JA_IBM_19-9G2_23Sep19_Redacted.pdf
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- Attached to
- 9LPC4ATC MPW Packaging
- Solicitation number
- HQ072719QRH07
- Issued by
-
Defense Microelectronics Activity
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| File | Type | Posted |
|---|---|---|
| SOW_19-9G2_IBM_Redacted_23Sep19.pdf | ||
| Combined_Solicitation_HQ072719QRH07_24Sep19.pdf |
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DMEA #19-45
6/8/2018
Defense Microelectronics Activity 4234 54th Street, McClellan, CA 95652
PWS # 19-9G2
Sole Source Justification
1. Agency and Contracting Activity: Office of Secretary of Defense, Defense Microelectronics Activity (DMEA).
2. Nature/Description of Action: DMEA is in the process of enabling capability by the end of 2021. To enable the new Advanced Packaging technology at DMEA, substrates are required to prove capability concept using various stress and manufacturing test.
This procurement is to develop a process to assemble and package flip chip products that will support the upcoming
3. Description of Supplies/Services: : In support of DMEA foundry and United States Government (USG) microelectronics mission, DMEA/ will procure The 9LP Assembly Test Chip (ATC) packaging is to provide a test vehicle for evaluating flip chip Advanced Packaging technology including design and manufacturing process. This will enable new product development at DMEA adding more capability to support package design capabilities.
DMEA/MEBC is in need of 9LP Assembly Test Chip (ATC) packaging. The total estimated value is $ .
4. Authority Cited:
FAR 13.106(b)(1), Soliciting from a single source.
5. Reason for Authority Cited: LPC4 ATC Mulitproject Wafer (MPW) Packaging is the sole trusted supplier in CONUS that can provide turn-key solution for flip chip packaging.
6. Efforts to Obtain Competition: Due to the finding from market research, paragraph 8, there were not additional trusted suppliers.
7. Fair and Reasonable Cost Determination: I hereby determine that the anticipated cost to the Government for this contract action will be fair and reasonable. This determination is based upon a comparison of the proposed price with prices found reasonable from other manufacture pricing.
Typed Name: Date:
Title: Contracting Officer Signature:
8. Market Research: IBM is the sole trusted supplier that can provide turn-key solution for flip chip packaging. For a third party vendor to provide this service/product could be harmful to our weapon system due to this third party vendor not a trusted source.
DMEA #19-45
6/8/2018
DMEA/MEBA believes that award to any other source would result in unacceptable delays and high risk in fulfilling this requirement.
9. Other Facts: None
10. Listing of Sources: International Business Machine (IBM)
11. Actions to Increase Competition: In order to increase competition, DMEA would require a third party vendor to invest and become a trusted supplier. The third party vendor must meet DMEA and
12. Contracting Officer Certification: I certify that this justification is accurate and complete to the
Typed Name: Date:
Title: Contracting Officer Signature:
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