SOW_19-9G2_IBM_Redacted_23Sep19.pdf

STATEMENT OF WORK (SOW)

DMEA 19-9G2

10 September 2019

Project Engineer:

1.0 SCOPE:

1.1 TITLE: 9LPC4ATC Multi Project Wafer (MPW) Packaging

1.2 APPLICABILITY: The 9LP Assembly Test Chip (ATC) packaging is to provide a test vehicle for evaluating flip chip Advanced Packaging technology including design and manufacturing process. This will enable new product development at DMEA adding more capability to support package design capabilities.

1.3 BACKGROUND: DMEA is in the process of enabling XXXX capability by the end of 2021. To enable the new

Advanced Packaging technology at DMEA, substrates are required to prove capability concept using various stress and manufacturing test.

1.4 PURPOSE: The purpose of this effort is to procure substrates for 9LP MPW run to evaluate flip chip packaging at DMEA.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: None

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title

130836 9/07/2018 Package Design Rule Document (PDRD)

130773 04/18/2019 9LP MPW Wafer Map

3.0 REQUIREMENTS:

Design, validate, and manufacture packages using PDRD Document No. 130836

3.1 TASK REQUIREMENTS:

3.1.1 LAMINATE DESIGN:

3.1.1.1 PDRD Rev 0.0: The contractor shall design a 9LPC4ATC package that fulfills the requirements and conforms to the specification listed in the PDRD Document No. 130836. [Note: DMEA will provide the contractor design collaterals containing 9LPC4 die file.] The design format to be in the Cadence Allegro BRD format (.brd).

The design shall consist of package footprint, 9LPATC die symbol placed on the package top layer, capacitors placed around the 4 sides of the die, substrate edge keep-out zones for the lid and all other handling keep out zones for testing. The contractor shall present the design at a Preliminary Placement Design Review (PPDR). (CDRLs:

A001 – 9LPC4ATC design; A002 – PPDR minutes)

3.1.1.2 PDRD Rev. 0.2: Upon approval of the 9LPC4ATC design package, the contractor shall provide a PDRD Rev

0.2 design file that shows the connectivity between the die bumps and the package balls. The contractor shall present the design at a review. (CDRLs: A003 – PDRD Rev 0.2 Design file; A002 – Review minutes)

3.1.1.3 PDRD Rev. 0.5: The contractor shall provide a PDRD Rev 0.5 design file with routing completed, and capacitors placed. [Note: At this stage the package ball-map will be frozen per PDRD, meaning no package ball swap after this point unless otherwise approved by packaging lead.] The contractor shall present the design at a review. (CDRLs: A004 – PDRD Rev 0.5 Design file; A002 – Review minutes)

3.1.1.4 PDRD Rev. 0.8: The Contractor will provide a PDRD Rev 0.8 design file. The design shall be clean of any

Design Rule Check (DRC). [Note: DMEA engineers will review the design and approve the design.] The contractor shall present the design at a review. (CDRLs: A005 – PDRD Rev 0.8 Design file; A002 – Review minutes)

3.1.1.5 PDRD Rev 1.0: The contractor shall provide the frozen design file; manufacturing files; assembly file; and

Bill of Materials (BOM). The contractor shall present the files at a review. (CDRLs: A006 – PDRD Rev 1.0 Design file; A002 – Review minutes; A007 – Manufacturing files; A008- Assembly file; A009 – BOM)

3.2 Product Introduction Assessment

3.2.1 Deliverables by contractor includes providing Process detail drawing, build solution document, as well as packaging manufacturing process flow summary document. (CDRLs: A007 – Manufacturing files)

3.3 Option 1 (Tooling/Manufacturing and Mask Fabrication NRE): The contractor shall fabricate the tooling and mask(s) for manufacturing and assembly of packages. (CDRLs: A011 – Tooling)

3.3.1 Deliverables includes providing the ball mask, bumping supplier tooling and process, laminate supplier tooling, form factor enablement, lab analysis and hardware.

3.4 Option 2 (First Article/Prototype Assemblies): The contractor shall produce and deliver two-hundred (200)

9LPC4 ATC packages with lids delivered using trays (CDRLs: A012 – 200 wafer product)

3.5 Option 3 (Production Representatives): The contractor shall produce and deliver seven-hundred (700) 9LPC4

ATC packages with lids using trays (CDRLs: A013 – 700 wafer product)

3.6 SECURITY: The contractor shall use International Traffic in Arms Regulation (ITAR) products

3.7 PROGRAM SUMMARY: The contractor shall summarize all work accomplished under this SOW including significant technical accomplishments, problems encountered, solutions implemented, recommendations for improvement, and a comparison of planned schedules and costs with final performance. (CDRLs: A010-Statement of work performed)

4.0 POINTS OF CONTACT:

DMEA/MEBC PROJECT ENGINEER:

DMEA/MEBC BRANCH CHIEF: