This federal Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) provides $376,318 to Purdue University for a 3-year research project focused on addressing emerging challenges in heterogeneous integration and semiconductor packaging. The project aims to develop advanced metrology techniques and predictive multiscale modeling tools to rapidly detect and quantify the impact of fabrication defects in next-generation semiconductor packages. By fusing 3D...
This $275,000 National Science Foundation (NSF) Project Grant, awarded under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program, funds the development and validation of materials and processes for advanced semiconductor manufacturing at Geminatio, a for-profit organization. The goal is to enable the progression of Moore's Law and strengthen domestic semiconductor manufacturing capacity and capability, which has been impacted by recent supply chain issues. The project seeks to...
This National Science Foundation (NSF) CAREER award under the Engineering program (CFDA 47.041) provides $650,000 of funding to Northeastern University over a 5-year period from June 2025 to May 2030. The project aims to conduct fundamental research on enhancing the adhesion, fatigue resistance, and switching capabilities of soft sticky adhesives, which have broad applications in areas like electronics, robotics, and healthcare. The research will integrate experimental characterization,...
This National Science Foundation (NSF) Project Grant award under CFDA 47.041 "Engineering" supports a collaborative US-German research effort to develop multiscale data-physics models for improving the critical interface properties of overmolded thermoplastic parts. The $777,782 award to Columbia University's Sponsored Projects Administration Division will fund fundamental research to quantitatively understand the molecular processes and manufacturing parameters governing adhesion...
This $600,000 project grant from the National Science Foundation's Engineering program (CFDA 47.041) will fund collaborative research between the University of South Florida and Princeton University from July 2022 to June 2025. The research aims to establish a predictive theoretical understanding of nanoscale gradients in rheological response at interfaces in glass-forming fluids. Specifically, the grant will support experiments to observe fluid flow and deformation at the nanometer scale,...
This $495,000 Project Grant awarded by the National Science Foundation's Mathematical and Physical Sciences (CFDA 47.049) program funds research to develop structurally programmable adhesives with actively modulated performance for specialized applications such as wearable electronics, biomedical devices, and soft robotics. The University of North Carolina at Chapel Hill, through its Office of Sponsored Research, will lead a 3-year effort to better understand how molecular brush architecture...
This $410,000 Project Grant from the National Science Foundation's Engineering program (CFDA 47.041) will fund research at The Pennsylvania State University to develop new approaches for electrical contacts to two-dimensional semiconducting transition metal dichalcogenides. The research team will test hypotheses about the role of metal deposition techniques, use of semimetals, and junction formation in reducing contact resistance. They will perform experiments to isolate the effects of key...
This Project Grant award of $521,832 from the National Science Foundation's (NSF) Engineering program (CFDA 47.041) supports research conducted by the University of Illinois focused on developing an innovative "Scanning Nanodroplet Additive Printer-on-a-Chip" (SNAP-Chip) technology. The research aims to test the hypothesis that miniaturizing nozzle and nozzle-electrode gap sizes can enable a new sub-continuum "nano-dripping" regime for additive manufacturing. This would allow...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Project Grant award of $275,000 to United Semiconductors, LLC supports the development of two critical hardware components for in-space manufacturing of advanced semiconductor materials: A Universal Crystal Growth Capsule designed to leverage microgravity conditions during crystal growth, enabling high-throughput production of high-purity semiconductor crystals. A novel Wafer Dicing Tool to achieve...
This Project Grant award, funded by the Division of Materials Research at the National Science Foundation (CFDA 47.049 - Mathematical and Physical Sciences), enables 10 undergraduate students per year to engage in a 10-week intensive research project revolving around semiconductor materials or technologies. The $411,886 award, with a project period from September 1, 2024 to August 31, 2027, aims to prepare students for the semiconductor industry by immersing them in research on novel...