Cooperative Agreement 70NANB2H3005

This National Science Foundation (NSF) EAGER (Early-concept Grants for Exploratory Research) project grant, awarded under CFDA 47.041 - Engineering, provides $300,000 in funding from November 1, 2024 to October 31, 2026 to the University of Illinois to develop lock-in infrared thermography capabilities for measuring thermal resistances in 3D integrated circuits. The key objectives of this project are to advance the science and engineering of thermal property measurement and develop a metrology...

This $300,000 Project Grant awarded by the National Science Foundation (NSF) under the Computer and Information Science and Engineering (CISE) program supports the development of a new testing methodology to enhance the detection of internal defects in state-of-the-art integrated circuits. The research project aims to generate compact and efficient tests that can comprehensively cover a wide range of resistive defects within individual circuit cells, as well as capture the timing impact of a...

This Project Grant award of $631,792 from the National Science Foundation's (NSF) Mathematical and Physical Sciences program aims to develop material processes and devices that maximize the ferroelectric performance and endurance of trench capacitors for energy-efficient data storage. The key technical objectives are to: 1) Demonstrate non-planar, hafnia-based devices exhibiting greater than 10^15 switching endurance under back-end-of-line semiconductor processing conditions, and 2) Develop a...

This $379,054 project grant awarded by the National Science Foundation's Engineering program (CFDA 47.041) to Texas A&M Engineering Experiment Station (Tees) will establish new via metrology and inspection technology for advanced wafer-level packaging in the semiconductor industry. The research aims to develop rapid modeling methodologies and experimental/computational calibration methods to characterize via geometry, optical properties, and defectivity. Key innovations include a via-edge...

This Project Grant award, totaling $398,498.00, was provided by the National Science Foundation's (NSF) Engineering program (CFDA 47.041) to the Georgia Tech Research Corp (GTRC) for the development of a fast, accurate, compact, trustable, low cost and power (FACTCOP) sub-THz/THz dielectric sensor. The key objective of this research project is to develop a ubiquitous dielectric sensing technology that can accurately and rapidly measure the dielectric properties of materials and biological cells....

This $275,000 project grant from the National Science Foundation's Engineering Directorate (CFDA 47.041) will fund the development of novel electronic-photonic silicon carbide neural probes for recording and stimulating neural activity. The Georgia Tech Research Corporation will receive funding on behalf of collaborating researchers to design penetrating neural probes made entirely of silicon carbide, a robust material proven to withstand the corrosive brain environment long-term. The probes...

The National Science Foundation (NSF) awarded a $305,000 Small Business Innovation Research (SBIR) Phase I project grant to Quantum Metrology LLC, located in Portland, Oregon. The project, titled "Quantum Metrology for Subsurface Defect Detection in Semiconductor Manufacturing," aims to develop a novel, non-destructive, in-line inspection technology to improve the quality and efficiency of semiconductor manufacturing. The project focuses on building and testing a new inspection tool...

This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Cooperative Agreement award of $1,000,000 to Diffract Technology Inc. is focused on developing a novel, high-resolution 3D optical metrology tool for precision manufacturing and industrial applications. The project aims to create a computer-generated holographic system capable of performing rapid, non-contact 3D measurements with sub-10-micron resolution over a large field of view. The advanced 3D...

This Project Grant award of $499,715 from the National Science Foundation's (NSF) Computer and Information Science and Engineering (CISE) program will support the development of a digital twin (DT) for an intelligent electromagnetic (EM) sensor on a chip (IEM-SOC). The project aims to create a scalable DT architecture that can validate new designs and advance research and development in emerging memory technologies for edge sensor applications. Key objectives include producing a DT for real-time...

The National Institute of Standards and Technology (NIST) awarded a $289,830.98 Cooperative Agreement under the CHIPS Research and Development (CFDA 11.042) program to Laser Thermal Analysis, Inc. The purpose of this award is for the company to build a hybrid atomic force microscopy-thermoreflectance (AFM-TR) instrument capable of generating high-resolution thermal resistance, thermal boundary interface resistance, and temperature profile maps of microprocessors and wide bandgap semiconductor...