Microelectronics Request for Information
Closed Pre-Solicitation Posted
- Solicitation number
- HDTRA126RFI-Microelectronics
- Agency
-
Defense Threat Reduction Agency
Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 541512 Computer Systems Design Services
- Place of performance
- Fort Belvoir, Virginia 22060, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Defense Threat Reduction Agency (DTRA), Research and Development Directorate, Chemical and Biological Technologies division, is issuing a Request for Information (RFI) to identify innovative microelectronic materials and hybrid semiconductors that can reduce size, weight, power, and cost (SWaP-C) for advanced sensor applications. The agency seeks information on flexible, two-dimensional materials with semi-conductive properties suitable for tactical defense applications, including materials that can replace traditional printed circuit boards and be integrated into textiles. Respondents must submit a five-page white paper and ten-slide PowerPoint presentation detailing their development plans, technical approach, material sensor characteristics, and preliminary cost estimates for 1-3 years of science and technology development followed by 3-4 years of advanced development. Key material requirements include operational sustainability across -30°C to 50°C temperature ranges, ruggedization per MIL-STD-810H standards, and microsensor integration capabilities. The submission deadline is February 6, 2026, by 5:00 PM EST, and all responses must be directed to Dr. Jennifer Soliz and Ms. Beth Jensen via email.
This RFI includes no set-aside designation and does not represent a commitment by the government to procure any materials or services; rather, it is an information-gathering exercise only. No incumbent contractors or current award values are identified in this notice. Respondents should note that all submissions become government property and will not be returned, and the information provided is subject to change at the government's discretion. Validation of proposed concepts can be supported by historical data, literature references, relationships with current Department of Defense researchers, or evidence of past interagency program investment. While specific budget ranges are not disclosed in the RFI, interested parties should be prepared to provide rough order of magnitude cost estimates for their proposed development programs.
Notice text
2 versions
Update #2 · Latest ·
***The submission date for responses is extended through 6 February 2026 by 1700 (5:00pm) EST
THIS IS A REQUEST FOR INFORMATION (RFI) ONLY to identify microelectronic materials that can provide low size, weight, power, and cost. The information provided in the RFI is subject to change and is not binding on the Government. The Defense Threat Reduction Agency has not made a commitment to procure any of the items discussed, and release of this RFI should not be construed as such a commitment or as authorization to incur cost for which reimbursement would be required or sought. All submissions become Government property and will not be returned. Respondents shall provide a brief description on how they plan to develop or advance existing technologies/sensing materials for the identified applications as well as any anticipated technical parameters of their product (or conceptual product). Validation can include historical, literature data or relationship with current DOD researchers. Validation can also include investment from interagency past programs.
The Defense Threat Reduction Agency, Research and Development, Chemical and Biological Technologies directorate (DTRA RD-CB) in support of the Joint Program Executive Office for Chemical, Biological, Radiological, Nuclear Defense (JPEO-CBRND) is seeking information on innovative fusion of diverse components for high-performing microelectronics. The goal is to develop hybrid materials and semiconductors to reduce size, weight, power, and cost (SWaP-C) for microelectronics that will revolutionize sensor design and add value on high performance and functionality. The development of these components will feed into technologies that will provide rapid response times as well as reduce the burden to the General Forces by lowering the SWaP-C.
***For details and full RFI, please see the attachment associated with this announcement***
Update #1 ·
THIS IS A REQUEST FOR INFORMATION (RFI) ONLY to identify microelectronic materials that can provide low size, weight, power, and cost. The information provided in the RFI is subject to change and is not binding on the Government. The Defense Threat Reduction Agency has not made a commitment to procure any of the items discussed, and release of this RFI should not be construed as such a commitment or as authorization to incur cost for which reimbursement would be required or sought. All submissions become Government property and will not be returned. Respondents shall provide a brief description on how they plan to develop or advance existing technologies/sensing materials for the identified applications as well as any anticipated technical parameters of their product (or conceptual product). Validation can include historical, literature data or relationship with current DOD researchers. Validation can also include investment from interagency past programs.
The Defense Threat Reduction Agency, Research and Development, Chemical and Biological Technologies directorate (DTRA RD-CB) in support of the Joint Program Executive Office for Chemical, Biological, Radiological, Nuclear Defense (JPEO-CBRND) is seeking information on innovative fusion of diverse components for high-performing microelectronics. The goal is to develop hybrid materials and semiconductors to reduce size, weight, power, and cost (SWaP-C) for microelectronics that will revolutionize sensor design and add value on high performance and functionality. The development of these components will feed into technologies that will provide rapid response times as well as reduce the burden to the General Forces by lowering the SWaP-C.
***For details and full RFI, please see the attachment associated with this announcement***
Files
| File | Type | Posted |
|---|---|---|
| Microelectronics_RFI_Final.pdf |
Similar open opportunities
| Opportunity | Agency | Set-aside | Responses due |
|---|---|---|---|
| Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies | Department of Energy | No set-aside |
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