This National Science Foundation (NSF) Engineering (CFDA 47.041) project grant, awarded to Lamar University in the amount of $198,456, supports research to enhance the reliability modeling of semiconductor packages subjected to dynamic excitation. The award seeks to develop a new framework, theory, and methods to effectively and efficiently model the reliability of electronic packages under vibrations, extreme temperatures, humidity, and mechanical shocks. Key objectives include integrating research with education and outreach initiatives, providing new research opportunities for undergraduate students, and advancing the state-of-the-art in accelerated testing and modeling techniques for semiconductor packages. The project aims to bridge the gap between force-excited and base-excited nonlinear dynamic modeling approaches, leveraging a phase-locked loop control algorithm and a novel accelerated testing approach. The award period is from June 15, 2025 to May 31, 2027.
Mod # | Description | Reason For Modification | Federal Obligation (Click to sort descending) | Date (Click to sort ascending) |
|---|---|---|---|---|
| Not listed | $198.5k | 6/5/25 |