Cooperative Agreement NNM16AA09A

This $150,000 Project Grant award from the National Science Foundation's (NSF) Division of Materials Research (DMR) aims to develop a new, eco-friendly process for creating metal-based photoresists used in extreme ultraviolet (EUV) lithography for semiconductor manufacturing. The research, which involves academic partners including Johns Hopkins University, Morgan State University, and Stony Brook University, as well as international collaboration, seeks to establish a fully solvent-free (dry)...

This Project Grant award from the National Science Foundation (NSF) Directorate for Engineering (CFDA 47.041) totaling $344,918 will establish a collaborative research program at Florida International University (FIU) to develop advanced data-driven approaches for additive manufacturing (AM) or 3D printing of materials with locally tunable electrical and mechanical properties. The research aims to create new polymer resin formulations for digital light processing (DLP) 3D printing that can...

This $524,480 Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) supports research at New York University (NYU) on developing novel semiconductor crystal materials and manufacturing processes for advanced optoelectronic applications. The key focus is on understanding how to fabricate "twisted" organic semiconductor crystals that can spontaneously form into aligned networks, enabling them to outperform single crystal materials in properties like...

This Project Grant award from the National Science Foundation (NSF) Integrative Activities program (CFDA 47.083) provides $257,665 to Montana State University (MSU) to develop an innovative 3D printing technology for microscale electronics. The project aims to establish an "Intense Pulsed Light Assisted Electrohydrodynamic 3D Printing" (IE 3D Printing) process that utilizes photonic sintering to fabricate 3D integrated microelectronics. Key research objectives include studying the...

This $300,000 Project Grant award from the National Science Foundation's (NSF) Integrative Activities (CFDA 47.083) program supports fundamental research at Iowa State University to develop new material-process-structure-property relationships for additively manufactured electronics that can function in extreme environments. The key objectives are to: 1) understand printing process fundamentals for air-sensitive metals and alloys, 2) investigate material sintering techniques, and 3) characterize...

This National Science Foundation (NSF) Division of Civil, Mechanical, and Manufacturing Innovation (CMMI) project grant, titled "LEAP-HI: ALL-CARBON RECYCLABLE ELECTRONICS (ACRE): REALIZING A SUSTAINABLE ELECTRONICS LIFECYCLE", will investigate the printing of all-carbon recyclable electronic (ACRE) materials to replace silicon- or metal oxide-based semiconductors in display manufacturing. The $500,000 award to Duke University, with a sub-award to Columbia University, aims to develop...

This $185,304 Project Grant award from the National Science Foundation (NSF) Engineering Directorate (CFDA 47.041) supports research by St. Mary's College of Maryland to develop low-cost, printable metal contacts to enable the fabrication of fully printed, all-inorganic cadmium telluride (CdTe) photovoltaic (PV) devices. The project aims to identify printable anode and cathode metals to achieve high-efficiency printed solar cells at a fraction of the cost of conventional PV. Key activities...

This $3,000,000 Project Grant awarded by the National Science Foundation (NSF) Engineering Program (CFDA 47.041) supports research to develop a novel lamination approach for halide perovskite semiconductors that enables new device architectures and material combinations for applications like solar cells, LEDs, and other optoelectronic devices. The research aims to understand, model, and control the process-structure-property relationships during halide perovskite semiconductor manufacturing...

The National Science Foundation (NSF) Division of Materials Research awarded a $271,852 Project Grant to the University of Arkansas (UA), Fayetteville through the Mathematical and Physical Sciences program (CFDA 47.049). The goal of this 3-year project is to study and develop a new semiconductor material system based on silicon, germanium, and tin (SiGeSn) alloys. The research will focus on growing SiGeSn in layered stacks with germanium to create quantum wells with engineered electronic...

This Project Grant award of $398,065.00 from the National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems supports research at New York University (NYU) to develop a novel doping process for organic semiconductor materials used in devices like perovskite solar cells. The project aims to enhance the conductivity, uniformity, and stability of these materials by investigating the mechanisms of molecular and photo-assisted doping, including the effects of cationic...