Surface Mount Technology Production Line

Added: Feb 10, 2011 3:39 pm Modified: Jun 18, 2011 3:06 pmTrack Changes Commercially available turnkey Surface Mount Technology (SMT) production line including the following 1) Inline Stencil Printer; 2) Automatic Inline Pick N Place module; 3) Reflow Oven; 4) Linking Conveyor System. All items will be compatible and work in sync to produce a completely populated board. A stand alone Ball Grid Array (BGA) rework machine to support the production line activity is also included.

The Naval Air Warfare Center Weapons Division (NAWCWD) China Lake, CA intends to procure a commercially available turnkey Surface Mount Technology (SMT) production line. This line will include the following 1) Inline Stencil Printer 2) Automatic Inline Pick N Place module 3) Reflow Oven 4) Linking Conveyor System. All of these items must be compatible and work in sync to produce a completely populated board. In addition to this line the Government will also require a stand alone Ball Grid Array (BGA) rework machine to support the production line activity.
Minimum specifications are as follows:
The Inline Stencil Printer (for Solder Paste application) shall:
Be capable of handling circuit boards of up to 14" X 14" in size; have an integrated stencil cleaning system; have an automatic framing positioning system; have an automatic integrated inspection system of solder paste; and shall interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase, Further, software upgrade shall be provided for at least 5 years at no additional cost.
The Automatic Inline Pick N Place Module shall:
Be able to accommodate component sizes from a 201 footprint up to 2"; be able to accommodate a minimum of 150 feeder positions; offer an intelligent feeder interface; accommodate component heights up to 25mm; be delivered with cassettes and feeders to accommodate the quantity of 76-8mm reels, 6-12mm reels, and 4-16mm reels, and be capable of accepting tubes and trays; have the capability of accommodating both trays and reels simultaneously; accommodate boards of up to 14"X14" in size; interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase; and provide software upgrades for at least 5 years at no additional cost.
The Hot Air Full Convection Reflow Oven shall:
Accommodate boards of up to 14" X 14" in size; accommodate lead solder; accommodate a minimum of 30 mm in clearance for items placed inside; have 5 heating zones and one cooling zone;l have the capability for the operator to program the temperature and speed; have an exhaust system; shall interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase; and provide software upgrades for at least 5 years at no additional cost.
The Conveyor System shall:
Connect Inline Fully Automatic Stencil Printer, Automatic Inline Pick N Place Module, Hot Air Full convection Reflow Oven, to work in a coherent and organized manner; and aid in the transfer of circuit boards from one machine to another such that there is limited to no human handling required.
The Ball Grid Array Rework/ Placement Station shall:
Be a stand-alone design, independent of the inline system; accommodate circuit boards of up to 14†X 14†in size; have a minimum clearance of 30 mm for items to be processed; accept leaded process; have an integrated Reflow Process Camera; have a XY table; be capable of desoldering and soldering BGAs; be controllable by the operator and be capable of maintaining set temperature + 10 degrees F and interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase; and provide software upgrades for at least 5 years at no additional cost.
This acquisition is for a commercial item and will be conducted using FAR Part 12 and 13.5.
Specific information to include detailed specifications shall be included in Solicitation N68936-11-T-0086 to be issued and posted on the Navy Electronic Commerce Online website at http://www.neco.navy.mil and the FEDBIZOPPS website at http://www.fbo.gov/ on or about March 1, 2011, to close 30 days after the Request for Quote issue date.
Delivery requirements shall be F.O.B. Destination China Lake, CA. Estimated award is May 2011.
All responsible sources may submit a written quotation which shall be considered by the agency. All responses shall be submitted in writing to the Naval Air Warfare Center Weapons Division, Code 210000D, Attn: S. Shultz, 429 E. Bowen Road Mail Stop 4015, China Lake, CA 93555-6108.
All responsible sources must be registered in the Central Contractor Registration (CCR) database at the following website: https://www.ccr.dlis.dla.mi;/ccr/scripts/index.html. In accordance with FAR 4.1201, prospective contractors shall complete electronic annual representations and certifications via the Online Representations and Certifications Application (ORCA at: http://orca.bpn.gov in conjunction with required registration in the CCR database.
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Added: Feb 10, 2011 3:39 pm The Naval Air Warfare Center Weapons Division (NAWCWD) China Lake, CA intends to procure a commercially available turnkey Surface Mount Technology (SMT) production line. This line will include the following 1) Inline Stencil Printer 2) Automatic Inline Pick N Place module 3) Reflow Oven 4) Linking Conveyor System. All of these items must be compatible and work in sync to produce a completely populated board. In addition to this line the Government will also require a stand alone Ball Grid Array (BGA) rework machine to support the production line activity.



Minimum specifications are as follows:



The Inline Stencil Printer (for Solder Paste application) shall:



Be capable of handling circuit boards of up to 14" X 14" in size; have an integrated stencil cleaning system; have an automatic framing positioning system; have an automatic integrated inspection system of solder paste; and shall interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase, Further, software upgrade shall be provided for at least 5 years at no additional cost.



The Automatic Inline Pick N Place Module shall:

Be able to accommodate component sizes from a 201 footprint up to 2"; be able to accommodate a minimum of 150 feeder positions; offer an intelligent feeder interface; accommodate component heights up to 25mm; be delivered with cassettes and feeders to accommodate the quantity of 76-8mm reels, 6-12mm reels, and 4-16mm reels, and be capable of accepting tubes and trays; have the capability of accommodating both trays and reels simultaneously; accommodate boards of up to 14"X14" in size; interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase; and provide software upgrades for at least 5 years at no additional cost.



The Hot Air Full Convection Reflow Oven shall:

Accommodate boards of up to 14" X 14" in size; accommodate lead solder; accommodate a minimum of 30 mm in clearance for items placed inside; have 5 heating zones and one cooling zone;l have the capability for the operator to program the temperature and speed; have an exhaust system; shall interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase; and provide software upgrades for at least 5 years at no additional cost.



The Conveyor System shall:

Connect Inline Fully Automatic Stencil Printer, Automatic Inline Pick N Place Module, Hot Air Full convection Reflow Oven, to work in a coherent and organized manner; and aid in the transfer of circuit boards from one machine to another such that there is limited to no human handling required.



The Ball Grid Array Rework/ Placement Station shall:

Be a stand-alone design, independent of the inline system; accommodate circuit boards of up to 14†X 14†in size; have a minimum clearance of 30 mm for items to be processed; accept leaded process; have an integrated Reflow Process Camera; have a XY table; be capable of desoldering and soldering BGAs; be controllable by the operator and be capable of maintaining set temperature + 10 degrees F and interface with standard 60Hz US power supplies: 120V 1-phase, 240V 1-phase, 208V 3-phase, or 480V 3-phase; and provide software upgrades for at least 5 years at no additional cost.



This acquisition is for a commercial item and will be conducted using FAR Part 12 and 13.5.

Specific information to include detailed specifications shall be included in Solicitation N68936-11-T-0086 to be issued and posted on the Navy Electronic Commerce Online website at http://www.neco.navy.mil and the FEDBIZOPPS website at http://www.fbo.gov/ on or about March 1, 2011, to close 30 days after the Request for Quote issue date.



Delivery requirements shall be F.O.B. Destination China Lake, CA. Estimated award is May 2011.



All responsible sources may submit a written quotation which shall be considered by the agency. All responses shall be submitted in writing to the Naval Air Warfare Center Weapons Division, Code 210000D, Attn: S. Shultz, 429 E. Bowen Road Mail Stop 4015, China Lake, CA 93555-6108.

All responsible sources must be registered in the Central Contractor Registration (CCR) database at the following website: https://www.ccr.dlis.dla.mi;/ccr/scripts/index.html. In accordance with FAR 4.1201, prospective contractors shall complete electronic annual representations and certifications via the Online Representations and Certifications Application (ORCA at: http://orca.bpn.gov in conjunction with required registration in the CCR database.