Microelectronics_RFI_Final.pdf

APPROVED FOR PUBLIC RELEASE

REQUEST FOR INFORMATION

[The DEFENSE THREAT REDUCTION AGENCY (DTRA) RESEARCH AND DEVELOPMENT DIRECTORATE (RD)

CHEMICAL AND BIOLOGICAL TECHNOLOGIES DIRECTORATE]

Approved for Public Release, Distribution Unlimited.

1.0 Description

The Defense Threat Reduction Agency, Research and Development, Chemical and Biological Technologies directorate (DTRA RD-CB) in support of the Joint Program Executive Office for Chemical, Biological, Radiological, Nuclear Defense (JPEO-CBRND) is seeking information on innovative fusion of diverse components for high-performing microelectronics. The goal is to develop hybrid materials and semiconductors to reduce size, weight, power, and cost (SWaP-C) for microelectronics that will revolutionize sensor design and add value on high performance and functionality. The development of these components will feed into technologies that will provide rapid response times as well as reduce the burden to the General Forces by lowering the SWaP-C.

Technologies of interest include new or significantly improved 2D material capabilities. Flexible materials that replace traditional chips or components are of high interest. Materials may have semi-conductive properties with the intention to replace traditionally rigid printed circuit boards (PCBs) and their traces; this includes but is not limited to conductive biomaterials and microelectronics. The desired flexible technology may be wearable or woven into materials or clothing.

Vertical integration of stackable materials that promote performance gains are of high interest. This may include 3D stacking of materials to increase efficiency. Agile chips, components, and materials must be robust and be able to withstand heat. All circuitries should be minimal in SWaP-C, be buildable into high-performing microelectronics, and feed into rapid prototyping. Technological efforts should result in microsensors that may be deployed into platforms or embedded in textiles suitable for tactical utility.

Material sensors may be a system of systems, one device/technology, or many kits. The resulting capability must be easy to use with minimal steps and have simple interpretation of results. The materials technologies are expected to need additional S&T development before advanced development. Partial solutions are accepted and encouraged.

Preferred characteristics of proposed material sensors:

• Sustainability in adverse environmental conditions o Temperatures from -30°C to 50°C o 10-95% Relative Humidity (RH)

• Ruggedization and robustness for deployment, i.e., ability to assess under MIL-STD-810H parameters

• Flexibility to be integrated into textiles

• Integration with microsensors and innovative circuitry

• Low SWaP-C

Responders must communicate a solid understanding of material limitations in performance and additional strengths and weaknesses it may offer. Environmental challenges, such as humidity, and heat dissipation must be understood in order to meet requirements. Responders should be able to compare their technology to the current state of the art to demonstrate innovation. Responders must consider the potential to scale up production.

THIS IS A REQUEST FOR INFORMATION (RFI) ONLY to identify microelectronic materials that can provide low size, weight, power, and cost. The information provided in the RFI is subject to change and is not binding on the Government. The Defense Threat Reduction Agency has not made a commitment to procure any of the items discussed, and release of this RFI should not be construed as such a commitment or as authorization to incur cost for which reimbursement would be required or sought. All submissions become Government property and will not be returned. Respondents shall provide a brief description on how they plan to develop or advance existing technologies/sensing materials for the identified applications as well as any anticipated technical parameters of their product (or conceptual product). Validation can include historical, literature data or relationship with current DOD researchers. Validation can also include investment from interagency past programs.

2.0 Background

The Department of War (DoW) seeks a path to develop innovative, low SWaP-C microsensors embedded into textiles for rapid prototyping. Current materials for PCBs are hard and pose challenges to sensors, such as heat dissipation, inflexibility, miniaturization, etc. The DoW is interested in exploring flexible materials with conducive properties to ultimately integrate into microsensors and their deployed platforms or textiles supporting the General Forces. The goal of this effort is to integrate supportive, lowered SWaP-C components in sensor designs that will reduce the burden of the General Forces.

3.0 Requested Information

THIS IS A REQUEST FOR INFORMATION (RFI) ONLY. This RFI is issued solely for information and planning purposes – it does not constitute a Request for Proposal (RFP)/Request for Prototype Proposals (RPP) or a promise to issue an RFP/RPP in the future. This request for information does not commit the Government to contract for any supply or service whatsoever. T he Defense Threat Reduction Agency is not currently seeking proposals. Responders are advised that the U.S. Government will not pay for any information or administrative costs incurred in response to this RFI; all costs associated with responding to this RFI will be solely at the interested party’s expense. Not responding to this RFI does not preclude participation in any future RFP/RPP, if any is issued. The information shall be emailed to the Program Manager, Dr. Jennifer Soliz (jennifer.r.soliz.civ@mail.mil), and Contract Support POC, Ms. Beth Jensen at beth.t.jensen.ctr@mail.mil. Hard copy submissions will not be accepted.

4.0 Responses

4.1 Submit a white paper (5-page limit) and a PowerPoint presentation (10-slide limit) addressing concept awareness and the preferred characteristics of the material sensors (Section 1.0 on page 1) as well as any additional information the respondent deems appropriate. A rough order of magnitude (ROM) cost estimate for the services outlined above over a 1–3-year period for further S&T development and a 3–4 year projected advanced development shall be provided.

4.2 White papers in Microsoft Word compatible format are due no later than January 26, 2026 at 1700, EST.

Responses shall be limited to five pages and submitted via e-mail only to the Program Manager, Dr. Jennifer Soliz (jennifer.r.soliz.civ@mail.mil) and Contractor Support POC Ms. Beth Jensen at beth.t.jensen.ctr@mail.mil.

Proprietary information, if any, should be minimized and MUST BE CLEARLY MARKED. To aid the Government, please segregate proprietary information. Please be advised that all submissions become Government property and will not be returned.

4.3 Section 1 of the white paper shall provide administrative information and shall include the following at a minimum:

4.3.1 Name, mailing address, overnight delivery address (if different from mailing address), phone number, mailto:jennifer.r.soliz.civ@mail.mil mailto:beth.t.jensen.ctr@mail.mil mailto:jennifer.r.soliz.civ@mail.mil mailto:beth.t.jensen.ctr@mail.mil.

fax number, and e-mail of designated point of contact.

4.3.2 Business type (large business, small business, very small business, veteran-owned small business, service-disabled veteran-owned small business) based upon North American Industry Classification System (NAICS) code 541512, Computer Systems Design Services. “Small business concern” means a concern, including its affiliates that is independently owned and operated, not dominant in the field of operation in which it is bidding on Government contracts, and qualified as a small business under the criteria and size standards in 13 CFR part 121.

4.3.3 The number of pages in Section 1 of the white paper shall not be included in the 5-page limitation, i.e., the 5-page limitation applies only to Section 2 of the white paper and one 10-page PowerPoint presentation.

5.0 Industry Discussions

DTRA representatives will not be meeting with potential offerors while the RFI is posted; however we plan to support discussions with industry following this RFI.

1 Questions

DTRA is accepting questions regarding this notice and will provide a collective response during Industry Day. The questions will be used to develop more information and receive input from industry regarding this system. The notice is strictly a request for capability packages. If a formal RFP/RPP is issued as result of this notice, Q&A may be allowed at that time. Contractor POC Ms. Beth Jensen (beth.t.jensen.ctr@mail.mil) and Government POC Dr. Jennifer Soliz (jennifer.r.soliz.civ@mail.mil).

mailto:beth.t.jensen.ctr@mail.mil mailto:jennifer.r.soliz.civ@mail.mil