The heterogenous adaptively produced photonic interfaces (happi) program aims to create a 1000X increase in the information transmission density within a microsystem by exploiting photonic signaling.

Active Definitive Contract Awarded Last action

Contract number
HR001125C0043
Awardee
Awarding agency
Obligated
$3,964,966

Award facts

Opportunity
Contract value 53% obligated
  • $3,964,966.00 Current, with exercised options
  • $7,489,990.00 Potential, with all options
Completion date 92% complete
Current and potential, with all options
Contracting staff
Set-aside
No set-aside
Competition
Full and Open Competition · 18 offers Basic Research
Pricing
Cost Plus Fixed Fee
Place of performance
Menlo Park, CA 94025, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Other Administrative Action P00005 $0
Funding Only Action P00004 $1,260,402
Funding Only Action P00003 · Heterogenous adaptively produced photonic interfaces near sculpted silicon (happiness) $764,585
Funding Only Action P00002 $365,661
Funding Only Action P00001 $882,504
Original award $691,814

About this award

The Defense Advanced Research Projects Agency awarded a $7.49 million definitive contract to Sri International for the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program on March 13, 2025, under cost-plus-fixed-fee pricing with no set-aside.

The HAPPI program seeks to achieve a 1000x increase in information transmission density within microsystems by exploiting photonic signaling. The work focuses on developing and executing processes for alignment and bonding of photonic integrated circuit chips to integrate four discrete photonic integrated circuit chips with optical interconnects between them. Technical requirements include optical loss per link less than 1 dB, link arrays up to 1,000 x 1,000 channels, operation within a 400–1800 nm wavelength range, and a minimum of four waveguide layers per chip. Place of performance is Menlo Park, CA.

The contract runs through December 13, 2026. Nhanced Semiconductors, Inc. serves as subcontractor, providing specialized semiconductor packaging and assembly expertise. The originating solicitation, posted September 10, 2024, with proposals due November 6, 2024, anticipated multiple awards from a $30 million total HAPPI program investment and was open to both U.S. and non-U.S. sources. The program was structured in two 18-month phases: initial feasibility demonstration followed by array density and manufacturability validation.

Subawards

Subcontractor Amount Awarded
Nhanced Semiconductors, Inc. THE HETEROGENOUS ADAPTIVELY PRODUCED PHOTONIC INTERFACES (HAPPI) PROGRAM AIMS TO CREATE A 1000X INCREASE IN THE INFORMATION TRANSMISSION DENSITY WITHIN A… $1,137,250

Quick answers

Who was awarded contract HR001125C0043?

HR001125C0043 was awarded to Sri International by Defense Advanced Research Projects Agency (Department of Defense) on March 13, 2025.

How much is contract HR001125C0043 worth?

The government has obligated $3,964,966 on HR001125C0043. Its potential value, with all options, is $7,489,990.

Was contract HR001125C0043 competed?

The extent of competition for HR001125C0043 was full and open competition. The government received 18 offers.

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