DARPA-PS-26-127_Perrseus_Attachment_D_Proposal_Instructions_and_Volume_I_Template_Technical_and_Management_v1.docx

Attachment D: DARPA-PS-26-127 Volume I: Technical and Management Proposal Template Competition Sensitive Information – see 41 U.S.C. 2102 DARPA-PS-26-127: Perrseus Proposal Instructions and Volume I Template Use of this template is mandatory for all proposal submissions to this PS. Proposers must include Attachments C, D, E, F, G, H, and I to constitute a full proposal submission. This document must include all components described herein and must be submitted in PDF or Microsoft Word formats. All submissions must be written in English, and all pages shall be formatted for printing on 8-1/2 by 11-inch paper with 1-inch margins and font size no smaller than 12 points. Font sizes of 8 or 10 points may be used for figures, tables, and charts.

Proposers are encouraged to submit concise but descriptive proposals. Specific examples of problems, approaches, or goals are preferred to qualitative generalities. The Government will not consider pages in excess of the page count limitations, as described herein. Proposals with fewer than the maximum number of pages will not be penalized. Proposers are encouraged to use the written proposal and oral presentation as complementary elements of a complete submission and are not required to replicate information between the two documents. Additional information not explicitly called for in the Technical and Management Volume must not be submitted with the proposal but may be included as links in the bibliography. Such materials will be considered for the reviewers’ convenience only and not evaluated as part of the proposal.

Oral Presentation

Oral presentations will be held in person with a Microsoft Teams option for sub-contractors only and are tentatively scheduled during the dates and times listed in the Overview Information section of the PS. DARPA will notify proposers of their scheduled time via email. Slides cannot be modified between proposal due date and oral presentation.

· The Government will not review or evaluate any information that is contained within the notes section of the PDF or PowerPoint slides. All pertinent information must be included in the main body of the presentation slides, and the content presented orally will be the basis for evaluation.

· The oral presentation shall not exceed 20 slides and and must be submitted in PDF or Microsoft PowerPoint format. Proposers will be allotted 30 minutes for presentations. Video demonstrations or prerecorded presentations are allowed within the 30-minute time limit. This may include a video demonstrating their capabilities (tools, labs, equipment, etc.) relevant to the Perrseus program that is no longer than 5 minutes.

· The oral presentation content should follow similar outline and information content as the written component (see Volume 1: Written content, below). A presentation template is not provided, but a strong emphasis on the innovative claims, technical approach, technical risks and mitigation strategies, and commercialization/manufacturing plan is encouraged. A section on how the proposed solution will achieve the program metrics is required. All claims must be justified using quantitative analysis and supporting evidence derived from modeling, simulation, and/or prior experimental work.

· Immediately following the oral presentation, there will be a 45-minute interactive Q&A Session to address questions from a Government evaluation panel. The Government panel may ask questions on any aspect of the oral or written proposal during the Q&A session. Answers to questions from the panel cannot be deferred to later time, and proposers cannot modify their proposals in response to the Q&A session. Any statements made or emails sent folllowing the 45-minute Q&A session will not be considered for evaluation.

Technical and Management Volumes shall not exceed a maximum of 15 pages.

All text, technical figures, tables, and charts in:

· Proposal Summary

· Goals and Impact

· Technical Plan

· Management Plan

· Personnel, Qualifications, and Commitments

· Capabilities

· Cover Sheet

· Table of Contents

· Official transmittal letter

· Letter of Intent (if applicable)

· Intellectual Property (IP) & Commercialization Plan

· Requirements for teams that include Government Entities and/or Federally Funded Research and Development Centers (FFRDCs)

· Phase 0 Security Deliverables

· Organizational Conflict of Interest Affirmations

· Novelty of Proposed Work

· Example Process Traveler (Optional)

· Graphical Representation of Proposed Process Steps (Optional)

· Resumes (Optional)

· References/Bibliography (Optional)

· Technical Papers (Optional, no more than 3)

Proposals must be submitted per the instructions outlined herein and received by DARPA no later than the due date and time listed in the Overview Information section. Proposals received after this time and date may not be reviewed. Please visit Proposer Instructions and General Terms and Conditions and see Attachment M for instructions on how to submit your proposal through the Broad Agency Announcement Tool (BAAT).

COVER SHEET

[PRIME ORGANIZATION LOGO]

Proposal Title

Proposer Organization

Proposer Reference Number, if any

Address:

Telephone:

Email:

Address:

Telephone:

Email:

Place(s) of Performance

Period(s) of Performance

Months

Organization:

Organization Type:

If YES, you must check the box below to certify compliance:

· [ ] I certify that a Joint Letter of Intent to Execute (LOI) signed by the commercialization/IP offices of both the Prime and the Federal Laboratory is included.

If YES, you must check the box below to certify compliance:

I certify that our team has contacted the agency POC to verify eligibility and confirm the entity is not on the prohibited IV&V partner list. [ ]

Phase 1 (Base): $ Phase 2 (Option): $ Total: $

CMMC Certification Level (1, 2, or 3)

[ ] Pathway B (Requires Phase 0)

SAM.gov Unique Entity ID (UEI)[endnoteRef:2] [2: The SAM-generated UEI becomes the official identifier for doing business with the U.S. Government. This replaces DUNS.]

Taxpayer identification number (TIN)[endnoteRef:3] [3: See https://www.irs.gov/individuals/international-taxpayers/taxpayer-identification-numbers-tin for information on requesting a TIN. Note, requests may take from 1 business day to 1 month depending on the method (online, fax, mail).]

Commercial and Government Entity (CAGE) code[endnoteRef:4] [4: A CAGE Code identifies companies doing or wishing to do business with the Federal Government. ]

Administration Office POC at Defense Contract Management Agency (DCMA)[endnoteRef:5] or Office of Naval Research (ONR)[endnoteRef:6], if known [5: https://pubapp.dcma.mil/CASD/CasdSearch.do.] [6: http://www.onr.navy.mil/Contracts-Grants/Regional-Contacts.aspx.]

Name:

Address:

Telephone:

Audit Office POC at Defense Contract Audit Agency (DCAA)[endnoteRef:7], if known [7: http://www.dcaa.mil/Home/Locator?title=Locator]

Name:

Address:

Telephone:

Date Proposal was Prepared

Proposal Validity Period (minimum 120 days)

Table of Contents

Official Transmittal Letter Attach the official transmittal letter from the prime proposer organization.

Proposal Summary Provide a top-level synopsis of the proposed project, including answers to the following questions:

· What is the proposed work attempting to accomplish or do?

· How is the work performed today (what is the state of the art or practice), and what are the limitations?

· What assumptions are holding the community back from making progress? What are your insights and innovations?

· If successful, will you provide a commercial service for vacuum packaging?

· What is new in your approach, and why do you think it will be successful?

· What are known risks and what are the unknowns in your proposed manufacturing process(es)?

· Why is your proposed process “manufacturable?” What will you do to ensure compatibility across MEMS, photonic, and quantum sensing devices?

· What is your proposed approach for the integrated pressure sensor(s) covering the needed pressure range of operation? How will you determine pressure sensor drift versus vacuum environmental drift?

· What is your proposed methodology for testing all the required vacuum parameters to track progress?

· What is your proposed methodology to validate device lifetime on a rapid timeframe, especially given potential nonlinear aging mechanisms of expected components?

The summary should include a description of the key technical challenges, a concise review of the technologies proposed to overcome these challenges and achieve the project’s goal, and a clear statement of the novelty and uniqueness of the proposed work.

Goals and Impact Describe what you are trying to achieve and the difference it will make (qualitatively and quantitatively) if successful. Describe the innovative aspects of the project in the context of existing capabilities and approaches, clearly delineating the uniqueness and benefits of this project in the context of the state of the art, alternative approaches, and other projects from the past and present. Describe how the proposed project is revolutionary and how it significantly rises above the current state of the art. Describe the deliverables associated with the proposed project and any plans to commercialize the technology, transition it to a customer, or further the work. Discuss the mitigation of any issues related to the sustainment of the technology over its entire lifecycle, assuming the technology transition plan is successful.

Technical Plan Outline and address technical challenges inherent in the approach and possible solutions for overcoming potential problems. Demonstrate a deep understanding of the technical challenges and present a credible (even if risky) plan to achieve the project’s goal. Discuss mitigation of technical risk. Provide appropriate measurable milestones (quantitative if possible) at intermediate stages of the project to demonstrate progress and a plan for achieving the milestones. List Government-furnished materials or data assumed to be available.

In addition, the technical plan should answer the following questions:

· What components are included in your proposed µUHV system? What is the maturity level of those components from a performance and manufacturing perspective?

· If using an active pump, such as an ion pump, describe its power draw, range of operation, and gases pumped.

· Describe, in detail, how the package will manage noble gas. For example: If the package is sealed at 1E-18 mbar and is impenetrable, then it is unlikely that noble gas is an issue. If the package is sealed at 1E-6 mbar and/or is penetrable, then we would like a description of how the package will remove noble gas.

· What process will you use to realize ohmic electrical interconnects? What is the anticipated leak rate of these interconnects (defined as the sum of permeation and outgassing)?

· What process will you use to realize single-mode photonic interconnects for wavelengths < 1 m? What is the anticipated leak rate of these interconnects (defined as the sum of permeation and outgassing)?

· What is the permeability of your housing? What is the anticipated leak rate of this housing (defined as the sum of permeation and outgassing)?

· What is your material bonding approach? What is the anticipated leak rate at this interface? What surface quality is required for this interface?

· How will you deal with trapped gases and virtual leaks that occur from cleanroom processing techniques (plasma cleans, sputtering, etc.) that might unintentionally create virtual leaks?

· How soon can you produce vacuum packages with integrated pressure sensors sensitive to pressures below 1E-3 mbar? Provide the manufacturing timeline for this cycle and explain how you will rapidly iterate from fabrication to testing.

· How long will it take to verify that the integrated pumps are actively pumping relevant gas species, and how will you iterate on the pump design based on those results?

· Describe the specific tooling and short loops you will use to accelerate the development timeline, enabling the rapid fabrication and testing of multiple package variations. Be specific.

· Describe how you will integrate a source of atoms or molecules for use in a quantum sensor.

· Describe how you will ensure that this source is compatible with MEMS and photonic tooling.

· Discuss how your approach enables the integration of atomic or molecular sources across the periodic table (e.g., Rb, Cs, K, Li, Na, Ca, Sr, Yb, Ba, Ra).

· Discuss your plan to control the vapor pressure of the source using the package interconnects.

· Discuss how you will load sufficient atomic source material to achieve > 3 years of device lifetime.

· Describe how you will integrate getters and methods to reduce getter contamination.

· Do you need more than one getter to pump varied gases?

· Discuss the gettering capacity and pumping lifetime of your approach.

· Relate this approach to the largest leak rate in your proposed system and estimate the device lifetime. Discuss methods to ensure > 3 years of device lifetime.

· Describe the sealing method of the proposed vacuum package.

· At what pressure will this device be sealed?

· Will you monitor background gases during the sealing process?

· What is the outgassing/bakeout procedure? How will this bakeout interact with (1) coefficient of thermal expansion mismatches for integrated pressure sensors (if any), and (2) the atomic and gettering sources included in the package? Be specific.

· Discuss anticipated mass loss from the atomic sources or getters during the bakeout. Explain how your approach is compatible with a wide variety of sources and getters.

· Discuss plans for an integrated pressure sensing architecture.

· Describe in detail the drift and accuracy of your proposed pressure sensors.

· Identify any issues that prevent sensitivity to the absolute pressure.

· Identify any issues that prevent accurate measurement of the pressure such as sensor geometry, shock sensitivity, and heating.

· Discuss how you will calibrate sensors and how much power it will take.

· For leak measurements over weeks, describe how you will determine pressure sensor drift from vacuum drift and sensor nonlinear aging.

· How will you verify whether your pressure sensors work across the full range of vacuum levels?

Proposers must include a detailed schematic of the proposed µUHV system along with a schematic of the process(es) that will be needed to realize the system.

Management Plan Provide a summary of the proposed team, including any subawardees/consultants and key personnel who will be executing the work (please use table below). Identify a principal investigator (PI) for the project. Provide a clear description of the team’s organization, including an organization chart that illustrates, as applicable, the relationship of team members, unique capabilities of team members, task responsibilities of team members, teaming strategy among the team members, and key personnel with the amount of effort to be expended by each person during the project. Provide a detailed plan for coordination, including explicit guidelines for interaction among collaborators/subawardees of the proposed project. Include a table outlining (1) the major risks of the program, (2) strategies to mitigate the risks early, and (3) alternatives if the risks persist.

Include an attestation that all subcontractors who will process, store, or transmit FCI or CUI under a resultant award will meet the applicable CMMC level required by 32 CFR § 170.23, and indicate how proposers will verify subcontractors’ status prior to subcontract award. For subcontractors handling CUI under this program, the minimum requirement is CMMC Level 2 (Self-Assessment).

Describe any formal teaming agreements that are required to execute this project.

· Identify how the proposed teaming is responsive to the multi-disciplinary nature of the Perrseus challenges.

· Identify past experiences of your team with Process Travelers and manufacturing process development.

· If the process developed under Perrseus is successful, how would the proposed team ensure commercial transition of the capability to be widely used to meet the Government’s needs?

Prime

Subawardees/Consultants

Personnel, Qualifications, and Commitments List key personnel (no more than one page per person), showing a concise summary of their qualifications, discussion of previous accomplishments, and work in this or closely related research areas. Indicate the level of effort in terms of hours to be expended by each person during each contract year and other (current and proposed) major sources of support for them and/or commitments of their efforts. DARPA expects all key personnel associated with a proposal to make substantial time commitment to the proposed activity, and the proposal will be evaluated accordingly. It is DARPA’s intention to put key personnel conditions into the awards, so proposers should not propose personnel that are not anticipated to execute the work.

Capabilities Describe the organizational experience in the relevant subject area(s), existing intellectual property, or specialized facilities. Discuss any work in closely related research areas and previous accomplishments. Identify other Government solicitation(s) to which this concept has been proposed. If applicable, state whether funding or a positive funding decision has already been received and from which agency.

Intellectual Property (IP) and Commercialization Strategy Please provide the following information, as applicable. Note: The Government will assume unlimited rights to all IP not explicitly identified as restricted in the proposal.

0. Intellectual Property Plan Offerors shall submit a comprehensive Intellectual Property Management Plan that addresses, at a minimum, the following topics:

· Identification of Background IP (BIP): A complete list of all pre-existing technical data, software, patents, or other proprietary information that will be incorporated into the proposed solution or will be necessary to use, manufacture, or transition the technology.

· Anticipated Foreground IP (FIP): A description of the new IP expected to be generated under this program.

· Proposed Ownership and Government Rights:

· State the proposed ownership approach for FIP.

· Clearly state whether you are adhering to the Government's Baseline IP Rights

· If proposing Specially Negotiated License Rights (SNLR), explicitly identify the proposed rights (e.g., GPR for FIP, Limited/Restricted for BIP) and provide a detailed justification linked to your commercialization plan and cost-share contribution.

· Licensing Strategy: Describe your strategy for licensing FIP and/or BIP to the Government and, if applicable, to third parties.

· Collaboration and "No Blocking Rights": Describe your approach for enabling collaboration and technical integration with other Perrseus performers, ensuring compliance with the "No Blocking Rights" clause.

Failure to disclose material restrictions or deviations from the Government's baseline rights will be considered in evaluating proposal risk.

a. Technical Data and Computer Software Are you asserting any IP restrictions on any technical data or non-commercial computer software that will be delivered to the Government?

No Yes If yes, list all proprietary claims to results, prototypes, deliverables or systems supporting and/or necessary for the use of the proposed research, results, prototypes and/or deliverables. Provide a short summary for each item asserted with less than unlimited rights that describes the nature of the restriction and the intended use of the intellectual property in the conduct of the proposed research. Use the following format for these lists.

NONCOMMERCIAL

Are you proposing any commercial software that will be delivered to the Government? If yes, please provide licensing terms.

No Yes

COMMERCIAL

b. Patents Does the proposed effort involve using patented inventions that are owned by or assigned to the proposing organization or individual? If yes, provide documentation proving ownership or possession of appropriate licensing rights to all patented inventions to be used for the proposed project. If a patent application has been filed for an invention, but it includes proprietary information and is not publicly available, provide documentation that includes: the patent number, inventor name(s), assignee names (if any), filing date, filing date of any related provisional application, and summary of the patent title, with either: (1) a representation of invention ownership; or (2) proof of possession of appropriate licensing rights in the invention (i.e., an agreement from the owner of the patent granting license to the proposer).

No Yes Commercialization and Transition Strategy Plan The Government’s objectives are stated below and are included in the evaluation criteria of “Potential Contribution and Relevance to the DARPA Mission.” Please provide information on how the approach presented is compatible with the vision for widely available high volume manufacturing.

· Ensure sufficient Government license rights to use, integrate, modify, sustain, transition, and further develop program results.

Failure to disclose material restrictions or transition barriers may result in a higher risk assessment under the proposal evaluation.

Responses must submit information describing the following topics:

· Anticipated Government, commercial, and dual-use applications.

· Manufacturing, production, or deployment strategy (specifically addressing the Captive Fab or Fabless requirements outlined in the PS).

· Planned private investments beyond Government funding.

· Specific commercialization and transition milestones.

Requirements for teams that include Government Entities and/or Federally Funded Research and Development Centers (FFRDCs) Are any of the team member organizations (prime or subawardee) a Government Entity or FFRDC? If yes, provide the information outlined below.

No Yes

a. Proof of Eligibility to Propose Provide documentation citing the specific authority that establishes the applicable team member’s eligibility to propose to Government solicitations; include: (1) statutory authority; (2) contractual authority; (3) supporting regulatory guidance; and (4) evidence of agency approval for applicable team member participation. For FFRDCs, this documentation must be in the form of a letter on official letterhead from their sponsoring organization and must also include a statement of compliance with the terms and conditions of the associated FFRDC sponsor agreement, as applicable.

If your proposed team utilizes an FFRDC as a technical performer, you must detail their specific roles, required facilities, and how the “Know-How” transfer will be physically executed. Additionally, you must submit a formal, co-signed Joint Letter of Intent to Execute (LOI) from the commercialization, IP offices of the prime and FFRDC stating that a CRADA or equivalent with “know-how” transfer will be executed within 45 days of program start.

b. Statement of Unique Capability Provide a statement that demonstrates the work to be performed by the Government entity or FFRDC team member is not otherwise available from the private sector.

Phase 0 Security Deliverables As stated in the main solicitation document, proposers that, at the time of proposal submission, do not have a valid, unexpired CMMC status (representing either Final or Conditional status) posted in the Supplier Performance Risk System (SPRS) indicating compliance at CMMC Level 2 (Self-Assessment), as well as a current annual CMMC affirmation, submitted by an authorized Affirming Official, posted in SPRS, will be required to complete Phase 0 prior to beginning Phase 1.

As part of the proposal, such proposers should include the following in their Technical Volumes with respect to Phase 0:

a. Current Cybersecurity Posture Describe the Offeror’s current cybersecurity environment, including:

· Existing compliance with NIST SP 800-171 requirements.

· Current CMMC implementation status.

· Existing information systems that may be used for this effort.

· Any current SPRS assessment information, if available.

b. Phase 0 Cybersecurity Implementation Plan Provide a detailed implementation plan describing the activities that will be completed during Phase 0 to establish a CUI-compliant environment. At a minimum, the plan shall include:

· Major implementation tasks.

· Responsible personnel.

· Schedule with milestones.

· Dependencies and critical path activities.

· Identification of any subcontractors supporting cybersecurity implementation.

c. Required Phase 0 Deliverables The implementation plan shall identify the delivery schedule for the following Government review and acceptance items:

· Complete System Security Plan (SSP).

· Completed CMMC Level 2 Self-Assessment.

· SPRS submission confirmation and assessment score.

· Network architecture diagram.

· CUI data flow diagram.

· Incident Response Plan.

· Configuration Management Plan.

· Access Control procedures.

· Media Protection procedures.

· Security Awareness and Training documentation.

· Plan of Action and Milestones (POA&M), if applicable.

d. Readiness Certification At the conclusion of Phase 0, the Offeror shall certify that:

· The CMMC Level 2 Self-Assessment has been completed.

· Assessment results have been submitted to SPRS.

· The information system is operational and capable of protecting CUI.

· All personnel requiring access to CUI have been appropriately authorized and trained.

· All subcontractors that will receive CUI satisfy applicable cybersecurity requirements.

No CUI shall be provided to the Offeror, nor shall the Offeror process, store, or transmit CUI, until the Government has reviewed and accepted the required Phase 0 cybersecurity deliverables and has provided written authorization to proceed.

Failure to successfully complete Phase 0 cybersecurity requirements may result in termination of the agreement or the Government’s decision not to authorize transition to subsequent phases.

Organizational Conflict of Interest Affirmations and Disclosure In accordance with the requirements of the PS, provide the following information.

a. Are any of the proposed individual team members or their respective organizations (whether prime or subawardee or consultant) currently providing SETA, A&AS, or similar support to DARPA?

No Yes

b. Did any of the proposed individual team members or their respective organizations (whether prime or subawardee or consultant) provide SETA, A&AS, or similar support to DARPA within one calendar year of this proposal submission?

No Yes If yes to 8.a OR 8.b, provide the following information for each applicable team member:

· The name of the DARPA office receiving the support

· The prime contract number

· Identification of proposed team member (subawardee, consultant) providing the support

· An OCI mitigation plan in accordance with FAR 9.5

c. Are there any other potential Organizational Conflicts of Interest involving any of the proposed individual team members or their respective organizations (whether prime or subawardee or consultant)?

No Yes If yes to 8.c, provide the following information for each applicable team member:

· Identification of applicable team member; and

· An OCI mitigation plan in accordance with FAR 9.5.] Novelty of Proposed Work Has the proposed work been submitted to any other Government solicitation?

No Yes If yes, provide the following information:

· Solicitation number ________________________

· Agency _________________________

· Proposed work has already received funding or a positive funding decision.

No Yes Decision pending Example Process Traveler (Optional) Proposers should provide a high-level summary of their anticipated manufacturing process flow. This summary should demonstrate a clear, logical sequence of the major fabrication, bonding, and testing steps that could be replicated by a non-expert. The following is a notional example of the expected level of detail; proposers should tailor the content to their unique technical approach.

Proposers may attach a previous example of a completed process traveler as evidence for process development experience. There is no page limit for any attached Process Travel. Attached process travelers will not be evaluated for technical content but as evidence of process development and manufacturing experience. Any relevant technical information relevant to the proposed technical approach must be included in the body of the abstract.

Example: Notional Information that may be found in a process traveler for a Hybrid Glass-Silicon µUHV Package. The more information the better.

· Step 1: Substrate Preparation

· 1.1: Procure 8-inch silicon wafer (prime grade, <100> orientation).

· 1.2: Fabricate electrical interconnects and MEMS sensor structures via standard CMOS foundry process (e.g., PolyMUMPS).

· 1.3: Deposit and pattern getter material (e.g., Titanium) in designated areas.

· Step 2: Housing Fabrication

· 2.1: Procure 8-inch borosilicate glass wafer.

· 2.2: Etch cavities for vacuum volume using deep reactive-ion etching (DRIE).

· 2.3: Deposit anti-permeation coating (e.g., Al₂O₃) on all surfaces via atomic layer deposition (ALD).

· Step 3: Wafer-Level Bonding

· 3.1: Align silicon and glass wafers in a high-vacuum (<10⁻⁷ mbar) wafer bonder.

· 3.2: Perform anodic bonding at 400°C to create a hermetic seal at the wafer level.

· Step 4: Pump-Down and Pinch-Off

· 4.1: Integrate micro-ion pump structures.

· 4.2: Activate getters and pumps during a high-temperature bake-out (250°C for 48 hours).

· 4.3: Perform final MEMS-scale pinch-off to seal the package.

· Step 5: Dicing and Final Test

· 5.1: Dice bonded wafer stack into individual µUHV packages.

· 5.2: Conduct initial pressure measurement using integrated high-Q MEMS resonator.

· 5.3: Perform He leak testing on a sample of diced packages to verify seal integrity.

Graphical Representation of Proposed Process Steps (Optional) Proposers should include a single, clear, and well-annotated cross-sectional diagram that illustrates the key components and manufacturing steps of their proposed µUHV package. The diagram should visually correspond to the major steps outlined in the Process Traveler Summary. Its purpose is to provide a quick, intuitive understanding of the proposed architecture.

Example Description of a Good Diagram:

· A good diagram would be a 2D cross-section showing the substrate wafer at the bottom and the housing wafer on top.

· It would clearly label key materials (e.g., "Silicon Substrate," "Glass Housing," "Al₂O₃ Coating").

· It would show the location of critical components described in the main solicitation, such as the "Getter Material," the "MEMS Sensor Structure," and the "Photonic/Electrical Interconnects" passing through the sealed boundary.

· Annotations or arrows could be used to indicate key processes, like “Bond Interface" or "Laser Weld Point."

(Note: Proposers should embed the diagram directly into this document.)

Bibliography (Optional) A brief (no more than 5 pages) bibliography may be provided with links to relevant papers, references, reports, etc.