R2.0_SS_RFI_SUBMISSION_v1.2.pdf

Approved for Public Release

DISTRIBUTION STATEMENT A. Approved for public release: distribution is unlimited.

RFI –Secure Packaged

Microelectronic Components, Printed

Circuit Boards, and Supporting

Technologies

This Request for Information (RFI) is issued solely for information and planning purposes. This is not a solicitation. In accordance with FAR 15.201(e), the US Government (USG) seeks technical, price, delivery, other market information, or capabilities for planning purposes to inform potential future solicitation opportunities. Responses to this RFI are not offers and cannot be accepted by the USG to form a binding contract. All information received in response to this RFI that is marked as proprietary will be handled accordingly. Responders are solely responsible for all expenses associated with responding to this RFI. Based on the results of this RFI, the USG may seek to establish Other Transaction Agreements (OTAs) or other procurement opportunities related to this RFI. (See also FAR Part 10 for market research policy.)

Q&A and Equal Information: Questions should be submitted through the Procurement Integrated

Enterprise Environment (PIEE) Solicitation Module at https://piee.eb.mil no later than seven days before the submission deadline of this RFI. To ensure fairness and equal information, the USG will post non‑proprietary Q&A updates to this RFI as appropriate.

Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of

Defense (DoD). This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas:

1. Board-level Security: Capabilities spanning microelectronic components and portable soft

IP integrated with commercial-off-the-shelf (COTS) devices across modular open systems architectures (MOSA) form factor systems (e.g., 3U/6U OpenVPX/SOSA, 3U/6U

SpaceVPX, VNX, and smaller).

2. Package Security: Specialized microelectronics packaging configurations or designs for multi-chip modules (MCMs) or systems-in-package (SIPs) which utilize COTS or bespoke security components that are intended to provide additional security to underlying components.

3. Enhanced Secure Boot: Portable soft IP that can be used in conjunction with COTS microelectronic components to provide additional security for enhanced secure boot applications.

4. Secure Components: Purpose-designed microelectronic components (chiplets, ASICs, etc.) that are intended to provide enhanced trust/security for co-packaged microelectronic components.

5. Multi-chip Packaging: Advanced microelectronics packaging techniques that inherently provide additional component security or could be easily adapted to provide additional microelectronic component security.

6. Emerging Technologies: Novel techniques, materials, and processes that are compatible with modern microelectronic manufacturing/packaging methods that can provide additional security to packaged microelectronic components.

7. Other: Technologies, methods, and processes not mentioned above that are compatible with modern microelectronic design, manufacturing, and packaging techniques and able to provide enhanced security to packaged microelectronic components.

Technologies of interest to the USG would meet some or all of the following criteria, as applicable:

1. A current technology readiness level (TRL) of 4 with a clearly understood technical path to mature the TRL to 6 and beyond. Here, TRL is defined by the February 2025 release of the DoD’s Technology Readiness Assessment Guidebook.

2. Compatibility with domestically available, industry standard microelectronic design, fabrication, and packaging processes. The USG prefers that potential performers leverage previous USG investments related to enhanced microelectronics security.

3. Robust performance in operational environments encountered by DoD systems (see, for example, JESD22-A104F, JESD22-A101, JESD-B103, and others).

To improve comparability between responses, responders are asked to structure their response as follows:

1. Cover Page: A single page that includes, at a minimum, the following information:

• RFI Reference number: W52P1J26R0001

• Company Name and Parent Company (If Applicable)

• Business Address: Street, City, State, and Zip Code

• Commercial and Government Entity (CAGE) Code

• Unique Entity Identifier (UEI)

• Information for a point-of-contact (POC) who can discuss the submitted material

(to include name, position, phone number, and email address).

• Whether or not the responder (or performers on the responding team) meets the definition of a Non-traditional Defense Contractor (NDC) as defined in 10 U.S.C.

§ 3014.

2. Technology Area(s) Addressed: Clearly state which of the seven listed Technology

Areas the described solution(s) best align with. If describing multiple solutions, please list which solutions align with which Technology Area(s).

3. Technical Description: Please describe how the solution(s) meet(s) the needs of the addressed Technology Area(s). Where possible, please provide design or test data to validate any performance claims. Clearly identify any proprietary data in the response.

Clearly marked proprietary data will be handled appropriately. Please state the current TRL of any described solutions in this section.

4. Manufacturing Compatibility: As applicable, please describe how the solution(s) are compatible with current and near-future domestically available microelectronic design, fabrication, and packaging techniques. For reference, please refer to the IEEE

Heterogeneous Integration Roadmap and the International Roadmap for Devices and

Systems for context regarding anticipated near-future industry capability. Please provide specific emphasis on compatibility with domestic manufacturing capability and advanced packaging techniques.

For soft IP-based solutions, please describe compatibility with existing target platforms

(FPGA families, COTS microprocessors, etc.)

5. Capability Statement: Provide a brief overview of the company/companies involved in the development of the described solution(s). This should include a brief company profile

(including facility clearance level, if any) and clearly indicate experience, assets, background, and ability to successfully develop the solution(s). Please provide any specific experience from previous efforts that is clearly related to the solution(s) being described.

This should include a brief description of the work performed, the dollar value of the effort, and the contract number, if applicable.

6. Data/IP Rights: The USG is seeking transparency to inform downstream acquisition planning (FAR Part 27, DFARS 227.7103‑3, and 227.7203‑3 encourage early identification of deliverables subject to restrictions). This RFI does not require respondents to grant particular rights at this stage; rather, the USG requests clarity on the anticipated license scope, markings, and any special terms the respondent would offer for any described solution(s). For any described solution(s) that are presently covered by SBIR/STTR data rights, please note the data rights protection period in the response.

7. Cost and Schedule: To inform planning and budgeting, the USG requests best effort, non-binding Cost and Schedule information. This RFI is a market research tool, therefore responses are not offers, will not be accepted to form a binding contract, and will be used only for planning purposes (see FAR 15.201(e)).

Please provide ROM pricing, acknowledging that emerging solutions may not yet have firm cost baselines. The USG understands that emerging or developmental solutions may lack precise pricing. Therefore, estimates, ranges, and assumptions are encouraged at this stage for future planning purposes. This RFI does not require certified cost or pricing data, is not considered binding, and is intended solely for market research. Where appropriate, provide price ranges and clearly state assumptions. At a minimum, please address:

• Unit cost rough order of magnitude (ROM) at Low Rate Initial Production (LRIP) quantities and any anticipated cost advantages and economies of scale at Full Rate

Production (FRP). Assume indicative quantities for the technology being developed during each phase of production.

• Nonrecurring engineering (NRE) costs along with a high-level breakdown of major cost drivers (manufacturing costs, design costs, testing costs, etc.).

• Any licensing or IP related costs tied to data rights (if applicable) both during active development and those that are anticipated at LRIP and FRP scales. Desired information includes anticipated licensing structures and costs at suitable unit quantities for the technology being developed (e.g., costs/license fees at 10, 100, 1000, 5000 units, etc.).

• A brief go-to-market strategy for the solution(s) being described. This should include product/market fit and any clear demand signals from anticipated end users. The

USG is particularly interested in solutions that utilize teaming relationships within existing microelectronics industrial manufacturing capability and/or solutions that leverage previous USG investments.

• Any assumptions and exclusions to provided pricing information.

Please provide a best-effort development schedule for key phases (design, build, test, delivery, etc.). Note uncertainties for emerging/developmental solutions. If firm dates are not available, please provide calendar windows (weeks, months, etc.) and note key schedule drivers and assumptions.

To aid analysis, link ROM cost and schedule to the technical content of your response

(materials, design, development, test plans, etc.). Use quantitative ranges and plain-language assumptions wherever possible.

Anticipated OTA Pathway: Based on RFI results, the USG may seek to develop a competitive prototype OTA topic for solicitation at a later date under 10 U.S.C. 4022. OTAs relieve some of the contractual burdens typically placed on contractors working for federal clients, making it possible for non-traditional contractors to participate in technology development. The Other Transaction

(OT) consortium model is an “enterprise partnership” between the government and technology providers in a specific domain. The OT consortium model relieves some of the contractual burdens typically placed on contractors working for federal clients.

Sensitive Information and Access Controls: If any materials pertaining to this RFI includes

Controlled Unclassified Information (CUI) or export‑controlled technical data, the USG will not post them publicly. Access to any such information will be limited to eligible entities via controlled attachments. For any export‑controlled technical data, requesters may be required to have JCP

(DD Form 2345) certification. All CUI will be properly marked and must be safeguarded per 32 CFR

Part 2002 and DoDI 5200.48; recipients shall acknowledge DFARS 252.204‑7012/NIST SP

800‑171 obligations when applicable.

Participation: Small businesses and non-traditional contractors are strongly encouraged to respond. Teaming is welcome. If a team submits, identify a lead, provide a single POC, list members with role/CAGE/UEI, and submit a consolidated ROM and integrated schedule in accordance with the Cost and Schedule guidance described above.

One‑on‑Ones: The USG may request to schedule a site visit of the vendor’s facility or a follow-up one-on-one session to validate TRL and production capabilities, as well as to engage in further discussion of the solution(s) described in a vendor’s response.

Submission Guidelines: Please provide only one response per vendor/vendor team and limit all responses to a 10-page maximum length (excluding a cover page). All responses should use an 11 pt font or greater (including captions and figures) and 1” margins or greater. PDF submissions are required.

1. Submission Method and Deadline (PIEE Only): Responses must be submitted through the Procurement Integrated Enterprise Environment (PIEE) Solicitation Module. Email, DoD SAFE, or any other transmission method will not be accepted.

2. Response Deadline: No later than Wednesday, September 16, 2026, at 5:00 PM

Central Daylight Time (CDT).

3. How to Submit in PIEE:

• Register/Role: Vendors shall register at https://piee.eb.mil and request the SOL –

Proposal Manager role. Your company’s Contractor Administrator (CAM) must approve/activate this role before submission.

• Find the Notice: After login, open Solicitation Search and locate this notice by W52P1J26R0001.

• Create Offer/Response: Select Create Offer/Response, complete cover fields, and upload your files in accordance with the submission formatting and content deadlines described above.

• File Handling: PIEE supports large attachments (up to ~1.9 GB per file; no limit on number of files). Do not upload .zip files. Please submit PDFs.

• Confirmation: Click Submit. PIEE will display an electronic date/time stamp confirming receipt. Save/print the confirmation for your records.

4. Markings and Data Handling:

• Proprietary/Competition-Sensitive: Clearly mark any proprietary or confidential information.

• CUI: If your submission contains Controlled Unclassified Information (CUI), mark each page header/footer as follows: Controlled Unclassified Information (CUI), Releasable to Government Agencies for Evaluation Purposes Only. Upload CUI only via the PIEE

Solicitation Module; do not email CUI.

• Classified material SHALL NOT be submitted.

5. Questions (Q&A in PIEE):

• All questions shall be submitted through the PIEE Notice Q&A for this posting.

Government answers will be posted to the notice and visible to all interested parties.

• Do not include proprietary or business-sensitive details in public Q&A. Put such information in your submission attachments (properly marked) rather than Q&A.

Government Review and Use: Responses to this RFI may be reviewed by Government personnel and authorized non-Government support contractors assisting the Government with market research, technical review, or acquisition planning. Submission of a response constitutes consent to such review. Support contractors will be bound by appropriate non-disclosure and organizational conflict of interest obligations and may use the information only to support the Government.

Respondents shall clearly mark any proprietary, confidential, or competition-sensitive information submitted as part of their response.

Late or Non-Conforming Submissions: Responses that fail to comply with the above instructions or present ideas not pertinent to the subject may not be reviewed. Responses submitted after the posted due date and time will not be considered unless determined to be in the best interest of the

USG. The USG is under no obligation to provide responses or comments to submitted responses, but additional information may be requested after review.