Semi-automatic thermosonic wire bond system

Ended Purchase Order Awarded Last action

Contract number
N0017324P5284
Awardee
Awarding agency
Obligated
$59,595

Award facts

Opportunity
Contract value 100% obligated
$59,595.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
NAICS code
334413 Semiconductor and Related Device Manufacturing
PSC
6640 Laboratory Equipment And Supplies
Set-aside
Total Small Business
Competition
Competed under SAP · 3 offers Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Germany

Award details come from SAM.gov/FPDS.

About this award

The Office of Naval Research awarded a purchase order to Cook and Weil, Inc., a small business, for a semi-automatic thermosonic wire bond system valued at $59,595 on September 27, 2024, under a total small business set-aside. Place of performance is Germany. The procurement includes a semi-automatic thermosonic wire bonder capable of ball, wedge, bump, and ribbon bonding, along with a microscope, heater stage, and accessories. The order is priced firm fixed and was evaluated on a lowest price technically acceptable basis. Ultimate completion date is November 22, 2024.

Quick answers

Who was awarded contract N0017324P5284?

N0017324P5284 was awarded to Cook And Weil, Inc. by Office of Naval Research (Secretary of the Navy) on September 27, 2024.

How much is contract N0017324P5284 worth?

The government has obligated $59,595 on N0017324P5284.

Was contract N0017324P5284 competed?

The extent of competition for N0017324P5284 was competed under sap. The government received 3 offers. It was set aside: Total Small Business.

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