This $414,655 National Science Foundation (NSF) Engineering Program (CFDA 47.041) project grant, awarded on September 15, 2024, aims to address emerging challenges in the field of heterogeneous integration (HI) in semiconductor packaging. The project will develop rapid 3D metrology techniques and incorporate machine learning to accelerate the detection of fabrication defects in semiconductor packages, thereby improving the reliability and performance of electronic packaging. The technical...
This $275,000 National Science Foundation (NSF) Project Grant, awarded under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program, funds the development and validation of materials and processes for advanced semiconductor manufacturing at Geminatio, a for-profit organization. The goal is to enable the progression of Moore's Law and strengthen domestic semiconductor manufacturing capacity and capability, which has been impacted by recent supply chain issues. The project seeks to...
This three-year, $399,750 Project Grant from the National Science Foundation's Division of Information and Intelligent Systems, under the Computer and Information Science and Engineering program (CFDA 47.070), will support the development of programmable visual capabilities for 3D printed objects through light-transfer techniques. The grant recipient, Texas A&M Engineering Experiment Station (doing business as Tees), will conduct material experiments to characterize light-transfer properties...
The National Science Foundation Division of Engineering Education and Centers awarded a $405,000 Project Grant to Texas A&M Engineering Experiment Station (doing business as Tees) to support an interdisciplinary research experiences program titled "REU SITE: INTERDISCIPLINARY RESEARCH EXPERIENCES IN METROLOGY & INSPECTION." The award period is from January 1, 2022 through December 31, 2024. The grant supports the NSF Directorate for Engineering's goal of improving the quality...
This $750,000 project grant from the National Science Foundation's Technology, Innovation, and Partnerships program will fund the Massachusetts Institute of Technology to develop key products and services supporting the microelectronics manufacturing industry through November 2023. MIT will establish the Microelectronics Manufacturing Sustainability Program to deliver consensus policy recommendations, technology roadmaps, and workforce training. The program aims to sustain performance scaling as...
Apogee Semiconductor, Inc. received a $255,991 National Science Foundation Project Grant under the Engineering (47.041) program. The grant funded research to develop a low-cost packaging solution for space-grade and high-reliability integrated circuits. The NSF Directorate for Engineering seeks to improve quality of life and economic strength by fostering innovation and excellence in engineering research. This award supports that mission by advancing packaging technologies for space applications...
This $348,061 federal Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) will fund research into the fundamental mechanics of thermomechanical fatigue in next-generation semiconductor materials and devices. The goal is to develop an energy dissipation criterion to evaluate and improve the durability and reliability of semiconductor/metal interfaces, which are prone to failure due to thermal expansion mismatch. The research will utilize integrated...
This National Science Foundation (NSF) Technology, Innovation, and Partnerships (CFDA 47.084) Project Grant award of $275,000 to United Semiconductors, LLC supports the development of two critical hardware components for in-space manufacturing of advanced semiconductor materials: A Universal Crystal Growth Capsule designed to leverage microgravity conditions during crystal growth, enabling high-throughput production of high-purity semiconductor crystals. A novel Wafer Dicing Tool to achieve...
This $107,965 Project Grant award from the National Science Foundation's STEM Education program (CFDA 47.076) will support the development and deployment of a foundational semiconductor research and education cyberinfrastructure (CI) tool at San Jose State University Research Foundation. The CI will integrate machine learning device models and semiconductor device data to empower semiconductor device research and education, lowering the entry barrier and facilitating broader participation in...
This federal Project Grant award, funded by the National Science Foundation (NSF) STEM Education program (CFDA 47.076), will develop and pilot an industry-wide semiconductor workforce certification program. The $1,484,704 award, made on September 15, 2024, will be administered by The Research Foundation for the State University of New York (RF-SUNY). The project aims to address the shortage of qualified technical workers in the semiconductor industry by creating a unified advanced...
This $379,054 project grant awarded by the National Science Foundation's Engineering program (CFDA 47.041) to Texas A&M Engineering Experiment Station (Tees) will establish new via metrology and inspection technology for advanced wafer-level packaging in the semiconductor industry. The research aims to develop rapid modeling methodologies and experimental/computational calibration methods to characterize via geometry, optical properties, and defectivity. Key innovations include a via-edge topography model, light-via interaction analysis, and through-focus scanning microscopy to enable 3D via characterization. The outcomes are expected to provide a via critical dimension defectivity database to improve semiconductor manufacturing process control and yield for high-volume, high-throughput production of integrated circuits, microelectronics devices, and systems. The project will run from Sep 2024 to Aug 2027.