This National Science Foundation (CFDA 47.041 - Engineering) Project Grant award of $348,061 to the CAL Poly Pomona Foundation Inc. will fund research to investigate the fundamental mechanics of thermomechanical fatigue in next-generation semiconductor devices. The research aims to develop an energy dissipation criterion to evaluate thermomechanical fatigue damage in semiconductor/metal interfaces, which are prone to failure due to thermal expansion coefficient mismatches. The study will measure changes in the impedance of the semiconductor/metal interface to assess interfacial debonding and fatigue crack propagation rates, while numerical simulations will guide the selection of appropriate fatigue testing amplitudes and provide insights into key state variables influencing crack initiation. The research will extend beyond traditional silicon-based semiconductors to include materials such as silicon carbide, gallium oxide, zirconium-doped hafnium oxide, and gallium nitride. The goal is to establish a unified material parameter, the specific energy of interfacial debonding, to evaluate fatigue damage in semiconductor/metal interfaces, providing a framework for improving the durability and reliability of future semiconductor devices. The project period is from May 1, 2025 to April 30, 2028.
Mod # | Description | Reason For Modification | Federal Obligation (Click to sort descending) | Date (Click to sort ascending) |
|---|---|---|---|---|
| Not listed | $348.1k | 4/23/25 |