This $414,655 National Science Foundation (NSF) Engineering Program (CFDA 47.041) project grant, awarded on September 15, 2024, aims to address emerging challenges in the field of heterogeneous integration (HI) in semiconductor packaging. The project will develop rapid 3D metrology techniques and incorporate machine learning to accelerate the detection of fabrication defects in semiconductor packages, thereby improving the reliability and performance of electronic packaging. The technical aspects of the project involve developing advanced metrologies and predictive multiscale modeling tools to capture defects within HI packages across multiple length scales and predict critical defects that could lead to device failure. The project will also involve a diverse educational and outreach program to train the next generation of students for the semiconductor industry. The University of Arizona is a sub-awardee on this project, contributing to the research efforts.
Mod # | Description | Reason For Modification | Federal Obligation (Click to sort descending) | Date (Click to sort ascending) |
|---|---|---|---|---|
| Not listed | $0 | 11/8/24 | ||
| Not listed | $414.7k | 9/10/24 |
Grant Number | Description | Subgrantee | Prime Award | Dollars Obligated (Click to sort descending) | Updated At (Click to sort ascending) |
|---|---|---|---|---|---|
10002550019S | Arizona Board Of Regents | Project Grant 2425126 | $193.5k | 4/29/25 |