Laser anneal 3D-micromac micropro XS
Ended Definitive Contract Awarded Last action
- Contract number
- HQ072723C0007
- Awardee
-
3D-Micromac America LLC UEI LV16VTP3TAY1
- Awarding agency
-
Defense Microelectronics Activity
Department of Defense
- Obligated
- $1,484,720
Award facts
- Opportunity
-
- Laser Anneal MicroPro XS Solicitation · HQ072723QMH06 · Posted Aug 14, 2023
- Contract value 98% obligated
- $1,521,220.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- Set-aside
- No set-aside
- Competition
- 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- San Jose, CA 95131, USA
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Funding Only Action | $36,500 | |
| Original award | $1,484,720 |
About this award
The Defense Microelectronics Activity, operating under the Department of Defense, awarded a $1.52M firm fixed-price definitive contract to 3D-Micromac America LLC on September 25, 2023, for procurement of a 3D-Micromac microPRO XS Laser Anneal System. This specialized equipment will be installed and operationalized at the contractor's San Jose, California facility to support silicon carbide device manufacturing. The system is specifically designed to provide laser annealing capability for forming backside ohmic contacts with nickel silicide and will support future high-voltage device development. The procurement was competitively solicited under a total small business set-aside, with proposals evaluated on product quality and price to achieve best value. The Defense Microelectronics Activity determined that 3D-Micromac America LLC possessed sole-source capability to meet the specialized technical requirements outlined in the solicitation.
The contract encompasses system delivery, installation, operator training, preventative maintenance, and extended warranty coverage through September 30, 2024. The laser anneal system must be capable of processing 150-millimeter silicon carbide wafer substrates within specified laser power and frequency parameters to support the government's advanced semiconductor manufacturing objectives. This procurement falls under NAICS code 333298 (other industrial machinery manufacturing) and supports the Defense Department's ongoing investment in domestic microelectronics manufacturing capabilities and next-generation defense-critical semiconductor technologies.
Quick answers
Who was awarded contract HQ072723C0007?
HQ072723C0007 was awarded to 3D-Micromac America LLC by Defense Microelectronics Activity (Department of Defense) on September 25, 2023.
How much is contract HQ072723C0007 worth?
The government has obligated $1,484,720 on HQ072723C0007. Its current value, with exercised options, is $1,521,220.
Was contract HQ072723C0007 competed?
The government received 1 offer.
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