Project Grant 2622185
- The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded the University of California, Los Angeles $100,000 on September 1, 2026, under the Engineering program (CFDA 47.041) to develop in situ thermal-mechanical metrology for advanced three-dimensional semiconductor packaging. The project will create high-resolution optical diagnostics capabilities to directly measure localized temperature and stress inside densely stacked 3D semiconductor devices,...
- The National Science Foundation Division of Chemical, Bioengineering, Environmental, and Transport Systems awarded Cornell University $430,066 on August 1, 2026, under the Engineering program (CFDA 47.041) to investigate thermal transport in MXenes, a family of two-dimensional materials with applications in energy storage, sensors, and electronics. The research will examine heat flow through MXene flakes, thin films, and layered structures using integrated experimental and computational methods....
- The National Science Foundation Division of Chemical, Bioengineering, Environmental, and Transport Systems awarded Cornell University $500,000 on July 1, 2026, under the Engineering program (CFDA 47.041) to probe heat transfer mechanisms at liquid-vapor interfaces using advanced optical metrology and multiscale modeling. The project combines high-fidelity multiscale simulation with high-resolution in-situ optical characterization, including interferometric scattering microscopy and confocal...
- This Engineering Research Initiation (ERI) award, funded by the National Science Foundation (NSF) Division of Civil, Mechanical, and Manufacturing Innovation under CFDA 47.041, provides $198,456 to Lamar University to develop advanced reliability modeling techniques for semiconductor packages subjected to dynamic excitation. The project, which commenced June 15, 2025 and concludes May 31, 2027, delivers fundamental research and analytical frameworks designed to predict service life and assess...
- This $348,061 project grant awarded by the National Science Foundation (NSF), under the Engineering program (CFDA 47.041), will fund research to understand the fundamental mechanics of thermomechanical fatigue in next-generation semiconductor devices. The research will focus on developing an energy dissipation criterion to evaluate thermomechanical fatigue damage in semiconductor/metal interfaces, which are prone to failure due to thermal expansion coefficient mismatches. The goal is to...
- The National Science Foundation Division of Chemical, Bioengineering, Environmental, and Transport Systems awarded Cornell University $104,859 on December 1, 2025, under the Engineering program (CFDA 47.041) to investigate fundamental mechanisms of heat transport in ladder polymers through molecular dynamics simulations and vibrational mode analysis. The research addresses unexpected thermal conductivity behavior in ladder polymers—polymer structures with unique double-stranded backbone...
- The National Science Foundation awarded Cornell University a $636,910 Project Grant under the Engineering program (CFDA 47.041) for research titled "CAREER: IN OPERANDO INVESTIGATION OF LASER POWDER-FED DIRECTED ENERGY DEPOSITION: PROCESS PHYSICS, MICROSTRUCTURE EVOLUTION, AND MECHANICAL PROPERTIES." The five-year project beginning February 1, 2021 will investigate laser powder-fed directed energy deposition, a metal additive manufacturing technique. Specifically, Cornell University...
- The National Science Foundation Division of Chemical, Bioengineering, Environmental, and Transport Systems awarded Cornell University $50,000 on October 1, 2026, under the Engineering program (CFDA 47.041) to investigate coupling between interfacial electrostatics and surface structures at transition-metal oxide and liquid interfaces. The research combines atomic-level material manufacturing, in-liquid imaging techniques, and computational modeling to observe how water and ions such as protons...
- The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded Trustees of Dartmouth College $429,534 on August 1, 2026, under the Engineering program (CFDA 47.041) to develop sustainable, wafer-scale manufacturing of ultra-thin semiconductor materials using molten interfaces. The project establishes scientific foundations for a scalable manufacturing process that produces ultra-thin semiconductor layers with thicknesses in the one to few nanometer range...
- The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded Arizona State University $530,924 on August 1, 2026, to investigate the mechanics and electromechanical coupling of asymmetric, atomically thin two-dimensional materials under the Engineering program (CFDA 47.041). The project establishes a mechanics-based framework for Janus layers—materials with distinct chemical compositions on their top and bottom surfaces—and their stacked and curved...
The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded Cornell University $150,000 on September 1, 2026, under the Engineering program (CFDA 47.041) to develop in situ thermal-mechanical metrology for advanced three-dimensional semiconductor packaging. The project will create high-resolution internal characterization techniques to measure localized temperature and stress within 3D packaging architectures, addressing a critical challenge in semiconductor device reliability. Advanced 3D packaging generates significant thermal-mechanical stress across multiple hierarchical levels that degrades transistor performance and accelerates device failure. Current approaches cannot access critical regions buried beneath densely stacked components and interconnected microstructures. The research integrates optical diagnostics and nanophotonics with semiconductor packaging engineering, employing micro-Raman spectroscopy as a temperature- and stress-sensitive optical probe and photonic waveguides co-designed with 3D packaging test vehicles to deliver the Raman probe to internal critical regions. The project will identify hotspot formation sites and thermal stress concentration points and provide design guidelines for next-generation 3D packaging with improved performance and reliability. Educational activities including curriculum development and student research opportunities complement the research. Work is performed at Ithaca, New York. The period of performance runs from September 1, 2026, through August 31, 2028. This is an EAGER (Early-Concept Grant for Exploratory Research) award, indicating exploratory and high-risk research at early stages of concept development.
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| Not listed | $150.0k | 7/29/26 |