor

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Justification and Approval

For Other than Full and Open Competition – FAR Part 6

1. Contracting Activity – Army Contracting Command-Aberdeen Proving Ground (ACC- APG), Division A, Aberdeen Proving Ground, MD

2. Description of Action –US Army Command, Control, Communications, Computers, Cyber, Intelligence, Surveillance, and Reconnaissance (C5ISR) Center, Research & Technology Integration Directorate (RTI), Electro-Optic Components Division (EOCD) requests approval to award a new Sole Source procurement for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays (FPAs). The resulting contract will be a single-award, Cost-Plus-Fixed-Fee (CPFF) Contract to the following contractor:

Name of Contractor: DRS Network & Imaging Systems, LLC. (DRS), CAGE Code:

32865, UEI: MC27B7LGBL34; locate at: 100 N Babcock ST, Melbourne, Florida 32935-

The contract will be funded using Research, Development, Test and Evaluation (RDT&E) FY26-28 Mantech funding.

3. Description of Supplies/Services – This project focuses on developing and implementing direct bonding techniques to eliminate the use of epoxy in the production of dual-band FPAs, thereby addressing the current limitations on sensitivity and yield.

The Contractor shall develop direct bonding (DB) techniques to completely remove or reduce the use of infrared absorbing epoxy (and or other bonding) materials from the manufacturing process.

The total estimated ceiling of the proposed action is $8.4 million (M). This estimated ceiling is based on historical knowledge. The period of performance is 36 Months.

4. Authority Cited – Title10 United States Code Section 3204(a)(1) as implemented in FAR 6.302-1(a)(2)(ii)(A), Only one responsible source and no other supplies or services will satisfy agency requirements, with substantial duplication of cost to the Government that is not expected to be recovered through competition.

5. Reason for Authority Cited: The proposed acquisition requires development of direct bonding techniques that can only be performed by a vendor with expertise and experience in the current Army Third Generation (3GEN) Forward Looking Infrared (FLIR) Electro-Optic Infrared (EOIR) system. The Government performed market research by posting a sources sought notice on sam.gov and Request for Information to

DRS Network & Imaging Systems, LLC. (DRS) Program: Direct Bonding for Compound Semiconductor

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IDIQ RS3 159 vendors to improve competition in accordance with FAR 6.303-2(b)(6).

Results of the market research found only DRS has the capability to successfully perform the design, fabrication, and testing of FPAs utilizing direct bond hybridization and ability to deliver and a manufacturing process capable of repurposing non-spec dual-band Infrared (IR) FPAs. DRS is the only detector manufacturer in the industry to provide cost efficiencies as required by this acquisition. DRS is the only vendor that has relevant experience in direct bonding and fabrication of FPAs to eliminate the use of epoxy in the production of the dual-band FPAs in order to meet the requirements of Direct Bonding for Compound Semiconductors.

6. Efforts to Obtain Competition: In accordance with DFARS 205.205-71, DFARS 206.302-1(d), and DFARS Procedures, Guidance, and Information (PGI) 206.302-1 (d), a Sources Sought announcement was publicized on SAM.gov on 21 August 2025 and ended on 05 September 2025. As of 5 September 2025, two sources expressed interest in this acquisition, emailed that the offeror is interested in this sources sought; however, as of 5 September 2025, no further information is received in writing to response to the market research. (2) DRS Network & Imaging Systems, LLC. (DRS), submitted a response to the sources sought on 5 September 2025. In addition, the RFI has been posted and released to Multi-Award IDIQ RS3 holders on 21 November 2025 with due date on 12 December 2025. Only two (2) vendors, submitted their responses to the RFI. The Government Technical Lead reviewed all responses and found both vendors’ responses are inadequate to perform this effort. The result of Market Research Report has been documented on 13 January 2026.

Subcontracting Competition: IAW FAR 19.702 and FAR 19.704, a Subcontracting Plan is required for this acquisition, as it exceeds $900K. According to FAR 19.704, the contractor must include FAR 52.219-8, entitled “Utilization of Small Business Concerns”, in all subcontracts that offer further subcontracting opportunities and shall require all subcontractors, except small businesses, that receive subcontracts in excess of $900K to adopt a plan that complies with the requirements of the clause at FAR 52.219-9, “Small Business Subcontracting Plan”. Per FAR 44.204(c), the solicitation and resulting contract will include the FAR clause 52.244-5, entitled “Competition in Subcontracting” and DFARS clause 252.219-7003, entitled “Small Business Subcontracting Plan (DoD Contracts)” to ensure that all subcontracts are awarded on a competitive basis to the maximum extent possible.

7. Actions to Increase Competition: As stated previously in paragraph five (5), the Government will continue to conduct market research to identify potential sources that can add value and inform requirements. .

DRS Network & Imaging Systems, LLC. (DRS) Program: Direct Bonding for Compound Semiconductor

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8. Market research Report/Commerciality Determination Report (MRR/CD): In accordance with FAR 10.001(a)(2). The purpose of this Market Research was to identify potential sources that have the skills, experience, knowledge, and capabilities required to completely remove or reduce the use of infrared absorbing epoxy (an or other bonding) materials from the manufacturing process. Sources must have a fully qualified processes and plans to perform development and ability to implement direct bonding techniques to eliminate the use of epoxy in the production of dual-band FPAs, thereby addressing the current limitations on sensitivity and yield. The scope encompasses the design, fabrication, and testing of FPAs utilizing direct bond hybridization (DBH) with a common IR-transparent material interface, such as ZnS.

Key deliverables include and a manufacturing process capable of repurposing non-spec dual-band Infrared (IR) FPAs as HDLW FPAs. The project leverages ongoing Office of the Secretary of Defense (OSD) and Army ManTech efforts to improve 3GEN processes (in LRIP), Molecular Beam Epitaxy (MBE) absorber growth, uniformity, and digital r95eadout integrated circuit (ROICs). Successful process improvements will be directly transferred to production lots and validated through standard FPA testing, with the potential to benefit programs like 3GEN FLIR, Distributed Aperture Infrared Countermeasure (DAIRCM) and Standard Missile 3 (SM3), enhancing Warfighter capabilities and reducing costs. The resultant potential sources are detailed above at paragraph 6. Efforts to Obtain Competition.

9. Interested Sources: The results of the Sources Sought announcement are addressed in paragraph six (6) of this document. There is a reasonable basis to conclude at this time, that the agency’s minimum needs can only be satisfied by the DRS. All notices required by FAR 5.201(b)(1)(i) will be published, and any proposal received shall be considered.

10. Other Facts:

a. Procurement history: In March 2016, Contract W909MY-16-C-0009 was awarded to DRS under Full and Open Competition for the design, development, fabrication, and qualification of a producible Dewar Cooler Bench (DCB). In August 2022, Contract W909MY-22-C-0023 was awarded to DRS under Full and Open Competition to produce a common DCB for integration into the 3GEN FLIR B-Kit.

b. Other Facts: There are no other facts to present that have not been previously stated.

DRS Network & Imaging Systems, LLC. (DRS) Program: Direct Bonding for Compound Semiconductor

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11. Technical Certification: I certify that the supporting data under my cognizance, which are included in the J&A, are accurate and complete to the best of my knowledge and belief.

Name:

Title: Signature:

12. Requirements Certification: I certify that the supporting data under my cognizance, which are included in the J&A, are accurate and complete to the best of my knowledge and belief.

Name:

Title: Signature

13. Fair and Reasonable Cost Determination: I hereby determine that the anticipated cost to the Government for this contract action will be fair and reasonable. The determination of fair and reasonable cost will comply with the policies, regulations, and procedures in FAR Part 15, “Contracting by Negotiation.” Analysis techniques will include cost/price analysis, technical evaluation, and pricing assistance support by the Defense Contract Audit Agency (DCAA). In accordance with FAR 15.403, certified cost or pricing data will be required for this acquisition.

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Title: Signature

14. Contracting Officer (KO) Certification: I certify that this justification is accurate and complete to the best of my knowledge and belief.

Name:

Title: Signature: