TPT semi-automatic thermosonic wire bonder package

Ended Purchase Order Awarded Last action

Contract number
N0017325P0103
Awardee
Awarding agency
Obligated
$47,960

Award facts

Contract value 100% obligated
$47,960.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
NAICS code
334413 Semiconductor and Related Device Manufacturing
PSC
3670 Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery
Set-aside
No set-aside
Competition
Not Competed · 1 offer Only One Source
Pricing
Firm Fixed Price
Place of performance
Washington, DC 20375, USA

Award details come from SAM.gov/FPDS.

About this award

The Office of Naval Research awarded a purchase order to Cook And Weil, Inc. for a TPT semi-automatic thermosonic wire bonder package valued at $47,960.00 on November 7, 2024, with completion due December 27, 2024. Cook And Weil is a small business based in Morganville, New Jersey, operating as a manufacturers' representative for semiconductor and electronics manufacturing equipment. Performance occurs in Washington, DC. The order is firm fixed price with no set-aside applied.

Quick answers

Who was awarded contract N0017325P0103?

N0017325P0103 was awarded to Cook And Weil, Inc. by Office of Naval Research (Secretary of the Navy) on November 7, 2024.

How much is contract N0017325P0103 worth?

The government has obligated $47,960 on N0017325P0103.

Was contract N0017325P0103 competed?

The extent of competition for N0017325P0103 was not competed. The government received 1 offer.

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