Attachment 1 NB680000-23-00593 SOW 2-14-23 .pdf

STATEMENT OF WORK/REQUIREMENTS DOCUMENT

Title: Procurement of a Suite of Focused Ion Beam and Scanning Electron Microscope

Instruments February 14, 2023

I. BACKGROUND INFORMATION

The Precision Imaging Facility at the National Institute of Standards and Technology (NIST) is involved in the characterization of metals, semiconductors, and insulators in support of multiple projects.

Materials characterization allows NIST scientists to make direct correlations between material processing, (nano)structure, and resulting properties. This work involves the analysis of structure and chemistry at atomic or near-atomic length scales in the transmission electron microscope (TEM) and scanning transmission electron microscope (STEM). This work also involves the analysis of chemistry using an atom probe tomography (APT) system. Both the TEM/STEM and the APT instruments require precises preparation of specimens at a scale that approaches single nanometers. In addition, NIST is interested in characterizing the chemistry, structure, and electrical properties in two and three dimensions.

A focused ion beam/scanning electron microscope (FIB/SEM) system consists of both electron and ion sources, which produce high energy focused beams of electrons/ions at a coincident point within a vacuum chamber. In general, the scanning electron microscope (SEM) portion of the instrument is used for imaging and analysis of materials. The focused ion beam (FIB) portion of the instrument is generally used to remove material at the micrometer and nanometer scales. With the aid of a gas injection system (GIS) and a software-integrated micromanipulator, the FIB/SEM instrument can be used to make specimens suitable for inspection and analysis in TEM/STEM and/or APT systems.

Additionally, the FIB and SEM columns can be used in concert to destructively image three-dimensional material volumes. FIB/SEM systems generally contain numerous analytical detectors, which allows for the quantitative structural and chemical analysis of materials at micrometer and nanometer scales.

This list of functions is not exhaustive and contract proposers should carefully review the “Minimum Requirements” section in this document. In this work, NIST is seeking a suite of three instruments:

A. A focused ion beam/scanning electron microscope system specializing in high quality sample preparation

B. A focused ion beam/scanning electron microscope system specializing in structural and chemical characterization of materials

C. A scanning electron microscope system specializing in chemical and structural characterization of materials

NIST specifically requires a suite of three instruments from the same manufacturer. The specific NIST requirements related to this suite of instruments is threefold:

A. The software and hardware user interface between the three instruments should be identical (or substantially identical) to reduce the time required to familiarize and train NIST staff on each instrument. Additionally, the identical user interface will simplify any alignments, service, or maintenance that NIST staff are required to perform.

B. The instrument hardware must be identical (or substantially identical) such that accessories, including sample holders, stages, and detectors can be moved between the instruments. These accessories can represent a substantial cost to NIST and maintaining multiple sets of accessories may be prohibitively expensive. This is especially important when moving samples between instruments to perform correlative measurements on materials, structures, or devices.

C. Instrument automation software between the three systems must be fully compatible such that data collected on one instrument can be analyzed on another instrument in the suite. For example, a large-area image taken on the scanning electron microscope system (CLIN 0003) shall be able to be loaded into one of the FIB/SEM systems (CLIN 0001 or 0002) to investigate an area of interest on the same specimen.

Consistent with NIST’s mission to develop measurement science, a particular research focus of the instrument will be to evaluate the sources of systematic and statistical error that limit the efficacy of FIB/SEM techniques, to devise strategies to mitigate these uncertainties, and to develop metrics that quantify the results.

II. SCOPE

The Contractor shall deliver and install three instruments with features as defined in the “Minimum Requirements” section inclusive of FOB Destination. Control and support computers shall also be included, as well as all software as defined in the “Minimum Requirements” section and all three systems shall be covered under warranty for at least one (1) year to include all parts, software, labor, and travel.

III. MINIMUM REQUIREMENTS

General Requirements for all CLINS:

A. All CLINS shall consist of all new, commercially available items. Prototypes, one-off systems, demonstration models, used or refurbished instruments will not be considered for award.

Compatibility Requirements Between CLIN 0001, 0002, and 0003:

A. Instrument Manufacturer

a. To meet NIST requirements described in the Background section all three systems shall originate from the same manufacturer

B. Compatible sample stages and/or goniometers:

a. The three systems provided by The Contractor shall have an identical stage geometry such that any specimen holders, stages, or other accessories that are compatible with one system can be used in the others.

C. Identical computer software, computer user interface, and physical user interface:

a. The three systems provided by The Contractor shall have an identical (or extremely similar) computer software and user interface

b. All data collection and analysis software provided by the Contractor shall be able to import and export identical data file types and formats

c. The three systems provided by The Contractor shall have identical physical user interfaces (commonly referred to as “hand control panels”)

D. Python-based scripting language:

a. The three systems provided by the Contractor shall share an identical Python-based scripting language. This may be accomplished via a native python application programming interface or through python wrappers for the native application programming interface. Python commands for identical functions (e.g. stage movement, image acquisition) shall be identical between the three instruments defined in CLIN

0001, CLIN 0002, CLIN 0003.

b. The Python-based scripting language shall allow for, but not be limited to, the following control of the instrument:

i. Electron-optical system and Ion-optical system (if applicable):

1. Adjustment of accelerating voltage and beam current

2. Adjustment of magnification

3. Movement of apertures

4. Adjusting focus, astigmatism, and brightness/contrast

5. Activate all automatic functions, including but not limited to automatic focus correction and automatic astigmatism correction

ii. Stage:

1. Moving the stage to relative or absolute positions

2. Controlling all stage axes, including two directions of tilt (on compatible holders)

3. Querying the stage for position and status

iii. Gas injection system:

1. Insert, retract, heat, and purge the gas injection system needle(s)

2. Start or stop flow of the gas injection system needle(s)

iv. Vacuum system:

1. Querying the vacuum state

2. Pumping and venting the vacuum system

v. Image acquisition:

1. Insert and retract compatible cameras and detectors

2. Image acquisition on all compatible detectors

vi. Data manipulation:

1. Import, export, and save acquired or derived data

2. Import, export, and save metadata

vii. Instrument status:

1. Query current vacuum status

2. Query current electron gun/source status

3. Query current stage position

viii. External server access:

1. Allow a network connected computer or server to query the microscope state as described above

2. Allow a network connected computer or server to control the microscope as described above

System 0001: Focused Ion Beam/Scanning Electron Microscope System for Sample Preparation

CLIN 0001: Focused Ion Beam/Scanning Electron Microscope System for Sample Preparation Description: Focused ion beam/scanning electron microscope (FIB/SEM) system configured for high quality TEM/STEM and APT sample preparation Quantity: one (1)

Technical Specifications:

A focused ion beam/scanning electron microscope (FIB/SEM) system shall consist of both electron and ion sources, which produce high energy focused beams of electrons/ions at a coincident point within a vacuum chamber. The scanning electron microscope (SEM) portion of the instrument shall be able to be used for imaging and analysis of materials. The focused ion beam (FIB) portion of the instrument shall be able to be used to remove material at the micrometer and nanometer scales. With the aid of a gas injection system (GIS) and a software-integrated micromanipulator, the FIB/SEM instrument shall be able to be used to make specimens suitable for inspection in a transmission electron microscope and/or atom probe tomography systems.

The system shall include:

A. Vacuum System:

a. Vacuum Pumps necessary for tool operation

i. All vacuum pumps and/or vacuum pumping systems shall be oil free.

b. Vacuum System Operations

i. All routine operations of the vacuum system (venting/pumping/plasma cleaning) shall be integrated into the instrument control software with software/hardware interlocks that prevent users from accidentally venting any or all of the vacuum system. The full vacuum system shall have all necessary pumps, gauges, controls, and valves necessary for routine operation. Automatic isolation valves shall close in the event of a building power or facilities loss to maintain the integrity of the vacuum system.

ii. The vacuum chamber shall be accessed by opening a large door on the front of the instrument

c. Plasma cleaner

i. The vacuum chamber shall be fitted with a plasma cleaner for removal of hydrocarbon contamination from the chamber and specimens in the chamber

ii. Operation of the plasma cleaner shall be integrated into the microscope control software

B. Electron Source:

a. Source

i. The electron emitter shall be a field emission gun (FEG)

ii. All operations of the electron source, including startup/operation, voltage ramping, source conditioning, and setting of the extraction voltage shall be integrated into the software interface

b. Accelerating Voltage

i. The electron source and accelerator shall be able to produce an electron beam at accelerating voltages between 500 volts and 30 kilovolts

ii. The accelerating voltage should be variable between the minimum voltage and

30 kilovolts

iii. The scanning electron microscope system shall be aligned at the following accelerating voltages during installation: 30 kilovolts, 25 kilovolts, 20 kilovolts, 15 kilovolts, 10 kilovolts, 5 kilovolts, 4 kilovolts, 3 kilovolts, 2 kilovolts, 1 kilovolt, 500 volts (if available), 200 volts (if available), and the lowest voltage available (if lower than 200 volts)

iv. Changing of the accelerating voltage shall be integrated into the software user interface and provide automatic control

c. Apertures

i. All apertures shall be motorized and integrated with the microscope software user interface

ii. Apertures shall be able to recall their previous position when changed

iii. Selectable apertures within the electron optical column shall have at least 5 user-selectable aperture sizes. The Contractor shall coordinate with the Government to configure the size of each available aperture

d. Scanning Electron Microscope (SEM) Capabilities

i. The SEM scanning system shall be able to collect images between 64 x 64 pixels in size (or smaller) and 4096 x 4096 pixels in size (or larger)

ii. The minimum SEM imaging dwell time shall be 50 nanoseconds or lower

iii. The SEM scanning system shall allow for the collection of images of square or rectangular shape of arbitrary pixel size

iv. The SEM resolution specifications shall be as follows. Preference will be given to systems with better scanning electron microscope resolution.

1. 0.8 nm or better at an accelerating voltage of 30 kilovolts using the STEM detector

2. 0.9 nm or better at an accelerating voltage of 15 kilovolts at the FIB/SEM coincident point

3. 1.5 nm or better at an accelerating voltage of 1 kilovolt at the FIB/SEM coincident point

C. Focused Ion Beam System

a. Source

i. The focused ion beam (FIB) source shall be a gallium liquid metal ion source

ii. All operations of the FIB source, including startup/operation, voltage ramping, source conditioning, and setting of the source parameters shall be integrated into the microscope software interface

b. Accelerating Voltage

i. The ion source and accelerator shall be able to produce an ion beam at accelerating voltages between 500 volts and 30 kilovolts

ii. The accelerating voltage shall be variable between the lowest voltage available and 30 kilovolts

iii. The focused ion beam system shall be aligned at a minimum of five accelerating voltages, including but not limited to: 30 kilovolts, 5 kilovolts, 2 kilovolts, 1 kilovolt, and 500 volts

1. The Contractor shall coordinate with the Governments to determine the ion beam alignment configuration following award

iv. Changing of the accelerating voltage shall be integrated into the software user interface and provide automatic control

c. Beam current

i. The focused ion beam current shall be adjustable between one (1) picoampere and 65 nanoamperes

ii. The Contractor shall coordinate the configuration of the probe current controlling apertures with the Government following award

d. Apertures

i. All apertures shall be motorized and integrated with the microscope software user interface

ii. Apertures shall be able to recall their previous position when changed

e. Focused Ion Beam Imaging Capabilities

i. The FIB scan system shall allow collection of images between 64 x 64 pixels in size (or smaller) and 4096 x 4096 pixels in size (or larger)

ii. The minimum FIB dwell time shall be 50 nanoseconds or lower

iii. The FIB scanning system shall allow for the collection of images of square or rectangular shape of arbitrary pixel size

iv. The guaranteed FIB resolution specifications (measured at the SEM and FIB coincident point) shall be as follows. These resolutions should be accomplished with the “selective edge” measurement method. Preference may be given for higher focused ion beam resolution.

1. 3.0 nm at an accelerating voltage of 30 kilovolts

2. 90 nm at an accelerating voltage of 2 kilovolts

3. 200 nm at an accelerating voltage of 1 kilovolt

4. 500 nm at an accelerating voltage of 500 volts

D. Specimen Stage:

a. Stage Type

i. The specimen stage shall be accessible to an instrument user via a large door at the front of the instrument

ii. The specimen stage shall be fully computerized and integrated with the instrument control software

b. Stage Travel

i. The specimen stage motion shall be accomplished in full, or in part, by piezoelectric mechanical actuators

ii. The stage shall either be of the eucentric or compucentric type

iii. Stage translation shall be at least ± 150 millimeter X- and Y-direction and at least

10 mm in the Z-direction

iv. The stage shall be capable of endlessly rotating 360 degrees

v. The stage shall tilt to -10 degrees (or less) and +60 degrees (or more)

vi. The stage shall accommodate a maximum sample height of at least 55 millimeters

c. Stage Position Recall and Repeatability

i. The stage position should be indicated with a precision of at least 1.0 micrometer and 0.1 degree

ii. The minimum X/Y stage position repeatability shall be 1.0 micrometer or better

iii. The software user interface shall allow for storage and accurate recall of stage positions

E. Gas Injection System(s)

a. The instrument shall be outfitted with a gas injection system which allows for patterning, deposition, or etching (depending on the gas chemistry) with the electron or ion beam systems

b. The gas injection system shall be outfitted with precursors to deposit the following materials with the electron or ion beam:

i. Platinum

ii. Carbon

iii. Tungsten

iv. A non-conductive/insulating material. The exact chemistry is at the discretion of the Contractor.

c. The gas injection system may be made up of a single needle or multiple needles.

Preference will be given to systems using a single gas injection needle.

d. All precursor chemistries are preferred to be available at all stage tilt angles and stage rotation positions.

i. If a multi-chemistry or multi-needle gas injection system solution is proposed, the precursor to deposit platinum shall be available at all positive stage tilt angles and stage rotation positions

e. All operations related to the gas injection system, including but not limited to insertion/retraction, heating, purging, and starting/stopping/adjusting gas flow shall be integrated into the microscope software user interface

F. Micromanipulator

a. The instrument shall be outfitted with a computer-controlled micromanipulator

b. The micromanipulator stage shall enable the micromanipulator tip to move along four axes, including X, Y, Z, and rotation

c. All features of the micromanipulator, including but not limited to insertion, retraction, and motion shall be integrated into the microscope software user interface.

d. The micromanipulator interface shall not require a separate computer or monitor to operate

e. The tip of the micromanipulator shall be user replaceable.

f. The micromanipulator shall be able to be used in the production of specimens for transmission electron microscopy and atom probe tomography

G. Patterning System

a. The instrument shall be outfitted with a patterning system which allows users to pattern various shapes with the electron or ion beam

b. The patterning system shall be fully integrated with the microscope software user interface

c. The patterning system shall allow users to draw, define, and pattern the following shapes/components:

i. Lines

ii. Squares and/or rectangles of arbitrary shape

iii. Circles

iv. Annuli

1. Annular patterning shall be true annular patterning, with the electron or ion beam moving in a circle

2. An annular pattern created by an orthogonally scanning beam is not acceptable

v. Polygons with an arbitrary shape and number of sides

vi. Cross sections

1. A progressing series of line scans that increases in milling or patterning depth with progression

vii. Arrays of polygons

d. In additions to the patterns described above, the patterning system shall also allow the user to upload bitmap (or other similar format) images for patterning using the focused ion beam or scanning electron microscope systems

i. The patterning system shall include software that allows users to define milling depth, dwell time, and all other ion beam parameters during patterning of the uploaded image(s)

e. The patterning system shall be integrated with the gas injection system so that the electron or ion beam systems can be used to pattern and/or deposit the materials defined in section E. b. based on precursor gasses emitted by the gas injection system

f. In the case that multiple patterning shapes/components are present, the user shall be able to adjust the function, parameters, and sequence of each shape/component individually

i. The patterning system shall allow for patterning shapes/components to be executed in serial, parallel, or any combination of the two (e.g. serial execution of groups of patterns that are to be executed in parallel)

g. The patterning system shall allow users save and load combination patterns consisting of multiple polygons or components.

H. Cameras and Detectors:

The instrument shall include the following detectors:

a. Beam current measurement

i. A software-integrated detector (e.g. Faraday cup) for measuring the beam current of the scanning electron microscope system

b. Camera(s) for viewing the chamber

i. An infrared camera to view inside the specimen vacuum chamber during normal operations

ii. A visible light camera inside the specimen vacuum chamber to allow for easy navigation of the specimen stage

c. Electron and Ion Detectors

i. An Everhart-Thornley detector in the vacuum chamber for detecting secondary electrons

ii. A detector designed to collect secondary electrons and secondary ions (SESI)

iii. An in-lens or through-lens detector designed to collect secondary electrons

iv. An in-lens or through-lens detector designed to collect backscattered electrons

v. A retractable, sold-state, segmented backscatter electron detector

1. The detector shall have at least six selectable segments, allowing variable detection of electrons depending on emission angle

vi. A retractable segmented detector to allow for imaging in scanning transmission electron microscopy (STEM) mode, including bright field, darkfield, and high angle annular dark field imaging modes

1. The STEM detector shall be fully retractable such that it does not interfere with any stage motion or other microscope operation when it is retracted.

I. Specimen Holders

a. The instrument shall include specimen holders and/or stage adapters to allow users to insert:

i. One standard pin stub style specimen holder

ii. One standard “half grid” style specimen fixtures to allow for the preparation of transmission electron microscope specimens

iii. One specimen holder for microtip coupons to allow for atom probe tomography sample preparation

iv. One holder for standard three-inch wafers commonly used in semiconductor applications

v. One holder for standard 150 mm wafers commonly used in semiconductor applications

J. Microscope User Interface

a. The instrument shall be equipped with a manual user interface (often called a hand panel) to allow the operator to control the microscope

b. The microscope user interface software shall allow adjustment of all microscope settings.

Aside from inserting and removing a specimen, the user shall not need to interact with the physical microscope during normal use

c. The microscope user interface software shall allow for user-friendly adjustment of instrument modes and alignments, among other features

i. The instrument shall be able to store and recall alignment files for the scanning electron microscope and focused ion beam systems

ii. The instrument shall be able to seamlessly switch between imaging with the focused ion beam and scanning electron microscope systems

iii. The instrument shall be able to recall imaging modes and alignments based on previously stored alignment files

K. Automation Software

a. The instrument shall be equipped with automation software to fully or partially automate the production of specimens for transmission electron microscopy

i. The automation software shall be able to guide the user through the setup of the automated steps using a graphical user interface

ii. The automation shall be able to run unattended (e.g. overnight) during normal operation

iii. Preference will be given to instruments with a higher degree of automation for transmission electron microscope sample preparation

b. The instrument shall be equipped with automation software to fully automate the collection of three-dimensional data volumes by performing serial sectioning using the focused ion beam and imaging using the scanning electron microscope

i. The automation software shall be able to collect three-dimensional data sets from all the detectors defined in section H. c.

ii. The automation software shall be able to integrate energy dispersive x-ray spectroscopy and electron backscatter diffraction data from third-party analytical detectors to be added at a later date

c. The instrument shall be equipped with software to automate the collection of images over large areas, including stage movements, auto focusing routines, auto brightness/contrast routines, and automated routines for the correction of astigmatism

i. The automation software shall be able to integrate energy dispersive x-ray spectroscopy and electron backscatter diffraction data from third-party analytical detectors to be added at a later date

d. The instrument shall be equipped with automated or semi-automated routines to perform regular alignments of the scanning electron microscope and focused ion beam systems

i. Simple alignments shall include focus and image astigmatism of the scanning electron microscope and focused ion beam systems

ii. Preference will be given to instruments that can perform automated advanced alignments, including:

1. Alignment of the scanning electron microscope system including, but not limited to, beam tilts/shifts and aperture positions

2. Alignment of the focused ion beam system including, but not limited to, aperture positions and beam shifts

L. Data Analysis Software

a. The Contractor shall provide software to allow for the processing and analysis of data produced by the microscope, including:

i. SEM images, including data from all electron detectors described in section H of this document

ii. Three-dimensional data sets which have been collected via the serial sectioning automation package, including data from all detectors outfitted on the instrument

iii. Three-dimensional data sets which have been collected via the serial sectioning automation package, including energy dispersive x-ray detector data and electron backscatter diffraction data from third-party detectors to be outfitted later

M. Remote Operation

a. The instrument shall include any and all software required to enable remote operation from a remote site

b. If available, the Contractor shall provide one additional set of hand panels for NIST use from a remote site. All remote hand panels shall comply with the USB 2.0 standard

c. The Contractor shall provide two NIST-wide site software licenses (if required) for remote operation of all native microscope modes

N. Support Equipment

a. The Contractor shall provide a water chiller to provide cooling water to the microscope and any other Contractor supplied equipment that requires cooling water

i. The Contractor shall coordinate with the Government upon award to confirm whether the system chiller will be water-cooled or air-cooled

O. Physical Requirements

a. The instrument (including all enclosures) shall fit in a laboratory with a ceiling height of 13 feet (3.96 meters)

b. The instrument will be collocated in a laboratory with line item 0002. The two instruments shall be able to fit in a room that is 23 feet (7.01 meters) wide and 23 feet (7.01 meters) deep.

P. Training

a. The Contractor shall provide at least five days of training on the FIB/SEM system that covers tool operation and basic maintenance.

b. The Contractor shall offer at least five days of remote applications support on the

FIB/SEM system

c. If the Government executes any Options for this system (CLIN 000102, CLIN 000103, 000104, 000105, or 000106), the Contractor shall provide training covering the optional equipment or software concurrently with the base system (CLIN 0001).

Q. Electrical Power

a. The system and all of its components shall be able to be powered by either 120 V/60 Hz single phase power or 208 V/60 Hz single phase or three phase power. If the tool requires power other than those describe above, the contractor shall provide a suitable transformer that can be powered using the above electrical specifications.

R. Inspection and Acceptance

a. Before shipping the system, the contractor shall provide the Government a standard factory acceptance report demonstrating that the scanning electron microscope system performs according to the contractor’s standard factory acceptance test. The Government reserves the right to be present during the factory acceptance test. The contractor shall provide the Government with a schedule of the factory acceptance test at least four (4) weeks prior to the test to ensure that the Government has enough time to arrange for travel to the factory acceptance testing.

b. After system installation, the contractor shall demonstrate the system performs according to the system specifications using a standard site acceptance test. The system must pass the standard site acceptance test before it will be accepted.

i. Before acceptance the contractor shall demonstrate the automated production of transmission electron microscope specimens as defined in section K. a.

ii. Before acceptance the contractor shall demonstrate the automated collection of three-dimensional data volumes as defined in section K. b.

S. Delivery and Installation

a. Upon successful factory testing, the contractor shall be responsible for delivering the FIB/SEM instrument to its final location in Building 81 on the NIST campus in Boulder, CO. This is to include all required rigging from the delivery truck to the final tool placement in the NIST building.

b. During transport to the final tool location, the system components shall be able to pass through a freight elevator with doors that are 7 feet 11 inches tall and eight feet wide. The elevator platform has an entrance door to back length of 9 feet and a width of 13 feet, a cab height of 7 feet 11 inches, and has a weight limit of 10,000 pounds.

c. The contractor shall provide personnel that pass required Federal government background checks to be issued badges for work on site.

d. The contractor shall schedule all visits to NIST for US citizens or permanent residents with the Contracting Officer’s Representative (COR) at least 2 weeks before arriving at the site. The contractor shall schedule all visits to NIST for non-US citizens or non-permanent residents with the COR at least 6 weeks before arriving at the site.

T. Travel

a. The contractor shall be responsible for all travel expenses for the contractor’s personnel

b. The Government will be responsible for all travel expenses for the Government’s personnel

U. Contractor supplied materials

a. The contractor shall supply all parts, hardware, equipment, tools, and labor required to install the instrument.

V. Warranty

a. The contractor shall provide a comprehensive warranty to cover the instrument for a period of one (1) year. The warranty shall cover all parts, labor, and travel related to execution of the warranty.

CLIN 000101: Uninterruptable Power Supply OPTION Description: Uninterruptable power supply for the focused ion beam scanning electron microscope instrument specified in CLIN 0001 Quantity: one (1) Option Execution: Within 120 days after contract award

Technical Specifications:

A. The contractor shall provide an uninterruptable power supply (UPS) system that can support the microscope and all critical systems during brief facility power outages

B. The UPS system shall support the microscope during a power outage with no delay where the instrument will lose power

C. The UPS system shall support the microscope for at least 10 minutes

CLIN 000102: Automated Preparation of Specimens for Atom Probe Tomography OPTION Description: A software package to fully or partially automate the production of sharp tips to be analyzed in an atom probe tomography instrument Quantity: one (1) Option Execution: Within 120 days after contract award

A. The instrument specified in CLIN 0001 shall be equipped with automation software to fully or partially automate the production of sharp tips to be analyzed in an atom probe tomography instrument

a. The automation software shall be able to guide the user through the setup of the automated steps using a graphical user interface

b. The automation shall be able to run unattended (e.g. overnight) during normal operation

c. The automation software shall be capable of, but not limited to, the following automated operations:

i. Automatically deposit a protective layer on the area of interest

ii. Automatically mill away portions of the specimen using the focused ion beam system to create a free chunk of material

iii. Use the integrated micromanipulator to automatically remove the chunk of material from the substrate

iv. Propagate the chunk of material to several user-defined specimen locations

CLIN 000103: Cooling Stage OPTION Description: A removable attachment for the instrument stage to cool specimens with liquid nitrogen

Option Execution: Within 365 days after contract award

A. The contractor shall provide a stage attachment for the instrument specified in CLIN 0001 that can cool specimens to –150 °C (or less) using liquid nitrogen

a. The stage attachment shall be able to be installed and removed by a microscope user. The Contractor shall provide training on the functions and safe operation of the cooling stage.

b. The stage attachment shall fit the three instruments specified in CLIN 0001, 0002, and

c. When installed, the stage attachment may cause some restriction in the movement of the stage, though full X/Y/Z, tilt, and rotation capabilities are preferred

d. The stage attachment may rely on an external source of liquid nitrogen for cooling

e. The stage attachment offered by the contractor shall include all vacuum feedthroughs, liquid nitrogen Dewars, and control software required to utilize the stage attachment.

CLIN 000104: Cooled Probe for Micromanipulator OPTION Description: A removable adapter for the micromanipulator to allow for cooling of the micromanipulator tip

A. The contractor shall provide an adapter for the micromanipulator specified in CLIN 0001 that enables cooling of the micromanipulator tip

a. The adapter shall be able to be able to be installed and removed by a microscope user.

The Contractor shall provide training on the functions and safe operation of the cooled probe adapter. The micromanipulator adapter shall fit the two micromanipulators specified in CLIN 0001 and 0002

b. When installed, the adapter may cause some restriction in the movement of the micromanipulator.

c. The micromanipulator adapter may rely on an external source of liquid nitrogen for cooling

d. The adapter offered by the contractor shall include all vacuum feedthroughs, liquid nitrogen Dewars, and control software required to utilize the adapter.

CLIN 000105: Low Energy Argon Ion Milling OPTION Description: An attachment for the microscope specified in CLIN 0001 to allow for low-energy argon ion milling of specimens in the sample chamber

A. The contractor shall provide a method to perform low-energy argon ion milling of specimens within the microscope vacuum chamber

a. The system shall be able to mill small specimens (e.g. TEM or APT specimens) or large specimens (e.g. polished metallographic specimens)

b. The argon ion milling system shall remove surface damage imparted by the gallium focused ion beam

CLIN 000106: Active Vibration Isolation System OPTION Description: Active vibration isolation system to reduce environmental vibrations

A. The contractor shall provide an active vibration isolation system to reduce the environmental vibrations

a. When installed, the active vibration isolation system shall reduce environmental vibrations to meet the VC-F vibration criteria

b. The Government will provide an opportunity for the contractor to visit the site during immediately following award to survey the site and determine what is necessary to meet this requirement

CLIN 000107: GIS Precursor Reservoirs OPTION Description: Replacement precursor cartridges for the gas injection system Quantity: one (1) to twenty (20)

A. The contractor shall offer precursor reservoirs for the gas injection system specified in CLIN 0001 to be purchased at the Government’s discretion. The Government is interested in purchasing precursor cartridges for one or more of the following gas injection chemistries:

a. Platinum

b. Tungsten

c. Carbon

d. Insulator

B. If purchased, these cartridges shall be held by the contractor as “consumable credits” to be utilized when the precursor cartridges require replacement

CLIN 000108: Liquid Metal Ion Sources OPTION Description: Replacement gallium liquid metal ion sources Quantity: one (1) to ten (10)

A. The contractor shall offer replacement gallium liquid metal ion sources to be purchased at the Government’s discretion

B. If purchased, these source replacements shall be held by the contractor as “consumable credits” to be utilized when the gallium liquid metal ion source requires replacement

CLIN 000109: Instrument Service Contract OPTION Description: One (1) year of service for the focused ion beam instrument specified in CLIN 0001 Quantity: one (1)

Technical Specifications:

A. Extended Warranty and Service Contract

a. Quantity one (1) Year – Instrument Service Contract (1st year after warranty included in base instrument CLIN 0001) to start at the end of the warranty service contract in CLIN 0001. This service associated with this contract shall meet or exceed the initial one (1) year Warranty and Service included with the base instrument. To be clear, executing this option would result in NIST having a total of at least two (2) years of instrument warranty/service contract.

CLIN 000110: Instrument Service Contract OPTION

Quantity: one (1)

Technical Specifications:

A. Extended Warranty and Service Contract

a. Quantity one (1) Year – Instrument Service Contract (2md year after warranty included in base instrument CLIN 0001) to start at the end of the service contract in CLIN 000109.

This service associated with this contract shall meet or exceed the initial one (1) year Warranty and Service included with the base instrument. To be clear, executing this option would result in NIST having a total of at least three (3) years of instrument

CLIN 000111: Instrument Service Contract OPTION

Quantity: one (1)

Technical Specifications:

A. Extended Warranty and Service Contract

a. Quantity one (1) Year – Instrument Service Contract (3rd year after warranty included in base instrument CLIN 0001) to start at the end of the service contract in CLIN 000110.

This service associated with this contract shall meet or exceed the initial one (1) year Warranty and Service included with the base instrument. To be clear, executing this option would result in NIST having a total of at least four (4) years of instrument

CLIN 000112: Instrument Service Contract OPTION

Technical Specifications:

A. Extended Warranty and Service Contract

a. Quantity one (1) Year – Instrument Service Contract (4th year after warranty included in base instrument CLIN 0001) to start at the end of the service contract in CLIN 000111.

This service associated with this contract shall meet or exceed the initial one (1) year Warranty and Service included with the base instrument. To be clear, executing this option would result in NIST having a total of at least five (5) years of instrument warranty/service contract.

D

System 0002: Focused Ion Beam/Scanning Electron Microscope System for Materials Analysis

CLIN 0002: Focused Ion beam/Scanning Electron Microscope System for Materials Analysis Description: Focused ion beam/scanning electron microscope (FIB/SEM) system configured for the structural and chemical analysis of materials Quantity: one (1)

Technical Specifications:

A focused ion beam/scanning electron microscope (FIB/SEM) system shall consist of both electron and ion sources, which produce high energy focused beams of electrons/ions at a coincident point within a vacuum chamber. The scanning electron microscope (SEM) portion of the instrument shall be able to be used for imaging and analysis of materials. The focused ion beam (FIB) portion of the instrument shall be able to be used to remove material at the micrometer and nanometer scales. With the aid of a gas injection system (GIS) and a software-integrated micromanipulator, the FIB/SEM instrument shall be able to be used to make specimens suitable for inspection in a transmission electron microscope and/or atom probe tomography systems.

a. Vacuum Pumps necessary for tool operation.

i. All vacuum pumps and/or vacuum pumping systems shall be oil free.

b. Vacuum System Operations

i. All routine operations of the vacuum system (venting/pumping/plasma cleaning) shall be integrated into the instrument control software with software/hardware interlocks that prevent users from accidentally venting any or all of the vacuum system. The full vacuum system shall have all necessary pumps, gauges, controls, and valves necessary for routine operation. Automatic isolation valves shall close in the event of a building power or facilities loss to maintain the integrity of the vacuum system.

ii. The vacuum chamber shall be accessed by opening a large door on the front of the instrument

c. Plasma cleaner

i. The vacuum chamber shall be fitted with a plasma cleaner for removal of hydrocarbon contamination from the chamber and specimens in the chamber

ii. Operation of the plasma cleaner shall be integrated into the microscope control software B. Electron Source:

i. The electron emitter shall be a field emission gun (FEG)

ii. All operations of the electron source, including startup/operation, voltage ramping, source conditioning, and setting of the extraction voltage shall be integrated into the software interface

b. Accelerating Voltage

i. The electron source and accelerator shall be able to produce an electron beam at accelerating voltages between 500 volts and 30 kilovolts

ii. The accelerating voltage shall be variable between the minimum voltage and 30 kilovolts

iii. The scanning electron microscope system shall be aligned at the following accelerating voltages during installation: 30 kilovolts, 25 kilovolts, 20 kilovolts, 15 kilovolts, 10 kilovolts, 5 kilovolts, 4 kilovolts, 3 kilovolts, 2 kilovolts, 1 kilovolt, 500 volts (if available), 200 volts (if available), and the lowest voltage available (if lower than 200 volts)

iv. Changing of the accelerating voltage shall be integrated into the software user interface and provide automatic control

c. Apertures

i. All apertures shall be motorized and integrated with the microscope software user interface

ii. Apertures shall recall their previous position when changed

iii. Selectable apertures within the electron optical column shall have at least 5 user-selectable aperture sizes. The contractor shall coordinate with the Government to configure the size of each available aperture

d. Scanning Electron Microscope (SEM) Capabilities

i. The SEM scanning system shall allow collection of images between 64 x 64 pixels in size (or smaller) and 4096 x 4096 pixels in size (or larger)

ii. The minimum SEM imaging dwell time shall be 50 nanoseconds or lower

iii. The SEM scanning system shall allow for the collection of images of square or rectangular shape of arbitrary pixel size

iv. The guaranteed SEM resolution specifications shall be as follows. Preference may be given for better scanning electron microscope resolution

1. 0.8 nm or better at an accelerating voltage of 30 kilovolt using the STEM detector

2. 0.9 nm or better at an accelerating voltage of 15 kilovolts

3. 1.7 nm or better at an accelerating voltage of 1 kilovolt

C. Focused Ion Beam System

i. The focused ion beam (FIB) source shall be a gallium liquid metal ion source

ii. All operations of the FIB source, including startup/operation, voltage ramping, source conditioning, and setting of the source parameters shall be integrated into the software interface

b. Accelerating Voltage

i. The ion source and accelerator must be able to produce an ion beam at accelerating voltages between 500 volts and 30 kilovolts

ii. The accelerating voltage should be variable between the lowest available voltage and 30 kilovolts

i. The focused ion beam system shall be aligned at at minimum of five accelerating voltages, including but not limited to: 30 kilovolts, 5 kilovolts, 2 kilovolts, 1 kilovolt, and 500 volts

1. The Contractor shall coordinate with the Governments to determine the ion beam alignment configuration following award

iii. Changing of the accelerating voltage should be integrated into the software user interface and provide automatic control

c. Beam current

i. The focused ion beam current shall be adjustable between 1.5 picoamperes and

65 nanoamperes

ii. The Contractor shall coordinate the configuration of the probe current controlling apertures with the Government following award

d. Apertures

i. All apertures shall be motorized and integrated with the microscope software user interface

ii. Apertures shall recall their previous position when changed

e. Focused Ion Beam Imaging Capabilities

i. The FIB scan system shall allow collection of images between 64 x 64 pixels in size (or smaller) and 4096 x 4096 pixels in size (or larger)

ii. The minimum FIB dwell time shall be 50 nanoseconds or lower

iii. The FIB scanning system shall allow for the collection of images of square or rectangular shape of arbitrary pixel size

iv. The guaranteed FIB resolution shall be 3.0 nanometers at an accelerating voltage of 30 kilovolts accomplished with the “selective edge” measurement method.

D. Specimen Stage:

a. Stage Type

i. The specimen stage shall be accessible to an instrument user via a large door at the front of the instrument

ii. The specimen stage shall be fully computerized and integrated with the instrument control software

b. Stage Travel

i. The stage shall either be of the eucentric or compucentric type

ii. Stage translation shall be at least ±100 millimeters in the X- and Y-direction and at least 50 mm in the Z-direction

iii. The stage shall be capable of rotating 360 degrees (endless rotation)

iv. The stage shall tilt to -15 degrees and +90 degrees

v. The stage shall accommodate a maximum sample height of at least 85 millimeters

c. Stage Position Recall and Repeatability

i. The stage position should be indicated with a precision of at least 1.0 micrometer and 0.1 degree

ii. The minimum X/Y stage repeatability shall be 3.0 micrometers

iii. The software user interface should allow for storage and accurate recall of stage

E. Gas Injection System(s)

a. The instrument shall be outfitted with a gas injection system which allows for patterning, deposition, or etching (depending on the gas chemistry) with the electron or ion beam systems

b. The gas injection system shall be outfitted with precursors to deposit the following materials with the electron or ion beam:

i. Platinum

ii. Carbon

c. The gas injection system shall be composed of two single gas needles

d. All precursor chemistries shall be available at all stage tilt angles

e. All operations related to the gas injection system including (but not limited to) insertion/retraction, heating, purging, and starting/stopping/adjusting gas flow shall be integrated into the microscope software user interface

F. Micromanipulator

a. The instrument shall be outfitted with a computer-controlled micromanipulator

b. The micromanipulator stage shall enable the micromanipulator tip to move along four axes, including X, Y, Z, and rotation

c. All features of the micromanipulator, including (but not limited to) insertion, retraction, and motion shall be integrated into the microscope software user interface.

d. The micromanipulator interface shall not require a separate computer or monitor to operate

e. The tip of the micromanipulator shall be user replaceable

f. The micromanipulator shall be able to be used in the production of specimens for transmission electron microscopy and atom probe tomography

G. Patterning System

a. The instrument shall be outfitted with a patterning system which allows users to pattern various shapes with the electron or ion beam

b. The patterning system shall be fully integrated with the microscope software user interface

c. The patterning system should allow users to draw, define, and pattern the following shapes/components:

i. Lines

ii. Squares and/or rectangles of arbitrary shape

iii. Circles

iv. Annuli

1. Annular pattern must be true annular patterning, with the electron or ion beam moving in a circle

2. An annular pattern created by an orthogonally scanning beam is not acceptable

v. Polygons with an arbitrary shape and number of sides

vi. Cross sections

1. A progressing series of line scans that increases in milling or patterning depth with progression

vii. Arrays of polygons

d. The patterning system shall allow the user to upload bitmap (or other similar format) images for patterning using the focused ion beam or scanning electron microscope systems

i. The patterning system shall include software that allows users to define milling depth, dwell time, and all other ion beam parameters during patterning of the uploaded image(s)

e. The patterning system shall be integrated with the gas injection system so that the electron or ion beam systems can be used to pattern and/or deposit the materials defined in section E. b. based on precursor gasses emitted by the gas injection system

f. In the case that multiple patterning shapes/components are present, the user should be able to adjust the function, parameters, and sequence of each shape/component

i. The patterning system shall allow for patterning shapes/components to be executed in serial, parallel, or any combination of the two (e.g. serial execution of groups of patterns that are to be executed in parallel)

g. The patterning system shall allow users save and load combination patterns consisting of multiple polygons or components.

H. Cameras and Detectors

a. Beam current measurement

i. A software-integrated detector (e.g. Faraday cup) for measuring the beam current of the scanning electron microscope system

b. Camera(s) for viewing the chamber

i. An infrared camera to view inside the specimen vacuum chamber during normal operations

ii. A visible light camera inside the specimen vacuum chamber to allow for easy navigation of the specimen stage

c. Electron and Ion Detectors

i. An Everhart-Thornley detector in the vacuum chamber for detecting secondary electrons

ii. An in-lens or through-lens detector designed to collect secondary electrons

iii. An in-lens or through-lens detector designed to collect backscattered electrons

iv. A retractable, sold-state, segmented backscatter electron detector

1. The backscatter detector should be optimized to work at both low and high accelerating voltages

2. The detector shall have at least six selectable segments, allowing variable detection of electrons depending on emission angle

v. A retractable segmented detector to allow for imaging in scanning transmission electron microscopy (STEM) mode, including bright field, darkfield, and high angle annular dark field imaging modes

1. The STEM detector must be fully retractable such that it does not interfere with any…