Packing, preformed

Ended Awarded

Contract number
SPE7L125F5254
Awardee
Awarding agency
Obligated
$11,437

Award facts

Contract value 100% obligated
$11,437.16 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
NAICS code
339991 Gasket, Packing, and Sealing Device Manufacturing
PSC
5330 Packing And Gasket Materials
Set-aside
No set-aside
Competition
Competed under SAP Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Oakland, NJ 07436, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

About this award

This is a firm fixed-price delivery order contract awarded by the Defense Logistics Agency (DLA) to The Dewey Electronics Corporation, a small business manufacturer based in Oakland, New Jersey. The contract, valued at $11,437.16, is for the provision of preformed packing materials. The award does not have a set-aside designation. Dewey Electronics Corporation has a history of providing specialized electronic and mechanical equipment to various U.S. Department of Defense agencies, including DLA, the Naval Supply Systems Command, and the Army Communications Electronics Command. The company holds multiple Indefinite Delivery Contracts (IDCs) with these agencies, covering a wide range of product categories essential for military logistics and sustainment operations. This latest award further demonstrates Dewey Electronics' capabilities as a critical supplier of specialized components to the U.S. defense sector.

Quick answers

Who was awarded contract SPE7L125F5254?

SPE7L125F5254 was awarded to The Dewey Electronics Corporation by Land and Maritime (Defense Logistics Agency) on April 10, 2025.

How much is contract SPE7L125F5254 worth?

The government has obligated $11,437 on SPE7L125F5254.

Is contract SPE7L125F5254 an order under another contract?

Yes. SPE7L125F5254 is a delivery order under SPE7LX25D60QN, an indefinite delivery contract.

Was contract SPE7L125F5254 competed?

The extent of competition for SPE7L125F5254 was competed under sap.

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