GVSC E-Vetronics High-Performance Computing Module RFI

Closed Pre-Solicitation Posted

Solicitation number
W912CH_E-Vetronics_HPCM_RFI
Agency
Responses due
Set-aside
No set-aside

Opportunity facts

Place of performance
Michigan 48092, United States

Notice details come from SAM.gov. Updated .

About this opportunity

Paragraph 1:

The U.S. Army Contracting Command - Detroit Arsenal (ACC-DTA), in conjunction with the U.S. Army's Combat Capabilities Development Command Ground Vehicle Systems Center (DEVCOM GVSC) Vehicle Electronics and Architecture (VEA), is issuing a Request for Information (RFI) for the procurement of a High-Performance Computing Module (HPCM) solution for U.S. Army Ground Combat Vehicles. The HPCM is a computing device that balances edge computing and centralized computing needs. The goal is to find an equilibrium balance to support fused sensor data and enable additional capabilities such as Aided Target Detection/Recognition, Automated Lethality, Survivability, and Defense. The U.S. Army is interested in understanding the availability, capabilities, and integration challenges of products from manufacturers in both processor and processing technologies. Responses are requested by 3:00 pm Eastern Standard Time on September 11, 2024.

Paragraph 2:

This RFI is not a set-aside procurement and has no specified incumbents or current contractors. The U.S. Government will not pay or reimburse any costs incurred by companies responding to this RFI, and no prototype project will be awarded. The information gathered through this RFI, along with other market investigation data, is solely intended for use by the U.S. Army and will not be shared with any company.

Notice text

Description of Intent:

The U.S. Army Contracting Command - Detroit Arsenal (ACC-DTA), in conjunction with U.S. Army’s Combat Capabilities Development Command Ground Vehicle Systems Center (DEVCOM GVSC) Vehicle Electronics and Architecture (VEA), is issuing a Request for Information (RFI) for the procurement of a High-Performance Computing Module (HPCM) solution for U.S. Army Ground Combat Vehicles. A HPCM is a computing device that balances edge computing and centralized computing.  GVSC - VEA is requesting information on all potential High-Performance Computing processor chip solutions that address HPCMs. However VEA is not soliciting enterprise HPCM solutions at this time.

Current U.S. Army Ground Combat vehicles intend to make use of emerging technologies to balance edge and centralized computing. These needs are based upon new features and capabilities to support fused sensor data with enough processing capacity to support additional capabilities including, but not limited to, Aided Target Detection/Recognition (AiTDR), Automated Lethality, Survivability, and Defense. ​ The goal is to take current algorithms for these technologies as well as Artificial Intelligence/Machine Learning (AI/ML) capabilities and evaluate them for true processing needs.​

The objective of this RFI is to better understand the availability and capabilities of products and the potential of manufacturers in both processor and processing technologies as well as gaining an understanding of total package integration challenges. The goal is to find that equilibrium balance of edge and centralized computing. The information gathered by the U.S. Army through this RFI, along with other market investigation data, is solely intended for use by the U.S. Army and will not be shared with any company. Participation in this RFI provides an important opportunity to influence the U.S. Army’s approach to procuring the HPCM solution for U.S. Army Ground Combat Vehicles. The U.S. Government is in no way liable to pay for or reimburse any companies or entities that respond to this announcement. Any costs incurred by interested companies in response to this announcement will NOT be reimbursed. This is a RFI ONLY and is not a solicitation for proposals; therefore, no questions will be taken at this time. A prototype project will not be awarded in response to this announcement.

Files

File Type Posted
E-Vetronics Phase II RFI 9 August 2024.pdf PDF

Similar open opportunities

Opportunity Agency Set-aside Responses due
Vendor Qualification Additive Manufacturing Processes Michigan 48092, United States Department of the Army No set-aside

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