QandA Mask Aligner - Final.pdf
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- Attached to
- 80GSFC21Q0004 - Mask Aligner Federal contract opportunity
- Solicitation number
- 80GSFC21Q0004
About this file
This document is a combined synopsis and solicitation for a mask aligner system with align-for-bond capabilities. The National Aeronautics and Space Administration Goddard Space Flight Center is seeking a system capable of handling substrates from 1-inch to 200mm in diameter for alignment and exposure. Key requirements include the ability to align and expose 3-inch, 4-inch, 6-inch and 8-inch wafers. The successful offeror must complete factory acceptance testing within 7-8 months, ship the system within 8 months, install and assemble it within 8-11 months, and complete final acceptance testing within 12 months of the award date. Training must also be completed within 12 months. The total period of performance is 12 months. Offers are due by January 7, 2022 and the award will be made based on technical capability, past performance, and price.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| Enclosure 1 - NASA IPv6 Baseline Requirements.pdf | ||
| Attachment A - SOW for Mask Aligner 12-20.pdf |
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Mask Aligner – 80GSFC21Q0004 Questions and Answers
Questions Answers
1) Please fill out the attached Worksheet to describe each substrates and mask to be used on the system.
One document for lithography application, one document for bonding application
With regard to the wafer substrate size, please see Section 14 of the Statement of Work (SOW). Per the SOW, the substrate sizes are provided as follows (sections 14.2 and 14.5):
SOW Section 14.2: The bond-alignment mode shall be capable of handling wafers for alignment from 3” up to 200mm diameter. All necessary chucks and fixtures shall be provided to cover this size range.
SOW Section 14.5: The alignment-exposure mode shall be capable of handling 1” parts up to 200mm diameter wafers. All necessary chucks and fixtures shall be provided to cover this size range.
Specifically, vendor shall provide wafer and mask chucks to support align and exposure of 3” wafers, 4” wafers, 6” wafers and 8” wafers.
Regarding the other Substrate Descriptions referenced in the worksheet provided (Shape, thickness, substrate material, etc.), our facility is R&D and not for production level work with a single substrate type. Our projects use a myriad of thicknesses and materials, shapes and sizes which would be difficult to capture in your form. We do tend toward industry standards on these parameters.
2) Please give SN, date of manufacture and model name for your SUSS SB6e bonder referenced in the above Solicitation.
SN 231; NASA purchased in 2009; Model:
SB6e Model 06,1002913
Section 14.3 of the SOW has been updated to include this information.
3) Please give pertinent information for present bond fixtures used in SUSS SB6 bonder:
3a) Technical drawings are not available at this time. NASA may entertain reverse engineering a drawing after award, however
Mask Aligner – 80GSFC21Q0004 Questions and Answers
a. Dimensions of fixture; technical drawing with photographs preferred
b. Substrate info to be used with each fixture: diameter, shape, thickness, notch/flat, length of flat [other info]. You may use the attached Customer Substrate Tooling Worksheet for this info.
as stated in response to question 2, the Serial Number and Model are referenced below:
SN 231; Model: SB6e Model 06,1002913
This is an acquisition for commercial items as such further information regarding the SUSS SB6 bonder may be publicly available.
3b) See response to question 1. Information is provided in sections 14.2 and 14.5 of the Statement of Work.
4) The Solicitation indicates the system should function in manual, semi-auto and fully-automatic modes. Which steps or functions should be automated:
a. Leveling and gap setting?
b. Execution of exposure program such proximity, contact or vacuum contact?
c. Execution of exposure parameters such as gap setting, dose, time, spectral distribution
d. Auto-align to fiducials?
e. Prealignment
i. By means of banking pins?
ii. By means of automated pre-aligner?
f. Auto-loading of wafers from cassette?
g. Other automated functions (via SECS/GEM protocol, IPv4/6 or DHCP), including recipe up/download, wafer alignment/exposure tracking?
4a) An automatic mode of operation should include this step/function.
4b) An automatic mode of operation should include this step/function.
4c) An automatic mode of operation should include this step/function.
4d) An automatic mode of operation should include this step/function.
4e) NASA is used to using banking pins as means to align on the chuck. The vendor may suggest alternatives. This step/function should be manual.
4f) This step/function is not applicable due to manual loading.
4g) This step/function is not applicable.
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