The National Science Foundation (NSF) awarded a $280,000 Project Grant under the Engineering (CFDA 47.041) program to The Research Foundation For The State University Of New York (RF SUNY). The grant, titled "ENG-SEMICON: MANUFACTURING USA: PLASTICITY-INDUCED CU-CU BONDING FOR SCALABLE 3D CHIP INTEGRATION IN ADVANCED SEMICONDUCTOR PACKAGING", aims to develop optimal copper-to-copper (Cu-Cu) bonding microstructures for enabling scalable and reliable hybrid bonding in 3D chip integration. The research will focus on understanding the fundamental bonding mechanisms, including interdiffusion and plastic deformation, and correlating microstructural factors with hybrid bonding performance. The project, which runs from July 1, 2025, to June 30, 2028, will leverage in-situ X-ray microdiffraction at Argonne National Lab to track Cu microstructure evolution and evaluate interconnect reliability under current stressing. The findings are expected to guide the development of low-temperature, high-reliability hybrid bonding for advancing semiconductor packaging and manufacturing efficiency.
Mod # | Description | Reason For Modification | Federal Obligation (Click to sort descending) | Date (Click to sort ascending) |
|---|---|---|---|---|
| Not listed | $280.0k | 7/7/25 |