NOI-Scope.docx

Notice of Intent to Sole Source for FIB-SEM Electron Optics

(NIH-SS-6388556)

The National Institutes of Health intends to award a Firm-Fixed-Price purchase order to Tescan USA, UEI - LLMSCX34X9M6.

In accordance with FAR Part 6.302-1, the Contractor is the only known responsible source who can provide the FIB-SEM. No other source has been identified who can provide the requirement listed below.

FIB-SEM Specifications

Room and Utility Requirements

· Must fit in a 312.5 cm x 286 cm (10.2’ x 9.4’) room

· Must operate to specifications without requiring space or plumbing for a water chiller

· Must use 120V, single-phase power source

SEM Electron Optics Electron column:

· consist of a four-lens wide field electron optical design with dedicated imaging/scanning modes for high-resolution imaging and enhanced depth of focus

· incorporates a full-column-length electrostatic acceleration tube capable of boosting electron energy by at least 8 keV

· incorporates a non-immersion (field-free) hybrid electrostatic-magnetic objective lens

· includes constant power dissipation over the full focal length range of the lenses to ensure high stability without requiring a water chiller

· include a Schottky field electron emitter with an expected lifetime minimum 2 years

Electron Landing Energy:

· range of at least 50 eV to 30 keV, without requiring stage bias beam deceleration

· adjustable in 10 eV steps or better over the full operating range

· includes a beam deceleration mode that allows electron landing energies of less than 50 eV Electron Beam Resolution to meet or exceed

· 1.5 nm at 1 keV (field-free)

· 0.9 nm at 15 keV (field-free)

· 0.8 nm at 30 keV STEM (field-free)

· 1.8nm at 30keV and 3.0nm at 3keV in Low Vacuum mode used with Gaseous Secondary Detector Magnification Range:

· continuous zoom magnification control (not discrete steps)

· minimum magnification range of 2x to 2,000,000x (referenced to a 127 mm wide image size) Field of View (FOV):

· capable of scanning a FOV ≥ 7 mm at a working distance of 6 mm

· at least 50 mm maximum FOV at the longest sample working distance Probe Current:

· allow continuous control of probe current to the sample from 2 pA to 400 nA

· allow user to specify the desired probe current in amperes (e.g. nA, pA)

· integrated picoammeter that continuously displays beam current on the graphical user interface

· stability is equal to or better than ±0.25 % per hour over periods of at least 12 hours as required for long-term automated data collection Beam Optimization:

· automatic and continuous optimization of the beam aperture at all operating conditions using electromagnetic aperture control or an equivalent technology to ensure the smallest spot size is achieved at all beam currents

FIB Ion Optics

· Gallium liquid metal ion source, minimum lifetime 3000 μAh guaranteed

· Electrostatic beam blanker with integrated Faraday cup

· Ion beam energy range: 500 eV–30 keV

· Probe current: < 1 pA–100 nA

· ion beam resolution of at least 2.5 nm at 30 keV

· capable of scanning a FOV ≥ 1 mm at 10 keV and at the FIB-SEM coincidence point

· fitted with piezo motor driven aperture strip that contains ≥30 apertures of varied or customized sizes whose positions can be saved

FIB-SEM Geometry and Specimen Stage FIB-SEM Coincidence Point:

· Coincidence SEM working distance: 6 mm

· Coincidence angle of 55° Stage Design and Movements:

· motorized, 5-Axis stage with minimum movements: X ≥ 130 mm, Y ≥ 130 mm, Z ≥ 90 mm, 360° continuous rotation, bi-directional tilting of at least -60° to +90°

· true, mechanically eucentric stage such that X, Y, and rotation movements all take place in the plane of tilt at any stage height Imaging Area:

· The stage allows full imaging coverage of samples 180 mm diameter or larger at any magnification

· accommodate samples 90 mm tall and 1 kg (or greater) with all stage movements

· accommodate samples 8 kg or more using XYZ stage movements Stage Precision:

· better than 2µm positioning precision and repeatability using vacuum-compatible stepper motors directly coupled to the XY ball screw drives (or superior technology)

· No external motors with vacuum feedthroughs or expanding universal couplers shall be used

Specimen Chamber Dimensions:

· 340 mm minimum width, 315 nm depth minimum

· accommodate sample sizes up to 280 mm x 335 mm

· optional chamber extension frames available for full imaging coverage of samples up to 8” in diameter at any magnification using a combination of XYR movements Vibration Isolation:

· includes an integrated, active vibration cancellation system effective even at low frequencies (< 2 Hz)

· able to accommodate the weight of optional future accessories Additional Components:

· chamber camera for optical navigation and correlation

· infrared chamber TV camera

· chamber camera for optical navigation and correlation

· Integrated plasma cleaner for decontaminator

· a retractable, single line gas injection system with platinum standard

· fully integrated XYZ nanomanipulator with position feedback

Vacuum System Vacuum Gauges:

· independent gauges for measuring electron gun, column and chamber pressures

· graphical user interface for monitoring gun, column and chamber pressures independently and continuously in user-specified units such as Pa, Torr, mbar UHV Column/Gun Pumping:

· high vacuum under 9x10-3 Pa

· all oil-free pumps

· independent pumping of the electron gun and upper column

· automatic isolation valves in the column/gun and vacuum manifold

· uses a hybrid NEG (Non-Evaporable Getter) ion pump to ensure that the Schottky gun and source remain under UHV for long periods of time during power failures (holding vacuum for at least several days)

FIB-SEM Control and Hardware

· independent scanning systems for SEM and FIB

· the control PC should interface to the FIB-SEM using a single standard interface (such as Ethernet cable) for all imaging and control functions

· to ease of PC upgrading or replacement, the FIB-SEM control PC should not require the use of any dedicated or proprietary graphics, communications, or scanning boards installed in the PC.

· standard 16-bit scan generator

· standard 16 k x 16 k image store

Included Automated and Semi-Automated Routines

· SEM and FIB emission control

· electron gun and column alignment

· contrast and brightness, autofocus

· electron beam spot optimization

· ion beam spot profile optimization

· FIB-SEM intersection finder

· gas injection system nozzle positioning and temperature control

Scanning and Imaging

· split screen imaging for live display of at least 6 independent detector signals

· include a wide field mode (ultra-low magnification “macro” imaging)

· scanning dwell speeds adjustable from 20 ns to 10 ms per pixel

· include dynamic focus

· include drift-corrected frame accumulation

· include image shift, scan rotation, and tilt correction

· acquisition of digital images with at least 16-bit pixel depth (signal dynamic range)

· image/Beam shift of at least 200 microns in both X and Y (simultaneously)

· support for popular image formats, at minimum TIFF, PNG, BMP, JPEG and GIF

Digital Image Acquisition

· includes inputs for at least 12 signals

· supports at least 20 independent signals (imaging detectors inputs)

· allows at least 6 signals to be imaged and displayed simultaneously

· allows acquisition of digital images at user-selectable resolutions through at least 16,384 x 16,384 pixels with user-selectable image aspect ratios

Microscope Diagnostics, Monitoring, and Logging

· hardware diagnostics system that covers all SEM subsystems

· automatic loging of events, faults, errors, and unusual operating conditions or user settings

· instrument status window monitoring the current state of the microscope and software

· displays for a status summary, consumables usage, vacuum system, SEM and FIB subsystems, detectors, remote access, and similarly useful information

· All faults, errors, or issues will be prominently displayed including a date, description, and guided problem resolution

· monthly history logs and session logs

· allow monitoring of each user account’s instrument access and use

· project manager software for tracking specific projects and time devoted to each

· allow retrieval of all system log files and microscope environment files via download or email, e.g. to share to the service organization for review and diagnosis

3D Modeling and Collision Avoidance

· includes a 3D modeling capability that allows users to view an accurate and dynamic real-time simulation of the chamber interior, specimen, stage, final lens, and all detectors and accessories (including 3rd party accessories)

· 3D model should show an accurate representation of the sample based on user-specified dimensions and prevent collisions through active warnings and interlocks

Detectors Low Energy Backscattered Electron (LE-BSE) Detector:

· in chamber with integrated shutter for detector protection

· incorporating an annular, single crystal scintillator

· sensitive to 200eV or less with a response time less than 100ns allowing operation at both TV and slow scan rates

· motorized, continuously retractable for positioning the detector continuously at any position along the full travel distance

· must use a stainless-steel bellows mechanism, not sliding O-rings Retractable HADF-STEM Detector

· for simultaneous bright-field (BF), dark-field (DF), and high angle dark-field (HADF) imaging Gaseous Secondary Detector

· for collection of secondary electrons in variable pressure mode Secondary Ion Detector

· dedicated secondary ion detector for FIB imaging

· allows simultaneous ion induced secondary electron and secondary ion imaging.

In-Lens/Column Secondary Electron Detector

· operating over the full accelerating voltage range of the FIB-SEM In-Lens/Column Axial Detector

· annular detector positioned symmetrically on the beam axis

· allows efficient collection and detection of axial electrons (with trajectories close to the primary beam axis) emitted from samples positioned at short working distance (for high resolution BSE imaging)

· user selectable collection of axial SE or axial BSE signal

· operates over the full accelerating voltage range of the FIB-SEM

Minimum Two-Year Warranty

This notice is not a request for competitive quotes. Tescan USA is the manufacturer. Only the FIB – SEM manufacturer can provide the FIB – SEM Electron Optics . However, any available small businesses (e.g., 8(a), service-disabled veteran owned small business, HUBZone small business, small disadvantaged business, veteran-owned small business, and women-owned small business) as stated herein may submit a written capability statement that clearly supports and demonstrates their ability to perform the requirement. A determination by the Government to compete this proposed award based upon responses to this notice is solely within the discretion of the Government.

It is anticipated that an award will be issued approximately ten (10) days after the date of this notice unless the Government determines that another organization has the capability to meet this requirement.

Please email responses to Lynda.Cole@nih.gov no later than 12:00 p.m. EST on Monday, August 22, 2022.