Attachment A - SOW for Mask Aligner 12-20.pdf

Attachment A

STATEMENT OF WORK FORMAT

Mask Aligner and Align-for-Bond

Background

The Detector Systems Branch of GSFC has a requirement to acquire a contact mask-aligner system with align-for-bond capabilities, for use in the Detector Development Lab (DDL).

The system has two main functions, 1) is to align a mask to a substrate (typically a wafer) and 2) is to expose UV light onto the substrate through the mask. The align and expose feature is used to transfer patterns from metal patterned glass plates to silicon wafers (or other substrates) containing a UV sensitive resist coating. Additionally, an align-for-bond feature allows multiple substrates to be aligned together and held in place prior to transfer via fixturing to a separate system which bonds the two substrates together maintaining the previous alignment. The bonding system is not in scope of this requirement. The system shall include all necessary software and hardware to enable precision alignment, force control and temperature control. The vendor shall provide technical support of the equipment. The current requirement is for a system that can align and expose, as well as align for subsequent bonding.

The Detector Systems Branch has a separate bonding system. The requirement presented here is for a system that shall be capable of mask-to-substrate alignment followed by UV light exposure and shall also be capable of alignment for bonding, directly interfacing with an existing Suss SB6e bonder. Any fixtures or substrate-holding required to interface with a Suss bonding system shall be included and work seamlessly with the existing bonding system and the alignment system.

Such a system is essential for nearly all device fabrication projects under development and in production in GSFC’s Detector Development Lab. While the DDL has multiple processes to create patterns for devices, contact lithography remains the most used among all projects. The requirement is important to maintaining capability in the DDL.

Objectives

1. To procure a system capable of contact mask alignments and subsequent UV exposure

2. To procure a system capable of wafer-to-wafer alignment for subsequent bonding in an existing Suss SB6e bonding system.

3. The system is to be installed in the NASA GSFC Detector Development Lab, a class

100 (ISO5) cleanroom.

4. To procure a system with a one-year warranty for parts and labor.

5. To procure a system meeting the GSFC safety requirements that include SEMI S2 compliance.

Scope

The scope of this work includes production, delivery and startup of a mask alignment and wafer-to-wafer alignment system. No prototypes or one-of-a-kind systems will be considered. The unit must be a production model with similar units working in the field demonstrating all capabilities listed in the requirements. The following milestones are expected.

a) Design of the system at the vendor location.

b) Approval of the design by the GSFC technical representative, communicating requirements to GSFC for installation including all needed utilities.

c) Construction of the system at the vendor site.

d) At vendor site, demonstrate system, including all requirements listed below. This demonstration may be in person or a virtual demonstration where reports and performance are shared with the technical representative. The platform of the demonstration (virtual or in person) shall be coordinated between the COR and vendor.

e) The vendor shall assume all crating and shipping responsibilities for delivery to

GSFC.

f) At GSFC, vendor shall complete installation and assembly. At GSFC, vendor shall demonstrate the following: equipment operability, all hardware and software functions, all requirements listed below and any acceptance testing of the system coordinated between the COR and the vendor. In addition, spare parts shall be provided at installation.

g) At GSFC, vendor shall provide training, of approximately three GSFC personnel, on all functions of the system.

Tasks or Requirements

The vendor shall provide a new system. The vendor shall insure that the system is equipped with the following equipment and meets the following requirements prior to

Acceptance of System.

1. A brand-new unit is required; no used equipment or accessories are acceptable.

2. The system shall meet current industry standard (semi S2) requirements for safety including the use of Emergency Off (EMO) panic buttons. The tool shall include the appropriate shielding and interlocks for hazardous areas, protecting the user and maintenance personal from high voltages, pneumatics, radiation, moving parts and the tool from potential service failures.

3. The system shall have all hazardous labels in English.

4. The unit shall be a commercially available model with similar units working in the field that demonstrate the complete list of requirements.

5. The equipment shall have a small footprint, minimizing floorspace.

6. The system shall be Class 100 (ISO5) Cleanroom compatible.

7. The system shall be built out of cleanroom compatible (i.e., low particulate) materials including paints and coatings (no outgassing volatile organic compounds) on metal surfaces.

8. The power off state (when EMO is pressed) shall close all valves, power off all power supplies, and stop flow of any gasses and restrict mechanical movement as relevant.

9. The system shall have an integrated base and frame with side covers to allow for vertical laminar flow.

10. The system shall include a computer interface for control of the system and logging of all process and machine state parameters.

11. The system shall include an industrial PC with modern Windows operating system and User Interface.

12. The computer interface shall be compliant with NASA IT specifications. The supplier shall agree to work with NASA to meet IT requirements for 508 compliance or provide necessary information and documentation should waivers be requested.

13. The system shall meet IPv6 compliance standards.

14. Specific system requirements shall include the following.

14.1. The system shall be capable of aligning two wafers together for the purpose of wafer bonding (referred to as bond-alignment mode).

14.2. The bond-alignment mode shall be capable of handling wafers for alignment from

3” up to 200mm diameter. All necessary chucks and fixtures shall be provided to cover this size range.

14.3. The bond-alignment mode shall be capable of directly interfacing with a separate bonding system, a Suss Bonder, model SB6e.

14.4. The bond-alignment mode shall seamlessly integrate with the bonding system and require no alteration to bonding hardware.

14.5. The alignment-exposure mode shall be capable of handling 1” parts up to 200mm diameter wafers. All necessary chucks and fixtures shall be provided to cover this size range. Specifically, vendor shall provide wafer and mask chucks to support align and exposure of 3” wafers, 4” wafers, 6” wafers and 8” wafers.

14.6. The system shall be capable of standard contact alignment modes that include, soft-contact, hard-contact, vacuum-contact, and proximity mode. All necessary chucks and fixtures shall be provided to cover these modes of operation.

14.7. The system shall be capable of the following exposure modes; timed, flood, split

(with wait).

14.8. The system shall be capable of automatic wedge compensation when in contact or without contact between mask and wafer for wafer planarization.

14.9. The system shall be programmable for an alignment gap of 1 to 1000 micron with a resolution of 1 micron.

14.10. The system shall include a stage with computer-controlled movement.

14.11. The system stage shall have a zero or “home” position.

14.12. The system shall utilize an LED generated broadband (350nm – 450nm), UV exposure system for I-line, G-H-line.

14.13. The system shall be capable of uniform exposure across a 200mm wafer better than 2.5% uniformity.

14.14. The system shall also include vibration suppression and be capable of handling wafers from 1” pieces up to 200mm in diameter.

14.15. The system shall be capable of Top Side Alignment, looking through a glass mask plate utilizing top-side microscope objective lenses.

14.16. The system shall be capable of Front-to-Back Side alignment utilizing a separate set of microscope objectives specifically for this mode.

14.17. The system shall have a camera system for both top-side and back-side imaging capable of providing at least 2x digital zoom.

14.18. The system shall include objective lenses for low power and medium power.

The low power lens shall be 5x power with a minimum of 23mm working distance.

The medium power lens shall be 10-14x power with a minimum working distance of 14mm.

14.19. The system shall include a separate IR light source for through wafer alignment.

14.20. The controlling software shall be capable of target training, pattern recognition,

14.21. The system shall be capable of the following operational modes: manual operation, semi-auto and full-auto. Semi-auto and full-auto shall operate for alignment assist without operator intervention.

14.22. Auto alignment modes shall have a manual alignment check prior to exposure.

14.23. The system shall be capable of top-side alignment accuracies less than 0.5 um with accuracies of 0.2um achievable.

14.24. The system shall be capable of bask-side alignment accuracies less than 1.0 um.

14.25. Installation, DDP shipping and extensive training and support shall also be included.

14.26. Vendor shall provide a test mask (5” x 5”) for alignment and resolution testing with minimum CD or 2um for lines and spaces.

14.27. Vendor shall provide a UV meter and case for intensity and uniformity measurements of the exposure dose.

14.28. The system shall occupy a footprint of no more than 48” x 40”.

Software

The controlling computer operating system (OS) shall be Windows 10 or later. Any system running an OS older than Win10 shall ship with at least Windows 7 and shall include an upgrade to Windows 10 at no additional cost.

The software shall have separate modes for different types of users such as administrator

(manage users, control system manually), engineer (recipe development), and basic user

(execute recipes).

Utility Connections (power, vacuum, air, water, etc)

All required utilities needed to operate the equipment shall be specified at the time of award and GSFC shall be notified of these requirements.

Cleanliness

The system, including all third-party components, shall be delivered to GSFC with exterior surface parts clean and free of grease or dust and compatible with operation in a

ISO 5 cleanroom environment.

Deliverables

The vendor shall be responsible for delivering the complete system (as described in this

SOW) to Goddard Space Flight Center including but not limited to the below:

The vendor will contact the GSFC technical representative within two weeks of date of award to present the planned design for the tool. Vendor will build the tool over the next weeks, providing updates to the technical representative to ensure scheduled delivery, and to coordinate acceptance testing or visit of GSFC representative to vendor site for inspection and testing of the unit for acceptance.

The vendor shall perform a factory demonstration prior to shipping (factory acceptance test) in addition to demonstrating the system meets all stated requirements in this SOW as well as vendor listed specifications.

At GSFC, demonstrate the system meets all stated requirements in this SOW as well as vendor listed specifications.

Final acceptance of system will be conditional upon: (1) successful demonstration of functions and all stated requirements; and (2) providing user training on system operation inclusive of providing operational manuals and maintenance manuals with circuit schematics and layouts.

Installation/Assembly

The vendor shall notify the COR if a vendor representative must be present to uncrate the equipment or for any subsequent equipment moves. The vendor shall set up and assemble all components of the equipment in the location specified by GSFC personnel within the

Detector Development Laboratory. Installation shall include all spare parts and verification and demonstration of equipment functionality and all stated requirements.

Training

At the completion of commissioning, the vendor shall provide training for up to three

GSFC employees inclusive of providing operational manuals and maintenance manuals with circuit schematics and layouts. The training shall be extensive to include all machine states, use of external hardware or components, and all software modes and functions needed to operate the machine and demonstrate all requirements.

Documentation

The vendor shall provide all necessary documents or information to GSFC technical representative to acquire access to the GSFC site. The vendor shall provide a factory trained engineer who is a U.S. Citizen or Lawful Permanent Resident to conduct the installation. Alternatively, if a foreign national must conduct the visit, then the vendor shall coordinate the visit with the COR and provide names of visitors and the required documentation 60 days in advance of scheduling a visit.

The vendor shall provide all system manuals on cleanroom paper in addition to providing digital copies. Manuals shall present clear instruction for operation, maintenance and care of the system and any third-party components.

Vendor will provide documentation of all hardware in the system including printed versions of any settings associated with the hardware, operation and maintenance.

Warranty

The vendor shall offer the government at least the same warranty terms, including offers of extended warranties, offered to the general public in customary commercial practice.

Warranty terms must be included in the system price. The period of warranty will begin upon acceptance of the system.

Supplier shall provide a Warranty of at least 12 Months (Parts and Labor), guaranteed to meet factory specifications.

Guarantee of tool functionality

Vendor will guarantee functionality of the system, as defined by the state of the system accepted after the demonstration and training visit, for one year after acceptance of installation. This will include replacement of failed parts on the tool, troubleshooting of problems with the system via phone consultation, as well as site visits to restore system if it is non-functioning.

Government-Furnished Equipment and Government-Furnished Information

No Government-furnished equipment (GPE) and Government-furnished information

(GFI) will be required. GSFC will provide power, gases, and other utility needs as communicated by the vendor.

IPv6 and 508 compliance

During the performance of this SOW the vendor will be providing IT hardware and software items. The Contractor shall ensure all such items are approved through the

OCIO’s standard approval process. This includes but is not limited to Internet Protocol

(IPv6) compliance and 508 Compliance. The Contractor shall not purchase IT hardware and software prior to approval.

The vendor shall ensure that products and services that use the Internet Protocol provide full feature functionality in both dual stack (IPv4 and IPv6) and IPv6-only environments in compliance with NIST USGv6 Testing Program, see Special Publication 500-267, A

Profile for IPv6 in the U.S. Government – Version 1.0. The vendor must notify the

Contracting Officer of all contract specifications that do not comply with providing full feature functionality for IPv6 and act in accordance with the instructions of the

Contracting Officer.

The contractor shall ensure that all NASA deliverables including systems, electronic communications, and any other information and communication technology be accessible to all people including those who use assistive technology as defined by Final Rule of

Section 508 of the Rehabilitation Act. The rule may be found at: Revised 508 Standards and 255 Guidelines (access-board.gov)

Applicable Chapters are as follows:

508 Chapter 1: Application and Administration

508 Chapter 2: Scoping

Chapter 3: Functional Performance Criteria

Chapter 4: Hardware

Chapter 5: Software

Chapter 6: Support Documentation and Services

Chapter 7: Referenced Standards.

Place of Performance

Work will be performed both at the vendor site, where the unit will be designed, built, and acceptance tested, and at NASA GSFC where the unit will be installed and demonstrated for final acceptance.

Period of Performance

The period of performance shall be 12 months from date of award.