11-1-9404-PCB_Specification_Update.pdf

PCB SPECIFICATION:

Overall dimensions: 1.800”x 3.000”x0.085” rectangular shape 4 layers: 2 signal, 2 planes 2oz copper on all layers.

1 Sided PCB: All Components and Silk Screen are on the top Layer.

Solder Mask on top and bottom.

Smallest Hole: 12mil Design rules: 10mil trace, 5mil space RoHS Compliant

PROCESS REQUIREMENTS:

1. Manufacture per IPC-6012B and this specification.

2. Electrical test each PCB per IPC-9252 Class 3. Exceptions require approval. Test mark required as an indication that the PCB has been tested.

3. Modify the artwork such that the vendor ID or Logo and lot date code appear in copper on the bottom layer of the PCB. All added marks shall be 0.080” from any original copper feature. Contact purchaser for alternate location.

4. Modify the artwork to provide the “94V-0” mark in copper on the bottom layer of the PCB. All added marks shall be 0.080” from any original copper feature. Contact purchaser for alternate location.

5. The artwork shall contain a country of manufacture using a phrase such as “PCB MADE IN USA”.

6. The vendor may add tooling holes upon purchaser approval.

7. The vendor may add addition copper upon purchaser approval. Added copper shall be a minimum of 0.080” from original copper features.

8. Breakaway holes shall not be plated.

9. Panelization of the design is at the discretion of the vendor.

10. Markings per IPC-1066:

Lead Free – The words “PB FREE” or the associated symbol shall be marked on the PCB.

Silk Screen – White in color, Font: San Serif; SICW legible with unmagnified vision.

PHYSICAL CHARACTERISTICS: (Units measured in Inches unless otherwise noted)

1 Design Rules: 0.010” minimum trace, 0.005” minimum space 2 Number of copper layers: 4 3 Finished copper weight: 2 oz minimum, All layers 4 Dielectric Constant 4.8 5 PCB Laminate In compliance with RoHS Directive 2002/95/EC 6 Material FR4 or equivalent. In compliance with RoHS Directive

2002/95/EC

7 Smallest hole: 0.012” 8 Board Thickness 0.085” +/- 8% 9 Plating Gold plating 10 Via Plating Via wall thickness 0.001” minimum and may be plated shut.

11 Solder Mask IPC-SM-840C Class T green LP1 12 Silk Screen White, allowed over vias

SPECIAL INFORMATION AND CAUTIONS:

1. Dielectric isolation between adjacent plane layers must be 250V or greater.

2. Stackup Detail:

Figure 1: PCB Stackup

ASSOCIATED REFERENCE MATERIALS:

IPC-A-600G Acceptability of Printed Circuit Boards.

IPC-4101B Specification for Base Material for Rigid and Multilayer PCBs.

IPC-SM-840C Amend 1 Qualification and performance of Permanent Solder Mask.

IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG).

IPC-6012B Qualification and Performance Spec for Rigid PCBs.

IPC-9252 Guide and Requirements for Electrical Testing of Unpopulated PCBs.

Directive 2002/95/EC Restriction on the use of certain hazardous substances in Electrical and

Electronic Equipment (RoHS) UL796F Printed-Wiring Boards.

IPC-1066 Marking symbols, and labels for Identification of Lead Free and other reportable materials in Lead Free assemblies, components and devices

ASSEMBLY SPECIFICATION:

1. The assembled product shall be built and inspected to IPC-A-610 Class 2 specifications.

2. For component orientation: The keying features on the silkscreen should always align with the keying features on the part. If there is any confusion or uncertainly about the orientation of a part, or where pin 1 is located, contact purchaser for clarification.

3. Location J4, J5, J6, J8 shall be assembled with cable assemblies made by the contract manufacture based on drawings supplied by purchaser.

4. Location TH1 shall be assembled per the BOM.

5. Location J3, J7, U2A, D4, D5 shall not be populated.

6. Location U2 is a bi-color LED and is show with exaggerated colors.