Amendment 1.pdf

0RC0F002

AMENDMENT OF SOLICITATION/MODIFICATION OF CONTRACT

Except as provided herein, all terms and conditions of the document referenced in Item 9A or 10A, as heretofore changed, remains unchanged and in full force and effect.

15A. NAME AND TITLE OF SIGNER (Type or print)

30-105-04EXCEPTION TO SF 30

APPROVED BY OIRM 11-84

STANDARD FORM 30 (Rev. 10-83) Prescribed by GSA

FAR (48 CFR) 53.243

The purpose of this amendment is to provide a set of "questions and answ ers" pertaining to the MICK Board Layout and Packaging project in accordance w ith Statement of Work (SOW) DMEA 10-0F0 dated 28 July 2010. The attached list is compiled from questions received from potential offerors.

The due date for receipt of proposals has been extended to 7 September 2010, Tw elve O'Clock noon, Pacific Time.

1. CONTRACT ID CODE PAGE OF PAGES

1 7

16A. NAME AND TITLE OF CONTRACTING OFFICER (Type or print)

16C. DATE SIGNED

BY 25-Aug-2010

16B. UNITED STATES OF AMERICA15C. DATE SIGNED15B. CONTRACTOR/OFFEROR

(Signature of Contracting Officer)(Signature of person authorized to sign)

8. NAME AND ADDRESS OF CONTRACTOR (No., Street, County, State and Zip Code) X H94003-10-T-0011

X 9B. DATED (SEE ITEM 11)

16-Aug-2010

10B. DATED (SEE ITEM 13)

9A. AMENDMENT OF SOLICITATION NO.

11. THIS ITEM ONLY APPLIES TO AMENDMENTS OF SOLICITATIONS

X The above numbered solicitation is amended as set forth in Item 14. The hour and date specified for receipt of Offer X is extended, is not extended.

Offer must acknowledge receipt of this amendment prior to the hour and date specified in the solicitation or as amended by one of the following methods:

(a) By completing Items 8 and 15, and returning 1 copies of the amendment; (b) By acknowledging receipt of this amendment on each copy of the offer submitted;

or (c) By separate letter or telegram which includes a reference to the solicitation and amendment numbers. FAILURE OF YOUR ACKNOWLEDGMENT TO BE RECEIVED AT THE PLACE DESIGNATED FOR THE RECEIPT OF OFFERS PRIOR TO THE HOUR AND DATE SPECIFIED MAY RESULT IN REJECTION OF YOUR OFFER. If by virtue of this amendment you desire to change an offer already submitted, such change may be made by telegram or letter, provided each telegram or letter makes reference to the solicitation and this amendment, and is received prior to the opening hour and date specified.

12. ACCOUNTING AND APPROPRIATION DATA (If required)

13. THIS ITEM APPLIES ONLY TO MODIFICATIONS OF CONTRACTS/ORDERS.

IT MODIFIES THE CONTRACT/ORDER NO. AS DESCRIBED IN ITEM 14.

A. THIS CHANGE ORDER IS ISSUED PURSUANT TO: (Specify authority) THE CHANGES SET FORTH IN ITEM 14 ARE MADE IN THE

CONTRACT ORDER NO. IN ITEM 10A.

B. THE ABOVE NUMBERED CONTRACT/ORDER IS MODIFIED TO REFLECT THE ADMINISTRATIVE CHANGES (such as changes in paying office, appropriation date, etc.) SET FORTH IN ITEM 14, PURSUANT TO THE AUTHORITY OF FAR 43.103(B).

C. THIS SUPPLEMENTAL AGREEMENT IS ENTERED INTO PURSUANT TO AUTHORITY OF:

D. OTHER (Specify type of modification and authority)

E. IMPORTANT: Contractor is not, is required to sign this document and return copies to the issuing office.

14. DESCRIPTION OF AMENDMENT/MODIFICATION (Organized by UCF section headings, including solicitation/contract subject matter where feasible.)

10A. MOD. OF CONTRACT/ORDER NO.

2. AMENDMENT/MODIFICATION NO. 5. PROJECT NO.(If applicable)

6. ISSUED BY

3. EFFECTIVE DATE

25-Aug-2010

CODE

DEFENSE MICROELECTRONICS ACTIVITY

CONTRACTING DIVISION

4234 54TH STREET

MCCLELLAN CA 95652-2100

H94003 7. ADMINISTERED BY (If other than item 6)

4. REQUISITION/PURCHASE REQ. NO.

CODE

See Item 6

FACILITY CODECODE

doster@dmea.osd.milEMAIL:(916)231-1521TEL:

DAWN B. DOSTER / CONTRACTING OFFICER

H94003-10-T-0011

SECTION SF 30 BLOCK 14 CONTINUATION PAGE

SUMMARY OF CHANGES

SECTION A - SOLICITATION/CONTRACT FORM

The required response date/time has changed from 31-Aug-2010 05:00 PM to 07-Sep-2010 12 noon.

(End of Summary of Changes)

Attachment 1

“Questions and Answers”

Technical Approach

1. As we do all of our mechanical layout using the SolidWorks CAD system, we are wondering if a CAD model (in SolidWorks, IGES, and/or STP format) would be permitted as a deliverable in lieu of a physical mock up? (Ref. RFQ paragraph 3.2.2.1).

If a physical model is still required, then what we would do is have a 3D model “printed” using proven stereolithography methods. With the first design review just 4 weeks into the program, we were thinking that the solid CAD model would be equivalent to a physical model.

A 3D “printed” model is adequate for a physical mock-up.

2. The MS5540-CM Miniature Barometer Module (Ref. BOM) is a SMD (Surface Mount Device) intended to lay flat on the surface of a Printed Circuit Board (PCB). If this sensor must be on the same face of the MICK as the other connectors, etc., then that will mean an additional small PCB will be needed as a carrier which is 90 degrees to the main two PCBs in the MICK. This adds complexity and consumes space.

Is it within the design space to allow the MS5540-CM to have its port on the top face of the MICK, thus allowing it to be surface mounted on the PCB?

The barometer sensor port placement shall concur with Figure 3 in the Statement of Work (SOW).

3. What specific PCB layout software is required for the layout of the board? (Pads, Altium, Cadence).

Are there any particular design tools for layout required by your engineer?

There is no specific requirement for this task. We use Orcad and PADS.

4. Is there a document with particular design rules for this design required by your designer/engineer, especially in the RF section?

There is no document with particular design rules for this task. The contractor will apply best practices, and the PCB layouts will be reviewed during the design reviews.

5. Why are there 31 individual header connectors? Most of them look like interface connectors that need to be accessed when the top cover is removed?

See NOTE on page 5 of the schematics.

To clarify required headers,

1) “External World Interface” are the external ports denoted by name,

2) the “Expansion Connector” shall be placed near a PCB edge and shall be accessible when the PCBs are stacked per paragraph 3.2.2.2, and

3) the Iridium module will be connected via J22 per page 3 of the schematics.

Placement is dependent on best volume fit by the offeror. In other words, no requirement is specified for accessibility when the top cover is removed.

6. Do the I/O connectors need to be waterproof? The Enclosure BOM connectors listed are not?

All enclosure connectors shall be waterproof based on design requirement #8 in Appendix A. The offeror shall recommend connectors required for the enclosure based on the note in the Enclosure BOM. Treat the listed connectors for reference only.

7. Are the connectors listed on the Enclosure BOM for reference only or are they contractor preferred?

The connectors listed on the Enclosure BOM are for reference only and are contractor preferred as long as they meet any related requirements.

8. There are two types of SMA connectors listed on the Enclosure BOM, which is preferred?

On the Enclosure BOM, there is a SMA connector and a SMA cable.

9. Will the design need to incorporate mechanical fences for circuit partitioning?

The offeror shall apply best engineering practices to ensure the product meets DMEA specifications.

10. Is the -40 deg C to +85 deg C really operational or is it storage? The +85 deg C seems high for operational.

The requirement for operational temperature is -40°C to +85°C.

11. Is conversion of design schematics to a different PCB design tool suite acceptable?

There are no specific software vendor requirements. We use OrCAD and PADS.

12. In the event of vendor shortages, are alternate vendors acceptable?

Alternate vendors are acceptable upon DMEA approval.

13. Pg 22, paragraph 3.2.2.1 mentions a warming blanket and insulation for the battery, but these items do not appear in the miniaturization BOM or the schematic. Are these the Kapton heaters (no reference designator) in the enclosure BOM? Are they still part of the design, and if so what are the details of these components?

Yes, the warming blanket is the Kapton heater. It is meant to regulate the temperature of the battery at a particular threshold.

14. Pg 27, line item number 16, what is the required submersion depth?

No specific submersion depth required. As specified in Appendix A, the enclosure shall be waterproof and survive altitude requirements. When the device is fielded, there may be a situation in which the device is submersed under 5 feet of water for brief intermittent periods of time. A maximum time interval of submersion with margin would be 10 minutes.

15. In the miniaturization BOM, J42 is missing a quantity/board. Can you clarify?

Disregard J42 per the NOTE on page 5 of the schematics. To clarify, the only connectors required are the “External World Interface”, the “Expansion Connector”, and J22 for U17.

16. Several parts in the enclosure BOM are missing the vendors and reference designators. Can you clarify?

The connectors listed on the Enclosure BOM are for reference only and are contractor preferred as long as they meet any related requirements.

17. The microcontroller interface is achieved through the use of 0.100" center headers. Including the single row headers, the footprint of these connectors will constitute greater than 22% (28.2 cm^2) of the total available footprint in a two card design. Additionally, the vertical (Z) profile required by these connectors will consume approximately 84% (2.1 cm) of the target dimension. Will these connectors be required in the miniaturized design, or is direct connection of these nets acceptable? Preliminary footprint analysis indicates that it is unlikely the initial or final miniaturized versions will satisfy the physical design requirements with the inclusion of these connectors.

See NOTE on page 5 of the schematics. Except “External World Interface” and “Expansion Connector”, all other connectors will be removed and replaced by traces to establish connectivity.

18. Will pin re-assignment for layout purposes (while retaining required microcontroller peripheral functionality) be allowed?

If related to the connectors, see NOTE on page 5 of the schematics.

19. Can we utilize the GPIO funtionality of the microcontroller for pin re-assignment to improve the board layout?

No.

20. Will any functional test firmware be available for on-site QA prior to shipment?

No.

21. Is sub-contracting of the PCB manufacturing, enclosure injection molding, RF shield metal stamping, assembly, and/or other manufacturing services acceptable?

Yes, but please address where sub-contracting will be used in your proposal.

Program Management

1. For planning purposes, what should we use as an anticipated award/start date for the program?

Please see Section F of the RFQ. It is anticipated that the award date will be NLT 30 September 2010.

2. Are the following components NOT GFE?

Altimeter/Barometric Sensor NOT GFE Sanyo Lithium Ion batteries (qty 2) GFE – QTY will be 20 per SOW Birk Kapton heaters (qty 2) NOT GFE Tamperproof switch NOT GFE

3. In the miniaturization and enclosure BOMs, U17 is missing a vendor. Can the part be acquired from the manufacturer or does the "(for reference only)" comment in the miniaturization BOM indicate that the Government will provide that part and/or assemble that part?

U17 is GFE.

4. In the miniaturization and enclosure BOMs, BT2 and BT3 are missing the vendor. Can the parts be acquired from the manufacturer or are those the Government provided batteries mentioned on pg 20, paragraph 1.2?

BT2 and BT3 is GFE.

5. From the RFQ, it appears that the only mandated contractor-performed testing is open/shorts testing.

Can you confirm?

The only contractor-performed testing is opens/shorts testing, but the contractor must design the MICK to meet all requirements.

Miscellaneous

1. Were the OrCAD designs and BOMs generated by DMEA or another entity? If another, are you at liberty to name or at least categorize (university, prime contractor, small business) the developer?

The OrCAD designs and BOMs were generated by DMEA.

2. Will the OrCAD files include the printed circuit board package libraries (OrCAD PCB Editor)?

No.